SG103287A1 - Self-aligned double gate mosfet with separate gates - Google Patents
Self-aligned double gate mosfet with separate gatesInfo
- Publication number
- SG103287A1 SG103287A1 SG200102828A SG200102828A SG103287A1 SG 103287 A1 SG103287 A1 SG 103287A1 SG 200102828 A SG200102828 A SG 200102828A SG 200102828 A SG200102828 A SG 200102828A SG 103287 A1 SG103287 A1 SG 103287A1
- Authority
- SG
- Singapore
- Prior art keywords
- self
- double gate
- gate mosfet
- aligned double
- separate gates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20413100P | 2000-05-15 | 2000-05-15 | |
US09/612,260 US6982460B1 (en) | 2000-07-07 | 2000-07-07 | Self-aligned gate MOSFET with separate gates |
Publications (1)
Publication Number | Publication Date |
---|---|
SG103287A1 true SG103287A1 (en) | 2004-04-29 |
Family
ID=26899213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200102828A SG103287A1 (en) | 2000-05-15 | 2001-05-12 | Self-aligned double gate mosfet with separate gates |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP3872316B2 (en) |
KR (1) | KR100503722B1 (en) |
CN (2) | CN1219329C (en) |
DE (1) | DE10119411B4 (en) |
IE (1) | IE20010380A1 (en) |
IL (1) | IL143013A (en) |
SG (1) | SG103287A1 (en) |
TW (1) | TW490745B (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100497672B1 (en) * | 2002-05-10 | 2005-07-01 | 재단법인서울대학교산학협력재단 | Dram using aligned soi double gate transistor and process thereof |
DE10241945A1 (en) * | 2002-09-10 | 2004-03-18 | Infineon Technologies Ag | Production of a planar transistor used as a MOSFET comprises forming a semiconductor-on-isolator substrate, forming a gate insulating layer and a gate region on the substrate, forming a second insulating layer, and further processing |
DE10245153A1 (en) * | 2002-09-27 | 2004-04-15 | Infineon Technologies Ag | Integrated field effect transistor with two control areas, use of this field effect transistor and manufacturing process |
JP4546021B2 (en) | 2002-10-02 | 2010-09-15 | ルネサスエレクトロニクス株式会社 | Insulated gate field effect transistor and semiconductor device |
WO2004088757A1 (en) * | 2003-03-28 | 2004-10-14 | Fujitsu Limited | Semiconductor device and method for fabricating the same |
FR2853454B1 (en) * | 2003-04-03 | 2005-07-15 | St Microelectronics Sa | TRANSISTOR MOS HIGH DENSITY |
CN1322590C (en) * | 2003-06-24 | 2007-06-20 | 北京大学 | A double-grid MOS transistor and method for making same |
JP2005174964A (en) * | 2003-12-05 | 2005-06-30 | National Institute Of Advanced Industrial & Technology | Double-gate field-effect transistor |
US20070029623A1 (en) * | 2003-12-05 | 2007-02-08 | National Inst Of Adv Industrial Science And Tech | Dual-gate field effect transistor |
JP2005167163A (en) * | 2003-12-05 | 2005-06-23 | National Institute Of Advanced Industrial & Technology | Double gate field-effect transistor |
JP2005174960A (en) * | 2003-12-05 | 2005-06-30 | National Institute Of Advanced Industrial & Technology | Double-gate field-effect transistor |
CN100444405C (en) * | 2004-07-02 | 2008-12-17 | 中华映管股份有限公司 | Double grid film electric crystal and pixel structure and its producing method |
KR100679693B1 (en) * | 2004-10-29 | 2007-02-09 | 한국과학기술원 | Non-Volatile Memory Structure for two Bits Cell Operation with Asymmetrical Work Function Double Gate and its Manufacturing |
US7202117B2 (en) * | 2005-01-31 | 2007-04-10 | Freescale Semiconductor, Inc. | Method of making a planar double-gated transistor |
US7288805B2 (en) | 2005-02-24 | 2007-10-30 | International Business Machines Corporation | Double gate isolation |
KR100745902B1 (en) * | 2005-10-24 | 2007-08-02 | 주식회사 하이닉스반도체 | Nonvolatile ferro-electric memory device |
CN101901837A (en) * | 2010-06-24 | 2010-12-01 | 复旦大学 | Grid-controlled PN field effect transistor and control method thereof |
CN103022124B (en) * | 2011-09-22 | 2015-08-19 | 中芯国际集成电路制造(北京)有限公司 | Double-gated transistor and manufacture method thereof |
US8685823B2 (en) * | 2011-11-09 | 2014-04-01 | International Business Machines Corporation | Nanowire field effect transistor device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0043944B1 (en) * | 1980-07-08 | 1986-10-08 | International Business Machines Corporation | Method for making a self-aligned field effect transistor integrated circuit structure |
US5296727A (en) * | 1990-08-24 | 1994-03-22 | Fujitsu Limited | Double gate FET and process for manufacturing same |
US5646058A (en) * | 1994-07-15 | 1997-07-08 | International Business Machines Corporation | Method for fabricating a self-aligned double-gate MOSFET by selective lateral epitaxy |
US5818070A (en) * | 1994-07-07 | 1998-10-06 | Semiconductor Energy Laboratory Company, Ltd. | Electro-optical device incorporating a peripheral dual gate electrode TFT driver circuit |
US6037204A (en) * | 1998-08-07 | 2000-03-14 | Taiwan Semiconductor Manufacturing Company | Silicon and arsenic double implanted pre-amorphization process for salicide technology |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63308386A (en) * | 1987-01-30 | 1988-12-15 | Sony Corp | Semiconductor device and manufacture thereof |
US5166084A (en) * | 1991-09-03 | 1992-11-24 | Motorola, Inc. | Process for fabricating a silicon on insulator field effect transistor |
US5273921A (en) * | 1991-12-27 | 1993-12-28 | Purdue Research Foundation | Methods for fabricating a dual-gated semiconductor-on-insulator field effect transistor |
KR960002103B1 (en) * | 1993-02-26 | 1996-02-10 | 현대전자산업주식회사 | Double gate tft and the making method thereof |
US5773331A (en) * | 1996-12-17 | 1998-06-30 | International Business Machines Corporation | Method for making single and double gate field effect transistors with sidewall source-drain contacts |
JP3699823B2 (en) * | 1998-05-19 | 2005-09-28 | 株式会社東芝 | Semiconductor device |
US6331476B1 (en) * | 1998-05-26 | 2001-12-18 | Mausushita Electric Industrial Co., Ltd. | Thin film transistor and producing method thereof |
US6365465B1 (en) * | 1999-03-19 | 2002-04-02 | International Business Machines Corporation | Self-aligned double-gate MOSFET by selective epitaxy and silicon wafer bonding techniques |
KR100372820B1 (en) * | 1999-06-29 | 2003-02-20 | 주식회사 하이닉스반도체 | Double silicon mosfet and method of manufacturing the same |
-
2001
- 2001-03-30 TW TW090107605A patent/TW490745B/en not_active IP Right Cessation
- 2001-04-18 IE IE20010380A patent/IE20010380A1/en not_active IP Right Cessation
- 2001-04-20 DE DE10119411.0A patent/DE10119411B4/en not_active Expired - Fee Related
- 2001-04-23 KR KR10-2001-0021685A patent/KR100503722B1/en not_active IP Right Cessation
- 2001-05-07 IL IL143013A patent/IL143013A/en not_active IP Right Cessation
- 2001-05-12 SG SG200102828A patent/SG103287A1/en unknown
- 2001-05-14 CN CNB01117935XA patent/CN1219329C/en not_active Expired - Fee Related
- 2001-05-14 JP JP2001143342A patent/JP3872316B2/en not_active Expired - Fee Related
- 2001-05-14 CN CNB2005100651111A patent/CN100356526C/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0043944B1 (en) * | 1980-07-08 | 1986-10-08 | International Business Machines Corporation | Method for making a self-aligned field effect transistor integrated circuit structure |
US5296727A (en) * | 1990-08-24 | 1994-03-22 | Fujitsu Limited | Double gate FET and process for manufacturing same |
US5818070A (en) * | 1994-07-07 | 1998-10-06 | Semiconductor Energy Laboratory Company, Ltd. | Electro-optical device incorporating a peripheral dual gate electrode TFT driver circuit |
US5646058A (en) * | 1994-07-15 | 1997-07-08 | International Business Machines Corporation | Method for fabricating a self-aligned double-gate MOSFET by selective lateral epitaxy |
US6037204A (en) * | 1998-08-07 | 2000-03-14 | Taiwan Semiconductor Manufacturing Company | Silicon and arsenic double implanted pre-amorphization process for salicide technology |
Also Published As
Publication number | Publication date |
---|---|
IE20010380A1 (en) | 2002-02-20 |
CN1670929A (en) | 2005-09-21 |
DE10119411B4 (en) | 2015-06-11 |
TW490745B (en) | 2002-06-11 |
CN1324113A (en) | 2001-11-28 |
IL143013A (en) | 2007-06-03 |
KR100503722B1 (en) | 2005-07-26 |
JP2002016255A (en) | 2002-01-18 |
DE10119411A1 (en) | 2001-11-29 |
CN100356526C (en) | 2007-12-19 |
CN1219329C (en) | 2005-09-14 |
KR20010105160A (en) | 2001-11-28 |
IL143013A0 (en) | 2002-04-21 |
JP3872316B2 (en) | 2007-01-24 |
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