SG102055A1 - Cleaning method and apparatus - Google Patents

Cleaning method and apparatus

Info

Publication number
SG102055A1
SG102055A1 SG200203708A SG200203708A SG102055A1 SG 102055 A1 SG102055 A1 SG 102055A1 SG 200203708 A SG200203708 A SG 200203708A SG 200203708 A SG200203708 A SG 200203708A SG 102055 A1 SG102055 A1 SG 102055A1
Authority
SG
Singapore
Prior art keywords
cleaning method
cleaning
Prior art date
Application number
SG200203708A
Other languages
English (en)
Inventor
Yoshida Takashi
Iwasaki Motoaki
Yano Tatsuro
Habaya Kurao
Shiroma Takahiro
Original Assignee
Yokogawa Electric Corp
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp, Fuji Electric Co Ltd filed Critical Yokogawa Electric Corp
Publication of SG102055A1 publication Critical patent/SG102055A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0092—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
    • G11B23/50—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges
    • G11B23/505—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges of disk carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning In General (AREA)
  • Liquid Crystal (AREA)
  • Elimination Of Static Electricity (AREA)
SG200203708A 2001-06-25 2002-06-19 Cleaning method and apparatus SG102055A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001191202A JP4210045B2 (ja) 2001-06-25 2001-06-25 洗浄装置

Publications (1)

Publication Number Publication Date
SG102055A1 true SG102055A1 (en) 2004-02-27

Family

ID=19029864

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200203708A SG102055A1 (en) 2001-06-25 2002-06-19 Cleaning method and apparatus

Country Status (4)

Country Link
US (1) US6899110B2 (ko)
JP (1) JP4210045B2 (ko)
KR (1) KR20030001306A (ko)
SG (1) SG102055A1 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4074814B2 (ja) * 2002-01-30 2008-04-16 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4118194B2 (ja) * 2003-06-02 2008-07-16 横河電機株式会社 洗浄装置
CA2531672A1 (en) * 2003-07-10 2005-01-20 Ag Tech Aps Jet spray tool
CN100350559C (zh) * 2003-08-05 2007-11-21 大日本网目版制造株式会社 基板处理装置及基板处理方法
JP2005072559A (ja) * 2003-08-05 2005-03-17 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
GB2412351A (en) * 2004-03-24 2005-09-28 Esselte A tape printer having separate tape and ink ribbon cassettes
CA2467316A1 (en) * 2004-05-14 2005-11-14 British Columbia Hydro And Power Authority Dry ice blasting cleaning apparatus
US8211242B2 (en) * 2005-02-07 2012-07-03 Ebara Corporation Substrate processing method, substrate processing apparatus, and control program
US20060201541A1 (en) * 2005-03-11 2006-09-14 Semiconductor Energy Laboratory Co., Ltd. Cleaning-drying apparatus and cleaning-drying method
US20060237043A1 (en) * 2005-04-25 2006-10-26 Applied Materials, Inc. Method and apparatus for cleaning semiconductor substrates
JP4528677B2 (ja) * 2005-06-24 2010-08-18 株式会社東芝 パターンド媒体の製造方法及び製造装置
JP4533809B2 (ja) * 2005-06-28 2010-09-01 株式会社東芝 ディスクリートトラック媒体用基板の製造方法およびディスクリートトラック媒体の製造方法
US20090255555A1 (en) * 2008-04-14 2009-10-15 Blakely, Sokoloff, Taylor & Zafman Advanced cleaning process using integrated momentum transfer and controlled cavitation
JP6048043B2 (ja) * 2012-09-28 2016-12-21 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置及び真空処理システム
JP2015050402A (ja) * 2013-09-04 2015-03-16 株式会社ディスコ 洗浄手段を備えた切削装置
CN105750272B (zh) * 2016-04-20 2018-02-06 中国工程物理研究院激光聚变研究中心 一种自动化干法清洗装置
CN109107997A (zh) * 2018-09-30 2019-01-01 上海钥熠电子科技有限公司 Oled蒸镀用挡板的干冰清洗装置及其工艺
TW202031374A (zh) * 2018-11-30 2020-09-01 日商東京威力科創股份有限公司 基板清洗方法、處理容器清洗方法及基板處理裝置
CN111254858B (zh) * 2020-03-06 2021-09-21 西南交通大学 一种液态二氧化碳清洗机和清洗方法
CN112235927B (zh) * 2020-09-26 2021-05-25 江苏亚电科技有限公司 一种晶圆去静电和清洗装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4798218A (en) * 1985-05-28 1989-01-17 Outillages Scientifiques Et De Laboratoires O.S.L. Cleaning apparatus for electronic components and/or precision parts of machinery
US5598861A (en) * 1995-03-07 1997-02-04 Safety-Kleen Corp. Parts washer with solvent flow control
JP2000271547A (ja) * 1999-03-25 2000-10-03 Kyocera Mita Corp 洗浄装置

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US4806171A (en) 1987-04-22 1989-02-21 The Boc Group, Inc. Apparatus and method for removing minute particles from a substrate
KR940011563B1 (ko) * 1989-09-27 1994-12-21 유니온 카바이드 케미칼즈 앤드 플라스틱스 캄파니 인코포레이티드 비압축성 및 압축성 유체를 계량 및 혼합하기 위한 방법 및 장치
US5062898A (en) 1990-06-05 1991-11-05 Air Products And Chemicals, Inc. Surface cleaning using a cryogenic aerosol
US5306350A (en) * 1990-12-21 1994-04-26 Union Carbide Chemicals & Plastics Technology Corporation Methods for cleaning apparatus using compressed fluids
US5315793A (en) 1991-10-01 1994-05-31 Hughes Aircraft Company System for precision cleaning by jet spray
JPH05134397A (ja) * 1991-11-14 1993-05-28 Nikon Corp ガラス基板の洗浄方法、及び洗浄装置
US5339844A (en) * 1992-08-10 1994-08-23 Hughes Aircraft Company Low cost equipment for cleaning using liquefiable gases
US5372652A (en) 1993-06-14 1994-12-13 International Business Machines Corporation Aerosol cleaning method
US5390450A (en) * 1993-11-08 1995-02-21 Ford Motor Company Supersonic exhaust nozzle having reduced noise levels for CO2 cleaning system
JP3504023B2 (ja) * 1995-05-26 2004-03-08 株式会社ルネサステクノロジ 洗浄装置および洗浄方法
US6239038B1 (en) * 1995-10-13 2001-05-29 Ziying Wen Method for chemical processing semiconductor wafers
DE19540373A1 (de) 1995-10-30 1997-05-07 Henkel Kgaa Reinigung mit Ultraschall und dazu geeignete Reinigungsmittel
US5847441A (en) * 1996-05-10 1998-12-08 Micron Technology, Inc. Semiconductor junction antifuse circuit
US5942037A (en) 1996-12-23 1999-08-24 Fsi International, Inc. Rotatable and translatable spray nozzle
WO1999049998A1 (en) * 1998-03-30 1999-10-07 The Regents Of The University Of California Composition and method for removing photoresist materials from electronic components
JPH11300293A (ja) 1998-04-23 1999-11-02 Sumitomo Heavy Ind Ltd 表面洗浄装置
US6612317B2 (en) * 2000-04-18 2003-09-02 S.C. Fluids, Inc Supercritical fluid delivery and recovery system for semiconductor wafer processing
US6589359B2 (en) * 2000-07-11 2003-07-08 Tokyo Electron Limited Cleaning method and cleaning apparatus for substrate
US6706641B2 (en) * 2001-09-13 2004-03-16 Micell Technologies, Inc. Spray member and method for using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4798218A (en) * 1985-05-28 1989-01-17 Outillages Scientifiques Et De Laboratoires O.S.L. Cleaning apparatus for electronic components and/or precision parts of machinery
US5598861A (en) * 1995-03-07 1997-02-04 Safety-Kleen Corp. Parts washer with solvent flow control
JP2000271547A (ja) * 1999-03-25 2000-10-03 Kyocera Mita Corp 洗浄装置

Also Published As

Publication number Publication date
US6899110B2 (en) 2005-05-31
US20030005949A1 (en) 2003-01-09
JP2003001208A (ja) 2003-01-07
JP4210045B2 (ja) 2009-01-14
KR20030001306A (ko) 2003-01-06

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