SG10202008623SA - Wafer pre-aligner and method of pre-aligning wafer - Google Patents

Wafer pre-aligner and method of pre-aligning wafer

Info

Publication number
SG10202008623SA
SG10202008623SA SG10202008623SA SG10202008623SA SG10202008623SA SG 10202008623S A SG10202008623S A SG 10202008623SA SG 10202008623S A SG10202008623S A SG 10202008623SA SG 10202008623S A SG10202008623S A SG 10202008623SA SG 10202008623S A SG10202008623S A SG 10202008623SA
Authority
SG
Singapore
Prior art keywords
wafer
aligner
aligning
aligning wafer
wafer pre
Prior art date
Application number
SG10202008623SA
Other languages
English (en)
Inventor
Charles Rogers John
Kathleen Swiecicki Margaret
Original Assignee
Yaskawa Electric Corp
Yaskawa America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp, Yaskawa America Inc filed Critical Yaskawa Electric Corp
Publication of SG10202008623SA publication Critical patent/SG10202008623SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/43—Refractivity; Phase-affecting properties, e.g. optical path length by measuring critical angle
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG10202008623SA 2019-09-06 2020-09-04 Wafer pre-aligner and method of pre-aligning wafer SG10202008623SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962896866P 2019-09-06 2019-09-06
US17/005,378 US11929277B2 (en) 2019-09-06 2020-08-28 Wafer pre-aligner and method of pre-aligning wafer

Publications (1)

Publication Number Publication Date
SG10202008623SA true SG10202008623SA (en) 2021-04-29

Family

ID=72381028

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202008623SA SG10202008623SA (en) 2019-09-06 2020-09-04 Wafer pre-aligner and method of pre-aligning wafer

Country Status (10)

Country Link
US (1) US11929277B2 (zh)
EP (1) EP3790041B1 (zh)
JP (1) JP2021044548A (zh)
KR (1) KR20210029691A (zh)
CN (1) CN112466802A (zh)
DK (1) DK3790041T3 (zh)
ES (1) ES2928291T3 (zh)
PL (1) PL3790041T3 (zh)
SG (1) SG10202008623SA (zh)
TW (1) TWI833988B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102501318B1 (ko) * 2022-04-07 2023-02-16 양희찬 웨이퍼 이동암
EP4273911A1 (de) 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
JP2024054636A (ja) * 2022-10-05 2024-04-17 川崎重工業株式会社 ロボットシステム、アライナおよび半導体基板のアライメント方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2694468B2 (ja) 1989-12-20 1997-12-24 東京エレクトロン株式会社 位置検出方法および検査装置
JPH10256350A (ja) * 1997-03-06 1998-09-25 Toshiba Corp 半導体製造方法及びその装置
JP2000021956A (ja) 1998-07-02 2000-01-21 Mecs Corp ノッチ合わせ機
US6275742B1 (en) * 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
CN100499060C (zh) 2001-11-14 2009-06-10 罗兹株式会社 晶片定位方法和装置,晶片加工系统及晶片定位装置的晶片座旋转轴定位方法
US6932558B2 (en) * 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner
US8634633B2 (en) * 2003-11-10 2014-01-21 Brooks Automation, Inc. Wafer center finding with kalman filter
JP4636934B2 (ja) 2005-05-09 2011-02-23 タツモ株式会社 基板角度位置補正装置
CN100355055C (zh) 2005-10-28 2007-12-12 清华大学 硅晶圆预对准控制方法
TWI315455B (en) * 2006-06-23 2009-10-01 Littelfuse Concord Semiconductor Inc A structure and exposure method of double sided dual exposure mask aligner
JP5689704B2 (ja) * 2010-08-08 2015-03-25 日本電産サンキョー株式会社 モータ制御装置およびモータ制御方法
CN103199046B (zh) 2012-01-05 2015-09-09 沈阳新松机器人自动化股份有限公司 晶圆缺口边缘中心预对准方法
JP6521988B2 (ja) * 2014-02-12 2019-05-29 ケーエルエー−テンカー コーポレイション ウェハノッチの検出
US10373858B2 (en) * 2016-04-06 2019-08-06 Lam Research Corporation Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal
JP6568986B1 (ja) * 2018-06-28 2019-08-28 平田機工株式会社 アライメント装置、半導体ウエハ処理装置、およびアライメント方法

Also Published As

Publication number Publication date
KR20210029691A (ko) 2021-03-16
US20210074566A1 (en) 2021-03-11
US11929277B2 (en) 2024-03-12
EP3790041B1 (en) 2022-08-10
EP3790041A1 (en) 2021-03-10
TW202115606A (zh) 2021-04-16
PL3790041T3 (pl) 2023-02-06
DK3790041T3 (da) 2022-10-31
JP2021044548A (ja) 2021-03-18
TWI833988B (zh) 2024-03-01
ES2928291T3 (es) 2022-11-16
CN112466802A (zh) 2021-03-09

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