SG10201908362UA - Probe card holder - Google Patents

Probe card holder

Info

Publication number
SG10201908362UA
SG10201908362UA SG10201908362UA SG10201908362UA SG10201908362UA SG 10201908362U A SG10201908362U A SG 10201908362UA SG 10201908362U A SG10201908362U A SG 10201908362UA SG 10201908362U A SG10201908362U A SG 10201908362UA SG 10201908362U A SG10201908362U A SG 10201908362UA
Authority
SG
Singapore
Prior art keywords
probe card
card holder
holder
probe
card
Prior art date
Application number
SG10201908362UA
Other languages
English (en)
Inventor
Hirota Hideki
Yasuta Takao
Narumi Takayuki
Kikuchi Yoshinori
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of SG10201908362UA publication Critical patent/SG10201908362UA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06788—Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
SG10201908362UA 2018-09-28 2019-09-10 Probe card holder SG10201908362UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018183116A JP7138004B2 (ja) 2018-09-28 2018-09-28 プローブカード保持具

Publications (1)

Publication Number Publication Date
SG10201908362UA true SG10201908362UA (en) 2020-04-29

Family

ID=69947849

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201908362UA SG10201908362UA (en) 2018-09-28 2019-09-10 Probe card holder

Country Status (7)

Country Link
US (1) US10989739B2 (ja)
JP (1) JP7138004B2 (ja)
KR (1) KR102129849B1 (ja)
CN (1) CN110967620B (ja)
MY (1) MY197465A (ja)
SG (1) SG10201908362UA (ja)
TW (1) TWI729471B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102520852B1 (ko) * 2022-10-14 2023-04-13 주식회사 유니밴스 프로브카드용 탑 보강판

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293935A (ja) * 1987-05-27 1988-11-30 Hitachi Ltd プロ−ブ検査装置
JPH01161173A (ja) * 1987-12-16 1989-06-23 Tokyo Electron Ltd プローブ装置のプローブカード自動交換方法
JP2613438B2 (ja) * 1988-06-27 1997-05-28 東京エレクトロン株式会社 プローブ装置
JP2995134B2 (ja) * 1993-09-24 1999-12-27 東京エレクトロン株式会社 プローブ装置
US5695068A (en) * 1994-09-09 1997-12-09 Digital Equipment Corporation Probe card shipping and handling system
JPH0883825A (ja) * 1994-09-09 1996-03-26 Tokyo Electron Ltd プローブ装置
JPH0943276A (ja) * 1995-05-23 1997-02-14 Tokyo Electron Ltd プローブ装置に用いられるプローブカードデバイス
US5923180A (en) * 1997-02-04 1999-07-13 Hewlett-Packard Company Compliant wafer prober docking adapter
JP4022335B2 (ja) * 1999-04-15 2007-12-19 株式会社日本マイクロニクス プローブカードの検査装置
KR20010058701A (ko) * 1999-12-30 2001-07-06 서성원 반도체 웨이퍼 테스트용 링 캐리어 장치
US6441629B1 (en) 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
JP2003324132A (ja) * 2002-04-30 2003-11-14 Japan Electronic Materials Corp テスト用基板
JP4548817B2 (ja) * 2002-10-18 2010-09-22 東京エレクトロン株式会社 プローブ装置
JP2005251813A (ja) * 2004-03-02 2005-09-15 Matsushita Electric Ind Co Ltd ウエハレベルバーンインアライメント装置およびウエハレベルバーンインアライメント方法
JP2005265658A (ja) 2004-03-19 2005-09-29 Tokyo Electron Ltd 複数種のテスタに対応可能なプローブ装置
JP4625387B2 (ja) * 2005-09-16 2011-02-02 東京エレクトロン株式会社 プローブカードのクランプ機構及びプローブ装置
JP5099874B2 (ja) * 2006-07-19 2012-12-19 東京エレクトロン株式会社 プローブカードの固定機構、プローブカードの固定方法及びプローブ装置
US7598727B1 (en) * 2006-09-12 2009-10-06 Xilinx, Inc. Probe card head protection device for wafer sort set up
JP5190195B2 (ja) * 2006-11-29 2013-04-24 株式会社日本マイクロニクス 電気的接続装置
JP2008216060A (ja) * 2007-03-05 2008-09-18 Micronics Japan Co Ltd 電気的接続装置
JP5134864B2 (ja) * 2007-05-30 2013-01-30 株式会社日本マイクロニクス 半導体検査装置
JP5138615B2 (ja) 2008-02-15 2013-02-06 シャープ株式会社 半導体機能試験電気接続装置
US7960989B2 (en) * 2008-12-03 2011-06-14 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
JP2011064659A (ja) * 2009-09-21 2011-03-31 Tokyo Electron Ltd プローブカードのクランプ機構及び検査装置
JP5735896B2 (ja) 2011-10-06 2015-06-17 株式会社日本マイクロニクス プローブカードのハンドリング機構
JP6054150B2 (ja) * 2012-11-22 2016-12-27 日本電子材料株式会社 プローブカードケース及びプローブカードの搬送方法
TWI604198B (zh) * 2016-06-22 2017-11-01 思達科技股份有限公司 測試裝置、夾持組件及探針卡載具
CN206817146U (zh) * 2017-06-26 2017-12-29 卢丽花 一种纺织机械防夹结构
CN207116348U (zh) * 2017-08-23 2018-03-16 四川阿尔凯电气有限公司 一种紧急分闸装置
CN207740524U (zh) * 2018-01-04 2018-08-17 田军璠 一种井口采油树阀门防护装置
CN207889402U (zh) * 2018-02-26 2018-09-21 李言哲 一种金融票据夹持板

Also Published As

Publication number Publication date
CN110967620B (zh) 2022-07-22
MY197465A (en) 2023-06-19
KR102129849B1 (ko) 2020-08-05
JP2020053609A (ja) 2020-04-02
TWI729471B (zh) 2021-06-01
JP7138004B2 (ja) 2022-09-15
US20200103442A1 (en) 2020-04-02
KR20200036744A (ko) 2020-04-07
CN110967620A (zh) 2020-04-07
TW202035999A (zh) 2020-10-01
US10989739B2 (en) 2021-04-27

Similar Documents

Publication Publication Date Title
CA185904S (en) Access-resistant holder
EP3406159C0 (en) CARD HOLDER
ZA201903791B (en) Rod-mountable holder
CA189818S (en) Handshower holder
CA188075S (en) Card
SG11202105529RA (en) Probe unit
CA184678S (en) Tip holder
GB201806504D0 (en) Sample holder
IL264274A (en) device holder
EP3768103C0 (en) LIGHTED Ponytail Clip
SG10201908362UA (en) Probe card holder
SG11202105474UA (en) Probe unit
CA188079S (en) Card
CA188077S (en) Card
CA188074S (en) Card
GB201803274D0 (en) Card
GB201815658D0 (en) Plyaing card holder
HK1257503A1 (zh) 樣品架
GB201817012D0 (en) Smart device holder
CA191288S (fr) Porte-cartes
PL3708304T3 (pl) Uchwyt urządzenia
GB2562744B (en) Sample holder
GB201715734D0 (en) Playing card holder
HU5220U (hu) Munkadarab alátámasztó készülék CNC plazmavágó berendezéshez
GB201817154D0 (en) Object holder