SG10201900354WA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10201900354WA
SG10201900354WA SG10201900354WA SG10201900354WA SG10201900354WA SG 10201900354W A SG10201900354W A SG 10201900354WA SG 10201900354W A SG10201900354W A SG 10201900354WA SG 10201900354W A SG10201900354W A SG 10201900354WA SG 10201900354W A SG10201900354W A SG 10201900354WA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
ffi
om2ryc
irt77
a0div
Prior art date
Application number
SG10201900354WA
Other languages
English (en)
Inventor
Kimba Toshifumi
Takahashi Nobuyuki
Kinoshita Masaki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201900354WA publication Critical patent/SG10201900354WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G01B11/0633—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
    • G02B6/266—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting the optical element being an attenuator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3502—Optical coupling means having switching means involving direct waveguide displacement, e.g. cantilever type waveguide displacement involving waveguide bending, or displacing an interposed waveguide between stationary waveguides
    • G02B6/3506—Translating the waveguides along the beam path, e.g. by varying the distance between opposed waveguide ends, or by translation of the waveguide ends

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201900354WA 2018-01-18 2019-01-14 Polishing apparatus SG10201900354WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018006358A JP7068831B2 (ja) 2018-01-18 2018-01-18 研磨装置

Publications (1)

Publication Number Publication Date
SG10201900354WA true SG10201900354WA (en) 2019-08-27

Family

ID=67213754

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900354WA SG10201900354WA (en) 2018-01-18 2019-01-14 Polishing apparatus

Country Status (6)

Country Link
US (1) US10663287B2 (https=)
JP (1) JP7068831B2 (https=)
KR (1) KR102384828B1 (https=)
CN (1) CN110052961B (https=)
SG (1) SG10201900354WA (https=)
TW (1) TWI750444B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3948702A4 (en) 2019-03-29 2023-07-26 Saint-Gobain Abrasives, Inc. POWER LOOP SOLUTIONS
JP7364217B2 (ja) * 2019-11-05 2023-10-18 スピードファム株式会社 研磨装置
JP2022147223A (ja) * 2021-03-23 2022-10-06 大塚電子株式会社 光学測定システム、光学測定方法および測定プログラム
JP7680347B2 (ja) * 2021-12-24 2025-05-20 株式会社荏原製作所 膜厚測定方法および膜厚測定装置
JP2024093464A (ja) 2022-12-27 2024-07-09 株式会社荏原製作所 光学式膜厚測定器の光量調整方法および研磨装置
JP2024117029A (ja) * 2023-02-16 2024-08-28 株式会社東京精密 研磨終点検出装置及び方法並びにｃｍｐ装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3730299B2 (ja) * 1996-02-07 2005-12-21 富士通株式会社 光等化増幅器および光等化増幅方法
JP3506114B2 (ja) * 2000-01-25 2004-03-15 株式会社ニコン モニタ装置及びこのモニタ装置を具えた研磨装置及び研磨方法
US6806948B2 (en) * 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP4096232B2 (ja) * 2002-07-04 2008-06-04 株式会社栗原工業 Ｌｅｄ面光源装置
CN100488729C (zh) * 2002-10-17 2009-05-20 株式会社荏原制作所 抛光状态监测装置和抛光装置以及方法
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
JP2005322939A (ja) * 2005-06-08 2005-11-17 Tokyo Seimitsu Co Ltd ウェーハ研磨方法
JP2011029505A (ja) * 2009-07-28 2011-02-10 Fujitsu Semiconductor Ltd 研磨終点検出方法及び半導体製造装置
GB2478590A (en) * 2010-03-12 2011-09-14 Precitec Optronik Gmbh Apparatus and method for monitoring a thickness of a silicon wafer
TW201223703A (en) * 2010-09-01 2012-06-16 Applied Materials Inc Feedback control of polishing using optical detection of clearance
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8774958B2 (en) * 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile
US20140224425A1 (en) * 2013-02-13 2014-08-14 Kabushiki Kaisha Toshiba Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
JP6105371B2 (ja) * 2013-04-25 2017-03-29 株式会社荏原製作所 研磨方法および研磨装置
JP2015036714A (ja) * 2013-08-12 2015-02-23 三菱電機株式会社 光減衰器
JP5877289B1 (ja) * 2014-06-09 2016-03-02 オリンパス株式会社 内視鏡システム
JP6473050B2 (ja) * 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置
CN104932066B (zh) * 2015-06-30 2016-05-11 武汉光迅科技股份有限公司 一种硅波导耦合对准装置
JP6861116B2 (ja) * 2017-07-14 2021-04-21 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
CN107520740A (zh) * 2017-09-18 2017-12-29 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种化学机械抛光中光谱终点的检测方法、装置及系统

Also Published As

Publication number Publication date
JP7068831B2 (ja) 2022-05-17
TW201933466A (zh) 2019-08-16
CN110052961B (zh) 2021-11-02
US10663287B2 (en) 2020-05-26
KR102384828B1 (ko) 2022-04-11
CN110052961A (zh) 2019-07-26
KR20190088413A (ko) 2019-07-26
US20190219381A1 (en) 2019-07-18
JP2019125733A (ja) 2019-07-25
TWI750444B (zh) 2021-12-21

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