SG10201900354WA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10201900354WA
SG10201900354WA SG10201900354WA SG10201900354WA SG10201900354WA SG 10201900354W A SG10201900354W A SG 10201900354WA SG 10201900354W A SG10201900354W A SG 10201900354WA SG 10201900354W A SG10201900354W A SG 10201900354WA SG 10201900354W A SG10201900354W A SG 10201900354WA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
ffi
om2ryc
irt77
a0div
Prior art date
Application number
SG10201900354WA
Inventor
Kimba Toshifumi
Takahashi Nobuyuki
Kinoshita Masaki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201900354WA publication Critical patent/SG10201900354WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G01B11/0633—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
    • G02B6/266—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting the optical element being an attenuator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3502—Optical coupling means having switching means involving direct waveguide displacement, e.g. cantilever type waveguide displacement involving waveguide bending, or displacing an interposed waveguide between stationary waveguides
    • G02B6/3506—Translating the waveguides along the beam path, e.g. by varying the distance between opposed waveguide ends, or by translation of the waveguide ends
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

NIi - r - Wff , j qF.01(. la 1 , -=- -- - - 114 - 1 - tti6 A0DIV)1,1V1 -- 6 ,i - L -- e ii TetA4wijrzt - j - 5 L. - L ffi.--e 6 ):FC.N . ffi RI J -- - 111 6a }F 1 , wa, ANL , 3=FM ----- -71i/p - J o) A /- 6 ff 1_1:-RE. tui - - ,71kftor)92J1A --- 4 - 6 - il - A - YG7 7 4 i—L Vivt*'_60 RYG 7 7 4 i— a, '0 iRt77-(is---3I - 0M2RYE7 7-(i—A'U, 101 iiR)YAla`01R A_,774/--.6' . Invt\"2RA,774A —, :::r 1 9111 - 1611, `02tAYG'41f01RYC, - 774/—:T-3I'OM2RYC,774/-0 5 tDor)W.< L ti--D:LIF 911-d -611,- - c - o6 0 29
SG10201900354WA 2018-01-18 2019-01-14 Polishing apparatus SG10201900354WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018006358A JP7068831B2 (en) 2018-01-18 2018-01-18 Polishing equipment

Publications (1)

Publication Number Publication Date
SG10201900354WA true SG10201900354WA (en) 2019-08-27

Family

ID=67213754

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900354WA SG10201900354WA (en) 2018-01-18 2019-01-14 Polishing apparatus

Country Status (6)

Country Link
US (1) US10663287B2 (en)
JP (1) JP7068831B2 (en)
KR (1) KR102384828B1 (en)
CN (1) CN110052961B (en)
SG (1) SG10201900354WA (en)
TW (1) TWI750444B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7364217B2 (en) * 2019-11-05 2023-10-18 スピードファム株式会社 polishing equipment

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3730299B2 (en) * 1996-02-07 2005-12-21 富士通株式会社 Optical equalization amplifier and optical equalization amplification method
JP3506114B2 (en) * 2000-01-25 2004-03-15 株式会社ニコン MONITOR DEVICE, POLISHING APPARATUS HAVING THE MONITOR DEVICE, AND POLISHING METHOD
US6806948B2 (en) * 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP4096232B2 (en) 2002-07-04 2008-06-04 株式会社栗原工業 LED surface light source device
JP4542324B2 (en) * 2002-10-17 2010-09-15 株式会社荏原製作所 Polishing state monitoring device and polishing device
CN101530983B (en) * 2002-10-17 2011-03-16 株式会社荏原制作所 Polishing state monitoring apparatus and polishing apparatus and method
JP2005322939A (en) 2005-06-08 2005-11-17 Tokyo Seimitsu Co Ltd Method for polishing wafer
JP2011029505A (en) 2009-07-28 2011-02-10 Fujitsu Semiconductor Ltd Method of detecting polishing end point, and device for manufacturing semiconductor
GB2478590A (en) * 2010-03-12 2011-09-14 Precitec Optronik Gmbh Apparatus and method for monitoring a thickness of a silicon wafer
TW201223703A (en) * 2010-09-01 2012-06-16 Applied Materials Inc Feedback control of polishing using optical detection of clearance
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8774958B2 (en) * 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile
US20140224425A1 (en) * 2013-02-13 2014-08-14 Kabushiki Kaisha Toshiba Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
JP6105371B2 (en) * 2013-04-25 2017-03-29 株式会社荏原製作所 Polishing method and polishing apparatus
JP2015036714A (en) 2013-08-12 2015-02-23 三菱電機株式会社 Optical attenuator
CN105636501B (en) * 2014-06-09 2017-11-21 奥林巴斯株式会社 Endoscopic system
JP6473050B2 (en) * 2015-06-05 2019-02-20 株式会社荏原製作所 Polishing equipment
CN104932066B (en) * 2015-06-30 2016-05-11 武汉光迅科技股份有限公司 A kind of silicon waveguide-coupled alignment device
JP6861116B2 (en) * 2017-07-14 2021-04-21 株式会社荏原製作所 Film thickness measuring device, polishing device, and polishing method
CN107520740A (en) * 2017-09-18 2017-12-29 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） The detection method of optical spectrum end-point, apparatus and system in a kind of chemically mechanical polishing

Also Published As

Publication number Publication date
JP2019125733A (en) 2019-07-25
CN110052961A (en) 2019-07-26
CN110052961B (en) 2021-11-02
KR20190088413A (en) 2019-07-26
JP7068831B2 (en) 2022-05-17
KR102384828B1 (en) 2022-04-11
TW201933466A (en) 2019-08-16
US10663287B2 (en) 2020-05-26
US20190219381A1 (en) 2019-07-18
TWI750444B (en) 2021-12-21

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