KR102384828B1 - 연마 장치 - Google Patents

연마 장치 Download PDF

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Publication number
KR102384828B1
KR102384828B1 KR1020190004473A KR20190004473A KR102384828B1 KR 102384828 B1 KR102384828 B1 KR 102384828B1 KR 1020190004473 A KR1020190004473 A KR 1020190004473A KR 20190004473 A KR20190004473 A KR 20190004473A KR 102384828 B1 KR102384828 B1 KR 102384828B1
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KR
South Korea
Prior art keywords
light
fiber
transmitting fiber
wafer
polishing
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KR1020190004473A
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English (en)
Korean (ko)
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KR20190088413A (ko
Inventor
도시후미 김바
노부유키 다카하시
마사키 기노시타
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20190088413A publication Critical patent/KR20190088413A/ko
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Publication of KR102384828B1 publication Critical patent/KR102384828B1/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G01B11/0633—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
    • G02B6/266—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting the optical element being an attenuator
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3502—Optical coupling means having switching means involving direct waveguide displacement, e.g. cantilever type waveguide displacement involving waveguide bending, or displacing an interposed waveguide between stationary waveguides
    • G02B6/3506—Translating the waveguides along the beam path, e.g. by varying the distance between opposed waveguide ends, or by translation of the waveguide ends

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020190004473A 2018-01-18 2019-01-14 연마 장치 Active KR102384828B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018006358A JP7068831B2 (ja) 2018-01-18 2018-01-18 研磨装置
JPJP-P-2018-006358 2018-01-18

Publications (2)

Publication Number Publication Date
KR20190088413A KR20190088413A (ko) 2019-07-26
KR102384828B1 true KR102384828B1 (ko) 2022-04-11

Family

ID=67213754

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190004473A Active KR102384828B1 (ko) 2018-01-18 2019-01-14 연마 장치

Country Status (6)

Country Link
US (1) US10663287B2 (https=)
JP (1) JP7068831B2 (https=)
KR (1) KR102384828B1 (https=)
CN (1) CN110052961B (https=)
SG (1) SG10201900354WA (https=)
TW (1) TWI750444B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113767404A (zh) 2019-03-29 2021-12-07 圣戈班磨料磨具有限公司 高效研磨解决方案
JP7364217B2 (ja) * 2019-11-05 2023-10-18 スピードファム株式会社 研磨装置
JP2022147223A (ja) * 2021-03-23 2022-10-06 大塚電子株式会社 光学測定システム、光学測定方法および測定プログラム
JP7680347B2 (ja) * 2021-12-24 2025-05-20 株式会社荏原製作所 膜厚測定方法および膜厚測定装置
JP2024093464A (ja) 2022-12-27 2024-07-09 株式会社荏原製作所 光学式膜厚測定器の光量調整方法および研磨装置
JP2024117029A (ja) * 2023-02-16 2024-08-28 株式会社東京精密 研磨終点検出装置及び方法並びにｃｍｐ装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039482A (ja) * 2002-07-04 2004-02-05 Kurihara Kogyo:Kk Ｌｅｄ面光源装置
US20120196511A1 (en) 2011-01-28 2012-08-02 Applied Materials, Inc. Gathering Spectra From Multiple Optical Heads
JP2015036714A (ja) * 2013-08-12 2015-02-23 三菱電機株式会社 光減衰器

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JP3730299B2 (ja) * 1996-02-07 2005-12-21 富士通株式会社 光等化増幅器および光等化増幅方法
JP3506114B2 (ja) * 2000-01-25 2004-03-15 株式会社ニコン モニタ装置及びこのモニタ装置を具えた研磨装置及び研磨方法
US6806948B2 (en) * 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
CN100488729C (zh) * 2002-10-17 2009-05-20 株式会社荏原制作所 抛光状态监测装置和抛光装置以及方法
JP2005322939A (ja) * 2005-06-08 2005-11-17 Tokyo Seimitsu Co Ltd ウェーハ研磨方法
JP2011029505A (ja) * 2009-07-28 2011-02-10 Fujitsu Semiconductor Ltd 研磨終点検出方法及び半導体製造装置
GB2478590A (en) * 2010-03-12 2011-09-14 Precitec Optronik Gmbh Apparatus and method for monitoring a thickness of a silicon wafer
TW201223703A (en) * 2010-09-01 2012-06-16 Applied Materials Inc Feedback control of polishing using optical detection of clearance
US8774958B2 (en) * 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile
US20140224425A1 (en) * 2013-02-13 2014-08-14 Kabushiki Kaisha Toshiba Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
JP6105371B2 (ja) * 2013-04-25 2017-03-29 株式会社荏原製作所 研磨方法および研磨装置
EP3045106A4 (en) * 2014-06-09 2017-07-05 Olympus Corporation Endoscope system
JP6473050B2 (ja) * 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置
CN104932066B (zh) * 2015-06-30 2016-05-11 武汉光迅科技股份有限公司 一种硅波导耦合对准装置
JP6861116B2 (ja) * 2017-07-14 2021-04-21 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
CN107520740A (zh) * 2017-09-18 2017-12-29 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种化学机械抛光中光谱终点的检测方法、装置及系统

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2004039482A (ja) * 2002-07-04 2004-02-05 Kurihara Kogyo:Kk Ｌｅｄ面光源装置
US20120196511A1 (en) 2011-01-28 2012-08-02 Applied Materials, Inc. Gathering Spectra From Multiple Optical Heads
JP2015036714A (ja) * 2013-08-12 2015-02-23 三菱電機株式会社 光減衰器

Also Published As

Publication number Publication date
US10663287B2 (en) 2020-05-26
TWI750444B (zh) 2021-12-21
CN110052961B (zh) 2021-11-02
KR20190088413A (ko) 2019-07-26
JP7068831B2 (ja) 2022-05-17
JP2019125733A (ja) 2019-07-25
US20190219381A1 (en) 2019-07-18
CN110052961A (zh) 2019-07-26
TW201933466A (zh) 2019-08-16
SG10201900354WA (en) 2019-08-27

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