SG10201804726XA - Polishing table and polishing apparatus having the same - Google Patents

Polishing table and polishing apparatus having the same

Info

Publication number
SG10201804726XA
SG10201804726XA SG10201804726XA SG10201804726XA SG10201804726XA SG 10201804726X A SG10201804726X A SG 10201804726XA SG 10201804726X A SG10201804726X A SG 10201804726XA SG 10201804726X A SG10201804726X A SG 10201804726XA SG 10201804726X A SG10201804726X A SG 10201804726XA
Authority
SG
Singapore
Prior art keywords
polishing
polishing table
porous layer
same
polishing pad
Prior art date
Application number
SG10201804726XA
Other languages
English (en)
Inventor
Saito Kenichiro
Kosuge Ryuichi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201804726XA publication Critical patent/SG10201804726XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG10201804726XA 2017-06-06 2018-06-04 Polishing table and polishing apparatus having the same SG10201804726XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017111605A JP6883475B2 (ja) 2017-06-06 2017-06-06 研磨テーブル及びこれを備える研磨装置

Publications (1)

Publication Number Publication Date
SG10201804726XA true SG10201804726XA (en) 2019-01-30

Family

ID=64459177

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201804726XA SG10201804726XA (en) 2017-06-06 2018-06-04 Polishing table and polishing apparatus having the same

Country Status (3)

Country Link
US (1) US11433502B2 (ja)
JP (1) JP6883475B2 (ja)
SG (1) SG10201804726XA (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11545365B2 (en) * 2019-05-13 2023-01-03 Chempower Corporation Chemical planarization
CN113510601B (zh) * 2021-09-13 2021-11-19 南通迅腾精密设备有限公司 一种半导体加工用抛光装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2589064Y2 (ja) * 1991-12-05 1999-01-20 日本鋳造株式会社 研磨機用定盤
JPH09314460A (ja) * 1996-05-27 1997-12-09 Toshiba Ceramics Co Ltd 研磨装置
JPH10264013A (ja) * 1997-03-27 1998-10-06 Toshiba Corp 研磨用プレートおよびそれを用いた研磨装置
US6126532A (en) 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
JP2006188428A (ja) 2000-04-26 2006-07-20 Ibiden Co Ltd セラミック部材及びウェハ研磨装置用テーブル
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US6599175B2 (en) * 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
US8602851B2 (en) * 2003-06-09 2013-12-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled penetration subpad
JP3630670B2 (ja) * 2002-10-31 2005-03-16 アプライド マテリアルズ インコーポレイテッド 化学機械研磨装置用のプラテン及びその製造方法
JP2004160573A (ja) 2002-11-11 2004-06-10 Ebara Corp 研磨装置
KR100526877B1 (ko) * 2003-06-23 2005-11-09 삼성전자주식회사 반도체 웨이퍼용 ｃｍｐ 설비의 폴리싱 패드
US7497763B2 (en) * 2006-03-27 2009-03-03 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
JP2008238375A (ja) * 2007-03-28 2008-10-09 Tokyo Seimitsu Co Ltd Ｃｍｐ装置のプラテン
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
JP2014176950A (ja) 2013-02-12 2014-09-25 Ebara Corp 研磨装置、及び研磨パッド貼り付け方法
US20150118944A1 (en) 2013-01-31 2015-04-30 Ebara Corporation Polishing apparatus, method for attaching polishing pad, and method for replacing polishing pad
JP6376085B2 (ja) 2015-09-03 2018-08-22 信越半導体株式会社 研磨方法及び研磨装置

Also Published As

Publication number Publication date
JP6883475B2 (ja) 2021-06-09
US20180345447A1 (en) 2018-12-06
JP2018202562A (ja) 2018-12-27
US11433502B2 (en) 2022-09-06

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