SG10201703595XA - Substrate holder and plating apparatus using the same - Google Patents

Substrate holder and plating apparatus using the same

Info

Publication number
SG10201703595XA
SG10201703595XA SG10201703595XA SG10201703595XA SG10201703595XA SG 10201703595X A SG10201703595X A SG 10201703595XA SG 10201703595X A SG10201703595X A SG 10201703595XA SG 10201703595X A SG10201703595X A SG 10201703595XA SG 10201703595X A SG10201703595X A SG 10201703595XA
Authority
SG
Singapore
Prior art keywords
same
substrate holder
plating apparatus
plating
holder
Prior art date
Application number
SG10201703595XA
Other languages
English (en)
Inventor
Matsutaro Miyamoto
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201703595XA publication Critical patent/SG10201703595XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroplating Methods And Accessories (AREA)
SG10201703595XA 2016-05-09 2017-05-03 Substrate holder and plating apparatus using the same SG10201703595XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016093993A JP6747859B2 (ja) 2016-05-09 2016-05-09 基板ホルダ及びこれを用いためっき装置

Publications (1)

Publication Number Publication Date
SG10201703595XA true SG10201703595XA (en) 2017-12-28

Family

ID=60242581

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201703595XA SG10201703595XA (en) 2016-05-09 2017-05-03 Substrate holder and plating apparatus using the same
SG10201705522TA SG10201705522TA (en) 2016-05-09 2017-07-05 Substrate holder and plating apparatus using the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201705522TA SG10201705522TA (en) 2016-05-09 2017-07-05 Substrate holder and plating apparatus using the same

Country Status (4)

Country Link
US (1) US10738390B2 (ja)
JP (1) JP6747859B2 (ja)
SG (2) SG10201703595XA (ja)
TW (1) TWI719199B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7264780B2 (ja) 2019-09-10 2023-04-25 株式会社荏原製作所 基板ホルダ及びそれを備えた基板めっき装置、並びに電気接点
CN111560593A (zh) * 2020-06-23 2020-08-21 惠州市祺光科技有限公司 一种小尺寸光学镜片的镀膜用固定治具及其镀膜方法
EP4219800A1 (en) * 2022-01-31 2023-08-02 Semsysco GmbH Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7022211B2 (en) * 2000-01-31 2006-04-04 Ebara Corporation Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
DE19962170A1 (de) * 1999-12-22 2001-07-12 Steag Micro Tech Gmbh Substrahthalter
JP2001323397A (ja) * 2000-05-12 2001-11-22 Shin Etsu Polymer Co Ltd 薄膜形成装置及びそのコンタクト治具の製造方法
JP2002363794A (ja) * 2001-06-01 2002-12-18 Ebara Corp 基板ホルダ及びめっき装置
JP2002363797A (ja) * 2001-06-01 2002-12-18 Ebara Corp 電気接点及びその製造方法、並びにめっき装置
CN101281858B (zh) 2002-06-21 2011-02-02 株式会社荏原制作所 基片保持装置和电镀设备
JP4162440B2 (ja) * 2002-07-22 2008-10-08 株式会社荏原製作所 基板ホルダ及びめっき装置
JP4124327B2 (ja) * 2002-06-21 2008-07-23 株式会社荏原製作所 基板ホルダ及びめっき装置
JP2005220414A (ja) * 2004-02-06 2005-08-18 Ebara Corp メッキ装置
US20140251798A1 (en) * 2011-10-19 2014-09-11 Jcu Corporation Substrate electroplating jig
US8900425B2 (en) * 2011-11-29 2014-12-02 Applied Materials, Inc. Contact ring for an electrochemical processor
JP2015071802A (ja) * 2013-10-02 2015-04-16 株式会社荏原製作所 めっき装置および該めっき装置に使用されるクリーニング装置
JP6508935B2 (ja) 2014-02-28 2019-05-08 株式会社荏原製作所 基板ホルダ、めっき装置及びめっき方法

Also Published As

Publication number Publication date
SG10201705522TA (en) 2017-12-28
US10738390B2 (en) 2020-08-11
JP6747859B2 (ja) 2020-08-26
US20170321343A1 (en) 2017-11-09
TWI719199B (zh) 2021-02-21
JP2017203178A (ja) 2017-11-16
TW201740477A (zh) 2017-11-16

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