SG10201608243QA - Polishing apparatus and polishing method - Google Patents

Polishing apparatus and polishing method

Info

Publication number
SG10201608243QA
SG10201608243QA SG10201608243QA SG10201608243QA SG10201608243QA SG 10201608243Q A SG10201608243Q A SG 10201608243QA SG 10201608243Q A SG10201608243Q A SG 10201608243QA SG 10201608243Q A SG10201608243Q A SG 10201608243QA SG 10201608243Q A SG10201608243Q A SG 10201608243QA
Authority
SG
Singapore
Prior art keywords
polishing
polishing apparatus
polishing method
Prior art date
Application number
SG10201608243QA
Other languages
English (en)
Inventor
Taro Takahashi
Yuta Suzuki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201608243QA publication Critical patent/SG10201608243QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10201608243QA 2015-10-16 2016-10-03 Polishing apparatus and polishing method SG10201608243QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015204767 2015-10-16
JP2016164343A JP6775354B2 (ja) 2015-10-16 2016-08-25 研磨装置、及び、研磨方法

Publications (1)

Publication Number Publication Date
SG10201608243QA true SG10201608243QA (en) 2017-05-30

Family

ID=58551539

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201608243QA SG10201608243QA (en) 2015-10-16 2016-10-03 Polishing apparatus and polishing method

Country Status (6)

Country Link
US (1) US11260499B2 (ja)
JP (1) JP6775354B2 (ja)
KR (1) KR102538863B1 (ja)
CN (1) CN106965075B (ja)
SG (1) SG10201608243QA (ja)
TW (1) TWI725987B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102591906B1 (ko) * 2017-10-31 2023-10-20 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
CN110549240B (zh) * 2019-09-18 2020-12-29 清华大学 一种终点检测方法和化学机械抛光装置
JP2021194748A (ja) 2020-06-17 2021-12-27 株式会社荏原製作所 研磨装置及びプログラム
KR102618657B1 (ko) * 2021-09-07 2023-12-29 한국생산기술연구원 로봇을 이용한 폴리싱 장치 및 이에 의한 폴리싱 방법

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JP3033488B2 (ja) * 1996-03-27 2000-04-17 日本電気株式会社 研磨終点検出装置および方法
JP2953387B2 (ja) * 1996-08-12 1999-09-27 日本電気株式会社 ウェハの研磨装置及びウェハの研磨方法
US5846882A (en) 1996-10-03 1998-12-08 Applied Materials, Inc. Endpoint detector for a chemical mechanical polishing system
JPH10180625A (ja) * 1996-12-26 1998-07-07 Toshiba Corp 研磨方法および研磨装置
JPH1187286A (ja) 1997-09-05 1999-03-30 Lsi Logic Corp 半導体ウエハの二段階式化学的機械的研磨方法及び装置
US6190494B1 (en) 1998-07-29 2001-02-20 Micron Technology, Inc. Method and apparatus for electrically endpointing a chemical-mechanical planarization process
US6191037B1 (en) * 1998-09-03 2001-02-20 Micron Technology, Inc. Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
US6433541B1 (en) * 1999-12-23 2002-08-13 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements during the process for removing the film
JP2001198813A (ja) * 2000-01-13 2001-07-24 Toshiba Corp 研磨装置及びその研磨方法
US6547637B1 (en) 2000-10-05 2003-04-15 Momentum Technical Consulting Inc. Chemical/mechanical polishing endpoint detection device and method
JP3860528B2 (ja) * 2002-11-12 2006-12-20 株式会社東芝 半導体装置の製造方法
US7008296B2 (en) * 2003-06-18 2006-03-07 Applied Materials, Inc. Data processing for monitoring chemical mechanical polishing
JP2005288664A (ja) 2004-04-05 2005-10-20 Ebara Corp 研磨装置及び研磨パッド立上完了検知方法
JP2005034992A (ja) * 2004-10-29 2005-02-10 Ebara Corp ポリッシングの終点検知方法
US20070108066A1 (en) 2005-10-28 2007-05-17 Applied Materials, Inc. Voltage mode current control
CN101511539B (zh) * 2006-09-12 2012-08-22 株式会社荏原制作所 研磨装置及研磨方法
JP2009028856A (ja) * 2007-07-27 2009-02-12 Tokyo Seimitsu Co Ltd トルク変化を利用した研磨終端時点検知方法及びその装置
JP5060755B2 (ja) 2006-09-29 2012-10-31 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの粗研磨方法、及び半導体ウェハの研磨装置
KR101357290B1 (ko) 2006-10-06 2014-01-28 가부시끼가이샤 도시바 가공 종점 검지방법, 연마방법 및 연마장치
JP5057892B2 (ja) * 2007-08-30 2012-10-24 株式会社東京精密 トルク変化を利用した研磨終端時点検知方法及びその装置
JP5112007B2 (ja) * 2007-10-31 2013-01-09 株式会社荏原製作所 研磨装置および研磨方法
JP2012124419A (ja) * 2010-12-10 2012-06-28 Toshiba Corp 処理の終点検出方法および処理の終点検出装置
JP5990074B2 (ja) 2012-09-28 2016-09-07 株式会社荏原製作所 研磨装置
TWI530360B (zh) 2012-09-28 2016-04-21 荏原製作所股份有限公司 研磨裝置
JP5863614B2 (ja) * 2012-09-28 2016-02-16 株式会社荏原製作所 研磨装置
JP6030041B2 (ja) 2013-11-01 2016-11-24 株式会社荏原製作所 研磨装置および研磨方法
JP6327958B2 (ja) 2014-06-03 2018-05-23 株式会社荏原製作所 研磨装置
CN106604802B (zh) 2014-09-02 2019-05-31 株式会社荏原制作所 终点检测方法、研磨装置及研磨方法
US10744617B2 (en) 2015-10-16 2020-08-18 Ebara Corporation Polishing endpoint detection method

Also Published As

Publication number Publication date
KR20170045111A (ko) 2017-04-26
JP6775354B2 (ja) 2020-10-28
TW201714706A (zh) 2017-05-01
JP2017076779A (ja) 2017-04-20
CN106965075B (zh) 2020-02-07
US20200001428A1 (en) 2020-01-02
US11260499B2 (en) 2022-03-01
KR102538863B1 (ko) 2023-06-01
CN106965075A (zh) 2017-07-21
TWI725987B (zh) 2021-05-01

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