SG10201601244SA - Retainer ring, substrate holding apparatus, and polishing apparatus, and retainer ring maintenance method - Google Patents

Retainer ring, substrate holding apparatus, and polishing apparatus, and retainer ring maintenance method

Info

Publication number
SG10201601244SA
SG10201601244SA SG10201601244SA SG10201601244SA SG10201601244SA SG 10201601244S A SG10201601244S A SG 10201601244SA SG 10201601244S A SG10201601244S A SG 10201601244SA SG 10201601244S A SG10201601244S A SG 10201601244SA SG 10201601244S A SG10201601244S A SG 10201601244SA
Authority
SG
Singapore
Prior art keywords
retainer ring
substrate holding
maintenance method
polishing apparatus
holding apparatus
Prior art date
Application number
SG10201601244SA
Inventor
Makoto Fukushima
Hozumi Yasuda
Keisuke Namiki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201601244SA publication Critical patent/SG10201601244SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201601244SA 2015-02-24 2016-02-19 Retainer ring, substrate holding apparatus, and polishing apparatus, and retainer ring maintenance method SG10201601244SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015033668A JP2016155188A (en) 2015-02-24 2015-02-24 Retainer ring, substrate holding device, polishing device, and maintenance method of retainer ring

Publications (1)

Publication Number Publication Date
SG10201601244SA true SG10201601244SA (en) 2016-09-29

Family

ID=56690200

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201601244SA SG10201601244SA (en) 2015-02-24 2016-02-19 Retainer ring, substrate holding apparatus, and polishing apparatus, and retainer ring maintenance method

Country Status (3)

Country Link
US (1) US20160243670A1 (en)
JP (1) JP2016155188A (en)
SG (1) SG10201601244SA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5533924A (en) * 1994-09-01 1996-07-09 Micron Technology, Inc. Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers
US5876273A (en) * 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US6390904B1 (en) * 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
JP2005050893A (en) * 2003-07-30 2005-02-24 Mitsui Chemicals Inc Retainer ring and method for polishing substrate using the same
EP1694464B1 (en) * 2003-11-13 2010-05-26 Applied Materials, Inc. Retaining ring with shaped surface
US7094133B2 (en) * 2004-11-10 2006-08-22 Kabushiki Kaisha Toshiba Retainer and wafer polishing apparatus
JP4756884B2 (en) * 2005-03-14 2011-08-24 信越半導体株式会社 Polishing head, polishing apparatus and polishing method for semiconductor wafer
JP2008093810A (en) * 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd Retainer ring, polishing head and polishing device
JP2008302464A (en) * 2007-06-07 2008-12-18 Renesas Technology Corp Polishing device and manufacturing method of semiconductor device using it
EP3406402B1 (en) * 2010-08-06 2021-06-30 Applied Materials, Inc. Substrate edge tuning with retaining ring
US8740673B2 (en) * 2010-10-05 2014-06-03 Strasbaugh CMP retaining ring with soft retaining ring insert
US20130035022A1 (en) * 2011-08-05 2013-02-07 Paik Young J Two-Part Plastic Retaining Ring
TWI674171B (en) * 2012-01-31 2019-10-11 日商荏原製作所股份有限公司 Substrate holding device, polishing device, and polishing method
US9434047B2 (en) * 2012-11-14 2016-09-06 Taiwan Semiconductor Manufacturing Company, Ltd. Retainer ring
JP6403981B2 (en) * 2013-11-13 2018-10-10 株式会社荏原製作所 Substrate holding device, polishing device, polishing method, and retainer ring
US9368371B2 (en) * 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets

Also Published As

Publication number Publication date
JP2016155188A (en) 2016-09-01
US20160243670A1 (en) 2016-08-25

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