SG10201501153XA - Method and apparatus for processing wafer-shaped articles - Google Patents
Method and apparatus for processing wafer-shaped articlesInfo
- Publication number
- SG10201501153XA SG10201501153XA SG10201501153XA SG10201501153XA SG10201501153XA SG 10201501153X A SG10201501153X A SG 10201501153XA SG 10201501153X A SG10201501153X A SG 10201501153XA SG 10201501153X A SG10201501153X A SG 10201501153XA SG 10201501153X A SG10201501153X A SG 10201501153XA
- Authority
- SG
- Singapore
- Prior art keywords
- shaped articles
- processing wafer
- wafer
- processing
- articles
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/184,304 US9698029B2 (en) | 2014-02-19 | 2014-02-19 | Method and apparatus for processing wafer-shaped articles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201501153XA true SG10201501153XA (en) | 2015-09-29 |
Family
ID=53798722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201501153XA SG10201501153XA (en) | 2014-02-19 | 2015-02-13 | Method and apparatus for processing wafer-shaped articles |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9698029B2 (ko) |
| JP (1) | JP6495030B2 (ko) |
| KR (1) | KR102360260B1 (ko) |
| CN (1) | CN104851780B (ko) |
| SG (1) | SG10201501153XA (ko) |
| TW (1) | TWI657519B (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6715019B2 (ja) * | 2016-02-09 | 2020-07-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP7029251B2 (ja) * | 2017-08-28 | 2022-03-03 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| CN107968061A (zh) * | 2017-11-21 | 2018-04-27 | 长江存储科技有限责任公司 | 晶圆清洗液回收装置 |
| KR102139605B1 (ko) * | 2018-11-06 | 2020-08-12 | 세메스 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
| CN112768377B (zh) * | 2020-12-31 | 2022-08-12 | 上海至纯洁净系统科技股份有限公司 | 一种有效解决晶圆干燥颗粒数干燥后二次污染的结构 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4176003A (en) * | 1978-02-22 | 1979-11-27 | Ncr Corporation | Method for enhancing the adhesion of photoresist to polysilicon |
| JPH043624Y2 (ko) * | 1986-04-23 | 1992-02-04 | ||
| AT389959B (de) | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
| DE59407361D1 (de) | 1993-02-08 | 1999-01-14 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige Gegenstände |
| JP2004265910A (ja) | 2003-02-03 | 2004-09-24 | Personal Creation Ltd | 基板の処理液の分別回収装置及び該装置を備えた基板の処理装置、並びに基板の処理液の分別回収方法 |
| JP4441530B2 (ja) * | 2003-03-20 | 2010-03-31 | ラム・リサーチ・アクチエンゲゼルシヤフト | ディスク形状の物体を湿式処理するための装置及び方法 |
| JP2010171286A (ja) * | 2009-01-26 | 2010-08-05 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP5721952B2 (ja) * | 2010-01-07 | 2015-05-20 | 株式会社日立国際電気 | 半導体装置、半導体装置の製造方法および基板処理装置 |
| JP5240245B2 (ja) * | 2010-06-22 | 2013-07-17 | 東京エレクトロン株式会社 | 流路切替え装置、処理装置、流路切替え方法及び処理方法並びに記憶媒体 |
| JP6026241B2 (ja) | 2012-11-20 | 2016-11-16 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| JP6219848B2 (ja) * | 2012-12-28 | 2017-10-25 | 株式会社Ｓｃｒｅｅｎホールディングス | 処理装置とその排気切換装置並びに排気切換ユニットと切換弁ボックス |
-
2014
- 2014-02-19 US US14/184,304 patent/US9698029B2/en active Active
-
2015
- 2015-02-06 JP JP2015021801A patent/JP6495030B2/ja active Active
- 2015-02-11 TW TW104104512A patent/TWI657519B/zh active
- 2015-02-13 SG SG10201501153XA patent/SG10201501153XA/en unknown
- 2015-02-16 CN CN201510083843.7A patent/CN104851780B/zh active Active
- 2015-02-16 KR KR1020150023441A patent/KR102360260B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150098211A (ko) | 2015-08-27 |
| TW201543596A (zh) | 2015-11-16 |
| CN104851780A (zh) | 2015-08-19 |
| CN104851780B (zh) | 2018-03-13 |
| JP6495030B2 (ja) | 2019-04-03 |
| US20150235876A1 (en) | 2015-08-20 |
| JP2015179823A (ja) | 2015-10-08 |
| KR102360260B1 (ko) | 2022-02-07 |
| TWI657519B (zh) | 2019-04-21 |
| US9698029B2 (en) | 2017-07-04 |
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