SG10201404086XA - Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus - Google Patents

Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus

Info

Publication number
SG10201404086XA
SG10201404086XA SG10201404086XA SG10201404086XA SG10201404086XA SG 10201404086X A SG10201404086X A SG 10201404086XA SG 10201404086X A SG10201404086X A SG 10201404086XA SG 10201404086X A SG10201404086X A SG 10201404086XA SG 10201404086X A SG10201404086X A SG 10201404086XA
Authority
SG
Singapore
Prior art keywords
substrate
substrate cleaning
processing apparatus
cleaning device
manufacturing
Prior art date
Application number
SG10201404086XA
Other languages
English (en)
Inventor
Sakurai Takeshi
Hirai Eiji
Hamaura Kaoru
Miyazaki Mitsuru
Maruyama Koji
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013150506A external-priority patent/JP6345393B2/ja
Priority claimed from JP2013199471A external-priority patent/JP6224974B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201404086XA publication Critical patent/SG10201404086XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG10201404086XA 2013-07-19 2014-07-15 Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus SG10201404086XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013150506A JP6345393B2 (ja) 2013-07-19 2013-07-19 基板洗浄装置および基板洗浄方法
JP2013199471A JP6224974B2 (ja) 2013-09-26 2013-09-26 基板洗浄機、基板洗浄装置、洗浄済基板の製造方法及び基板処理装置

Publications (1)

Publication Number Publication Date
SG10201404086XA true SG10201404086XA (en) 2015-02-27

Family

ID=52319601

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201404086XA SG10201404086XA (en) 2013-07-19 2014-07-15 Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus

Country Status (5)

Country Link
US (2) US10032655B2 (zh)
KR (1) KR102211040B1 (zh)
CN (2) CN104299930B (zh)
SG (1) SG10201404086XA (zh)
TW (1) TWI628710B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10504753B2 (en) * 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
KR102635712B1 (ko) 2016-03-08 2024-02-14 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치, 기판 세정 방법, 기판 처리 장치 및 기판 건조 장치
JP6968547B2 (ja) * 2016-03-30 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法およびプログラム記録媒体
JP6956578B2 (ja) 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
CN107971261B (zh) * 2017-11-23 2021-03-02 Tcl华星光电技术有限公司 清洁装置
US11929268B2 (en) * 2018-02-05 2024-03-12 Tokyo Electron Limited Substrate processing system, substrate processing method and computer-readable recording medium
US11342202B2 (en) 2018-08-17 2022-05-24 Taiwan Semiconductor Manufacturing Co., Ltd. Automated wafer cleaning
US11791173B2 (en) 2019-03-21 2023-10-17 Samsung Electronics Co., Ltd. Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
JP7308074B2 (ja) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN216542663U (zh) * 2021-09-07 2022-05-17 杭州众硅电子科技有限公司 晶圆抛光系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3114156B2 (ja) 1994-06-28 2000-12-04 株式会社荏原製作所 洗浄方法および装置
KR0150595B1 (ko) 1994-06-30 1998-12-01 이시다 아키라 브러쉬 세정장치 및 브러쉬 세정방법 및 브러쉬 부착/분리방법
JP2848783B2 (ja) 1994-07-04 1999-01-20 大日本スクリーン製造株式会社 ブラシ洗浄装置
US5693148A (en) * 1995-11-08 1997-12-02 Ontrak Systems, Incorporated Process for brush cleaning
TW353784B (en) * 1996-11-19 1999-03-01 Tokyo Electron Ltd Apparatus and method for washing substrate
JPH10323631A (ja) 1997-05-23 1998-12-08 Ebara Corp 洗浄部材のセルフクリーニング装置
KR100354456B1 (ko) * 1999-10-27 2002-09-30 주식회사 기가트론 습식세정 및 건조장치와 그 방법
US6616509B1 (en) * 2000-03-31 2003-09-09 Lam Research Corporation Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure
JP2002043267A (ja) 2000-07-21 2002-02-08 Ebara Corp 基板洗浄装置、基板洗浄方法及び基板処理装置
JP4079205B2 (ja) * 2000-08-29 2008-04-23 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
JP4283068B2 (ja) 2003-08-29 2009-06-24 株式会社荏原製作所 基板洗浄装置の洗浄部材の初期化方法、基板洗浄装置並びに基板研磨及び洗浄システム
KR100648165B1 (ko) * 2004-04-06 2006-11-28 동경 엘렉트론 주식회사 기판 세정 장치, 기판 세정 방법 및 그 방법에 사용되는프로그램을 기록한 매체
US8608858B2 (en) * 2004-09-28 2013-12-17 Ebara Corporation Substrate cleaning apparatus and method for determining timing of replacement of cleaning member
JP2006319279A (ja) 2005-05-16 2006-11-24 Seiko Epson Corp 基板洗浄装置及び基板洗浄方法
JP2007052300A (ja) * 2005-08-19 2007-03-01 Pre-Tech Co Ltd マスク基板用の洗浄装置及びそれを用いたマスク基板の洗浄方法
JP2007273608A (ja) * 2006-03-30 2007-10-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2008060299A (ja) * 2006-08-31 2008-03-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5385537B2 (ja) 2008-02-26 2014-01-08 大日本スクリーン製造株式会社 基板処理装置
JP2013069776A (ja) 2011-09-21 2013-04-18 Tokyo Electron Ltd 基板洗浄装置、基板洗浄方法および基板洗浄方法を実行するためのコンピュータプログラムが記録された記録媒体

Also Published As

Publication number Publication date
KR102211040B1 (ko) 2021-02-02
US10879086B2 (en) 2020-12-29
CN104299930A (zh) 2015-01-21
TWI628710B (zh) 2018-07-01
CN104299930B (zh) 2018-09-25
US20150020851A1 (en) 2015-01-22
TW201513205A (zh) 2015-04-01
KR20150010659A (ko) 2015-01-28
CN108493134B (zh) 2022-03-29
US10032655B2 (en) 2018-07-24
US20180308716A1 (en) 2018-10-25
CN108493134A (zh) 2018-09-04

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