SE9900114D0 - System for production of large area display panels with improved precision - Google Patents
System for production of large area display panels with improved precisionInfo
- Publication number
- SE9900114D0 SE9900114D0 SE9900114A SE9900114A SE9900114D0 SE 9900114 D0 SE9900114 D0 SE 9900114D0 SE 9900114 A SE9900114 A SE 9900114A SE 9900114 A SE9900114 A SE 9900114A SE 9900114 D0 SE9900114 D0 SE 9900114D0
- Authority
- SE
- Sweden
- Prior art keywords
- mask
- pattern
- producing
- substrate
- production
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
- G03F7/70504—Optical system modelling, e.g. lens heating models
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
- G03F7/706839—Modelling, e.g. modelling scattering or solving inverse problems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9900114A SE517345C2 (sv) | 1999-01-18 | 1999-01-18 | Metod och system för tillverkande av stora skärmpaneler med förbättrad precision |
SE9901866A SE9901866A0 (en) | 1999-01-18 | 1999-05-20 | A method for error reduction in lithography |
US09/869,119 US6844123B1 (en) | 1999-01-18 | 2000-01-18 | System for production of large area display panels with improved precision |
KR1020017009020A KR100710970B1 (ko) | 1999-01-18 | 2000-01-18 | 향상된 정밀도를 갖는 대영역 디스플레이 패널 생산시스템 |
PCT/SE2000/000097 WO2000042630A1 (en) | 1999-01-18 | 2000-01-18 | System for production of large area display panels with improved precision |
JP2000594132A JP2002535710A (ja) | 1999-01-18 | 2000-01-18 | 改良された精度を有する大面積表示パネルを製造するシステム |
AU23382/00A AU2338200A (en) | 1999-01-18 | 2000-01-18 | System for production of large area display panels with improved precision |
KR1020017014744A KR100770100B1 (ko) | 1999-01-18 | 2000-05-22 | 리소그래피에서 에러 감소를 위한 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9900114A SE517345C2 (sv) | 1999-01-18 | 1999-01-18 | Metod och system för tillverkande av stora skärmpaneler med förbättrad precision |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9900114D0 true SE9900114D0 (sv) | 1999-01-18 |
SE9900114L SE9900114L (sv) | 2000-07-19 |
SE517345C2 SE517345C2 (sv) | 2002-05-28 |
Family
ID=20414113
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9900114A SE517345C2 (sv) | 1999-01-18 | 1999-01-18 | Metod och system för tillverkande av stora skärmpaneler med förbättrad precision |
SE9901866A SE9901866A0 (en) | 1999-01-18 | 1999-05-20 | A method for error reduction in lithography |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9901866A SE9901866A0 (en) | 1999-01-18 | 1999-05-20 | A method for error reduction in lithography |
Country Status (6)
Country | Link |
---|---|
US (1) | US6844123B1 (sv) |
JP (1) | JP2002535710A (sv) |
KR (2) | KR100710970B1 (sv) |
AU (1) | AU2338200A (sv) |
SE (2) | SE517345C2 (sv) |
WO (1) | WO2000042630A1 (sv) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7444616B2 (en) * | 1999-05-20 | 2008-10-28 | Micronic Laser Systems Ab | Method for error reduction in lithography |
JP3572053B2 (ja) * | 2001-05-31 | 2004-09-29 | 株式会社東芝 | 露光マスクの製造方法、マスク基板情報生成方法、半導体装置の製造方法およびサーバー |
SE0104131D0 (sv) * | 2001-12-10 | 2001-12-10 | Micronic Laser Systems Ab | Improved method and apparatus for image formation |
SE0200547D0 (sv) * | 2002-02-25 | 2002-02-25 | Micronic Laser Systems Ab | An image forming method and apparatus |
US7588869B2 (en) * | 2003-12-30 | 2009-09-15 | Lg Display Co., Ltd. | Divided exposure method for making a liquid crystal display |
WO2006021406A2 (en) * | 2004-08-23 | 2006-03-02 | Micronic Laser Systems Ab | Pupil improvement of incoherent imaging systems for enhanced cd linearity |
US7221434B2 (en) * | 2005-03-01 | 2007-05-22 | Canon Kabushiki Kaisha | Exposure method and apparatus |
KR100674964B1 (ko) * | 2005-03-14 | 2007-01-26 | 삼성전자주식회사 | 포토마스크 교정 방법 및 시스템 장치 |
JP4336671B2 (ja) * | 2005-07-15 | 2009-09-30 | キヤノン株式会社 | 露光パラメータの決定をコンピュータに実行させるプログラム、露光パラメータを決定する決定方法、露光方法及びデバイス製造方法。 |
JP2009175276A (ja) * | 2008-01-22 | 2009-08-06 | Toshiba Corp | フォトマスク作製方法、フォトマスク作製システムおよび半導体デバイス |
US20090199152A1 (en) * | 2008-02-06 | 2009-08-06 | Micronic Laser Systems Ab | Methods and apparatuses for reducing mura effects in generated patterns |
US8725477B2 (en) | 2008-04-10 | 2014-05-13 | Schlumberger Technology Corporation | Method to generate numerical pseudocores using borehole images, digital rock samples, and multi-point statistics |
CN101878434B (zh) * | 2008-04-10 | 2014-05-07 | 普拉德研究及开发股份有限公司 | 用于表征被井眼穿过的地质构造的方法 |
US8311788B2 (en) | 2009-07-01 | 2012-11-13 | Schlumberger Technology Corporation | Method to quantify discrete pore shapes, volumes, and surface areas using confocal profilometry |
US10996573B2 (en) * | 2017-01-31 | 2021-05-04 | Asml Netherlands B.V. | Method and system for increasing accuracy of pattern positioning |
JP6963967B2 (ja) * | 2017-10-30 | 2021-11-10 | Hoya株式会社 | パターン描画方法、フォトマスクの製造方法、及び表示装置用デバイスの製造方法 |
WO2022002418A1 (en) | 2020-07-03 | 2022-01-06 | Ceramic Data Solution GmbH | Increased storage capacity for a method for long-term storage of information and storage medium therefor |
CA3184849A1 (en) | 2020-07-03 | 2022-01-06 | Martin Kunze | Information storage method and information storage medium with increased storage density by multi-bit coding |
EP3955248A1 (en) * | 2020-08-11 | 2022-02-16 | Christian Pflaum | Data recording on ceramic material |
EP4085455A1 (en) | 2021-03-16 | 2022-11-09 | Ceramic Data Solutions GmbH | Data carrier, reading method and system utilizing super resolution techniques |
CN118103772A (zh) * | 2022-03-25 | 2024-05-28 | 美商福昌公司 | 用于光掩模表面处理的系统、方法和程序产品 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6474547A (en) * | 1987-09-14 | 1989-03-20 | Motorola Inc | Manufacture of semiconductor for compensating strain between pattern on semiconductor body and mask for obtaining pattern |
DE4022732A1 (de) | 1990-07-17 | 1992-02-20 | Micronic Laser Systems Ab | Auf einem lichtempfindlich beschichteten substrat durch fokussierte laserstrahlung hergestellte struktur sowie verfahren und vorrichtung zu ihrer herstellung |
JPH08297692A (ja) * | 1994-09-16 | 1996-11-12 | Mitsubishi Electric Corp | 光近接補正装置及び方法並びにパタン形成方法 |
WO1997005526A1 (en) | 1995-07-31 | 1997-02-13 | Lsi Logic Corporation | Lithography systems employing programmable reticles |
JP2000066367A (ja) * | 1998-08-21 | 2000-03-03 | Sony Corp | フォトマスクおよびレジストパターン形成方法 |
-
1999
- 1999-01-18 SE SE9900114A patent/SE517345C2/sv not_active IP Right Cessation
- 1999-05-20 SE SE9901866A patent/SE9901866A0/sv not_active Application Discontinuation
-
2000
- 2000-01-18 WO PCT/SE2000/000097 patent/WO2000042630A1/en active IP Right Grant
- 2000-01-18 AU AU23382/00A patent/AU2338200A/en not_active Abandoned
- 2000-01-18 JP JP2000594132A patent/JP2002535710A/ja active Pending
- 2000-01-18 KR KR1020017009020A patent/KR100710970B1/ko active IP Right Grant
- 2000-01-18 US US09/869,119 patent/US6844123B1/en not_active Expired - Lifetime
- 2000-05-22 KR KR1020017014744A patent/KR100770100B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
SE517345C2 (sv) | 2002-05-28 |
KR100710970B1 (ko) | 2007-05-16 |
SE9901866D0 (sv) | 1999-05-20 |
KR20010101570A (ko) | 2001-11-14 |
SE9901866L (sv) | |
KR20010112497A (ko) | 2001-12-20 |
WO2000042630A1 (en) | 2000-07-20 |
AU2338200A (en) | 2000-08-01 |
KR100770100B1 (ko) | 2007-10-24 |
JP2002535710A (ja) | 2002-10-22 |
SE9900114L (sv) | 2000-07-19 |
SE9901866A0 (en) | 2000-07-19 |
US6844123B1 (en) | 2005-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |