SE9604678D0 - Bumps in grooves for elestic positioning - Google Patents

Bumps in grooves for elestic positioning

Info

Publication number
SE9604678D0
SE9604678D0 SE9604678A SE9604678A SE9604678D0 SE 9604678 D0 SE9604678 D0 SE 9604678D0 SE 9604678 A SE9604678 A SE 9604678A SE 9604678 A SE9604678 A SE 9604678A SE 9604678 D0 SE9604678 D0 SE 9604678D0
Authority
SE
Sweden
Prior art keywords
bumps
parts
alignment
grooves
elastic
Prior art date
Application number
SE9604678A
Other languages
English (en)
Other versions
SE9604678L (sv
Inventor
Lellebror Hjalmar Hesselbom
Jan Peter Bodoe
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9604678A priority Critical patent/SE9604678L/sv
Publication of SE9604678D0 publication Critical patent/SE9604678D0/sv
Priority to TW086100965A priority patent/TW327245B/zh
Priority to PCT/SE1997/002179 priority patent/WO1998027590A1/en
Priority to CNB971817049A priority patent/CN1145210C/zh
Priority to EP97951405A priority patent/EP0951736A1/en
Priority to JP52763198A priority patent/JP4143130B2/ja
Priority to US08/995,202 priority patent/US6188138B1/en
Priority to AU55056/98A priority patent/AU5505698A/en
Priority to KR1019997005629A priority patent/KR20000069627A/ko
Priority to CA002275521A priority patent/CA2275521A1/en
Publication of SE9604678L publication Critical patent/SE9604678L/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/81141—Guiding structures both on and outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/83141—Guiding structures both on and outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Combinations Of Printed Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SE9604678A 1996-12-19 1996-12-19 Bulor i spår för elastisk lokalisering SE9604678L (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE9604678A SE9604678L (sv) 1996-12-19 1996-12-19 Bulor i spår för elastisk lokalisering
TW086100965A TW327245B (en) 1996-12-19 1997-01-29 Bumps in grooves for elastic positioning
CA002275521A CA2275521A1 (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning
EP97951405A EP0951736A1 (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning
CNB971817049A CN1145210C (zh) 1996-12-19 1997-12-19 对准结构
PCT/SE1997/002179 WO1998027590A1 (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning
JP52763198A JP4143130B2 (ja) 1996-12-19 1997-12-19 少なくとも１つのｖ字溝を備えた第１部品と、少なくとも１つの隆起を備えた第２部品とを有した整合構造
US08/995,202 US6188138B1 (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning
AU55056/98A AU5505698A (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning
KR1019997005629A KR20000069627A (ko) 1996-12-19 1997-12-19 탄성적 위치결정을 위한 홈내 범프

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604678A SE9604678L (sv) 1996-12-19 1996-12-19 Bulor i spår för elastisk lokalisering

Publications (2)

Publication Number Publication Date
SE9604678D0 true SE9604678D0 (sv) 1996-12-19
SE9604678L SE9604678L (sv) 1998-06-20

Family

ID=20405044

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9604678A SE9604678L (sv) 1996-12-19 1996-12-19 Bulor i spår för elastisk lokalisering

Country Status (10)

Country Link
US (1) US6188138B1 (sv)
EP (1) EP0951736A1 (sv)
JP (1) JP4143130B2 (sv)
KR (1) KR20000069627A (sv)
CN (1) CN1145210C (sv)
AU (1) AU5505698A (sv)
CA (1) CA2275521A1 (sv)
SE (1) SE9604678L (sv)
TW (1) TW327245B (sv)
WO (1) WO1998027590A1 (sv)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1122567A1 (en) 2000-02-02 2001-08-08 Corning Incorporated Passive alignement using slanted wall pedestal
US6809420B1 (en) * 2000-02-29 2004-10-26 Intel Corporation Characterization of induced shift on an overlay target using post-etch artifact wafers
US6759746B1 (en) * 2000-03-17 2004-07-06 Robert Bruce Davies Die attachment and method
EP1178340A1 (en) * 2000-08-02 2002-02-06 Corning Incorporated Vertically-tolerant alignment using slanted wall pedestal
US6495396B1 (en) * 2001-08-29 2002-12-17 Sun Microsystems, Inc. Method of coupling and aligning semiconductor devices including multi-chip semiconductor devices
US6696320B2 (en) * 2001-09-30 2004-02-24 Intel Corporation Low profile stacked multi-chip package and method of forming same
US6774482B2 (en) * 2002-12-27 2004-08-10 International Business Machines Corporation Chip cooling
US7112882B2 (en) * 2004-08-25 2006-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Structures and methods for heat dissipation of semiconductor integrated circuits
US20070013053A1 (en) * 2005-07-12 2007-01-18 Peter Chou Semiconductor device and method for manufacturing a semiconductor device
US7745301B2 (en) * 2005-08-22 2010-06-29 Terapede, Llc Methods and apparatus for high-density chip connectivity
US8957511B2 (en) * 2005-08-22 2015-02-17 Madhukar B. Vora Apparatus and methods for high-density chip connectivity
US20080048456A1 (en) * 2006-08-23 2008-02-28 Northern Power Systems, Inc. Modular microturbine system
US7656017B2 (en) * 2006-12-18 2010-02-02 Stats Chippac Ltd. Integrated circuit package system with thermo-mechanical interlocking substrates
JP5073351B2 (ja) * 2007-04-12 2012-11-14 日本電波工業株式会社 表面実装用の電子デバイス
TWI478272B (zh) * 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
WO2012162369A1 (en) * 2011-05-23 2012-11-29 University Of Massachusetts Apparatus and methods for multi-scale alignment and fastening
CN103282814B (zh) * 2011-12-26 2015-02-25 株式会社藤仓 光模块
CN102623615A (zh) * 2012-03-30 2012-08-01 东南大学 可自对准的发光二极管的圆片级封装方法
US9044237B2 (en) * 2012-04-16 2015-06-02 Boston Scientific Scimed, Inc. Securement structure for joining medical device parts
US9606307B2 (en) 2012-09-27 2017-03-28 Fujikura Ltd. Optical module
CN104889903B (zh) * 2014-03-07 2019-09-17 耐克创新有限合伙公司 磁性自对准的制造固定器
JP7006322B2 (ja) 2018-01-31 2022-01-24 トヨタ自動車株式会社 車両
CN108966488B (zh) * 2018-09-26 2024-04-16 四川锐宏电子科技有限公司 一种半孔微槽电路板及其加工设备和加工工艺
CN113178421B (zh) * 2021-04-08 2022-03-29 深圳市磐锋精密技术有限公司 一种手机集成电路的多芯片封装定位装置及其定位方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB661490A (en) * 1949-03-21 1951-11-21 Frederick Charles Baker Mounting for shafts and the like
US3484944A (en) * 1968-01-29 1969-12-23 Pratt & Whitney Inc Aligning of guide v-rails
JPS5582009A (en) * 1978-12-14 1980-06-20 Fujitsu Ltd Alignment system for tested printed board
US4330935A (en) * 1980-06-10 1982-05-25 Western Electric Company, Inc. Methods of and apparatus for assembling contact elements with a housing to form a contact module
JPH07112041B2 (ja) * 1986-12-03 1995-11-29 シャープ株式会社 半導体装置の製造方法
DE3884823D1 (de) * 1987-01-30 1993-11-18 Hewlett Packard Co Verfahren und Vorrichtung zur Alignierung zweier Oberflächen.
US4813129A (en) 1987-06-19 1989-03-21 Hewlett-Packard Company Interconnect structure for PC boards and integrated circuits
EP0411165B1 (en) * 1989-07-26 1997-04-02 International Business Machines Corporation Method of forming of an integrated circuit chip packaging structure
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
CA2034703A1 (en) 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
US4975079A (en) 1990-02-23 1990-12-04 International Business Machines Corp. Connector assembly for chip testing
US5180311A (en) 1991-01-22 1993-01-19 Hughes Aircraft Company Resilient interconnection bridge
US5411400A (en) * 1992-09-28 1995-05-02 Motorola, Inc. Interconnect system for a semiconductor chip and a substrate
DE4232608C2 (de) * 1992-09-29 1994-10-06 Bosch Gmbh Robert Verfahren zum Herstellen eines Deckels für eine integriert optische Schaltung
US5406701A (en) * 1992-10-02 1995-04-18 Irvine Sensors Corporation Fabrication of dense parallel solder bump connections
US5322816A (en) 1993-01-19 1994-06-21 Hughes Aircraft Company Method for forming deep conductive feedthroughs
US5465152A (en) * 1994-06-03 1995-11-07 Robotic Vision Systems, Inc. Method for coplanarity inspection of package or substrate warpage for ball grid arrays, column arrays, and similar structures
US5523628A (en) * 1994-08-05 1996-06-04 Hughes Aircraft Company Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips
DE4438053C2 (de) 1994-10-25 2002-05-02 Harting Elektrooptische Bauteile Gmbh & Co Kg Verfahren zum Herstellen einer elektrisch leitfähigen Struktur
US5472886A (en) 1994-12-27 1995-12-05 At&T Corp. Structure of and method for manufacturing an LED
JP3310499B2 (ja) * 1995-08-01 2002-08-05 富士通株式会社 半導体装置
US5660321A (en) * 1996-03-29 1997-08-26 Intel Corporation Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts
US5726502A (en) * 1996-04-26 1998-03-10 Motorola, Inc. Bumped semiconductor device with alignment features and method for making the same
EP0953210A1 (en) * 1996-12-19 1999-11-03 TELEFONAKTIEBOLAGET L M ERICSSON (publ) Flip-chip type connection with elastic contacts

Also Published As

Publication number Publication date
WO1998027590A1 (en) 1998-06-25
KR20000069627A (ko) 2000-11-25
JP4143130B2 (ja) 2008-09-03
AU5505698A (en) 1998-07-15
US6188138B1 (en) 2001-02-13
TW327245B (en) 1998-02-21
SE9604678L (sv) 1998-06-20
CA2275521A1 (en) 1998-06-25
EP0951736A1 (en) 1999-10-27
CN1145210C (zh) 2004-04-07
CN1245586A (zh) 2000-02-23
JP2001506415A (ja) 2001-05-15

Similar Documents

Publication Publication Date Title
SE9604678D0 (sv) Bumps in grooves for elestic positioning
ES550110A0 (es) Un componente optico integrado para uso en tecnologias de comunicaciones.
TW376543B (en) Substrate temperature control equipment and method
ES2111591T3 (es) Conector optico.
DK67482A (da) Fremgangsmaade til fremstilling af en glat endeflade paa en optisk fiber
SE8503011L (sv) Eldfast platta samt sett att montera denna i en skjutspjellsventil
ES2017941B3 (es) Muelle de flexion y procedimiento para su fabricacion.
EP0926520A3 (en) Optical fiber array
US20110262577A1 (en) Mold for molding optical fiber connectors
MXPA06002745A (es) Metodos para formar guia de onda y guias de onda fabricadas a partir de los mismos.
DE50006706D1 (de) Heisskanal-verteiler-system
ATE137587T1 (de) Vorrichtung zur kopplung von lichtwellenleitern
JPH0610690B2 (ja) 光デバイスパツケ−ジ
SE9604676L (sv) Anslutning av flip-chip typ med elastiska kontakter
JPS5628A (en) Magnetic head unit
EP1111421A3 (en) Flip-chip mounting of optical module and alignment using grooves together with optical fibers
JPS57112706A (en) Connector for optical fiber
SE9603864L (sv) Förfarande och anordning för positionering och fasthållning av mikrobyggblock
JPS6474784A (en) Fixing structure for positioning semiconductor laser chip and input lens
JPS5735816A (en) Fine adjusting method for axis alignment of optical fiber
JPS6425582A (en) Mounting construction of led device
JPS5782808A (en) Optical fiber connector
DE69942548D1 (de) Formträgerrahmen mit thermisch stabilem zentrum
CZ278784B6 (en) Guide pad for rail fastening
DE3678228D1 (en) Waeschehalter.

Legal Events

Date Code Title Description
NUG Patent has lapsed