SE9603864L - Förfarande och anordning för positionering och fasthållning av mikrobyggblock - Google Patents

Förfarande och anordning för positionering och fasthållning av mikrobyggblock

Info

Publication number
SE9603864L
SE9603864L SE9603864A SE9603864A SE9603864L SE 9603864 L SE9603864 L SE 9603864L SE 9603864 A SE9603864 A SE 9603864A SE 9603864 A SE9603864 A SE 9603864A SE 9603864 L SE9603864 L SE 9603864L
Authority
SE
Sweden
Prior art keywords
chip
positioning
chips
micro
micromechanical
Prior art date
Application number
SE9603864A
Other languages
English (en)
Other versions
SE9603864D0 (sv
SE510314C2 (sv
Inventor
Ylva Baecklund
Carola Strandman
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9603864A priority Critical patent/SE510314C2/sv
Publication of SE9603864D0 publication Critical patent/SE9603864D0/sv
Priority to TW086115245A priority patent/TW357425B/zh
Priority to CN97199007A priority patent/CN1112085C/zh
Priority to EP97910667A priority patent/EP0933012B1/en
Priority to AU47972/97A priority patent/AU4797297A/en
Priority to KR1019990703411A priority patent/KR20000052643A/ko
Priority to DE69730338T priority patent/DE69730338T2/de
Priority to CA002269523A priority patent/CA2269523A1/en
Priority to PCT/SE1997/001745 priority patent/WO1998018304A1/en
Priority to JP51928498A priority patent/JP2001504271A/ja
Priority to US08/954,731 priority patent/US6137172A/en
Publication of SE9603864L publication Critical patent/SE9603864L/sv
Publication of SE510314C2 publication Critical patent/SE510314C2/sv
Priority to HK00102678A priority patent/HK1023685A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/002—Aligning microparts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/008—Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/05—Aligning components to be assembled
    • B81C2203/051—Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conveying And Assembling Of Building Elements In Situ (AREA)
SE9603864A 1996-10-21 1996-10-21 Anordning för att kunna lägesinställa och fasthålla minst ett mikrobyggblock såsom ett chip eller liknande på ett bärarmaterial SE510314C2 (sv)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE9603864A SE510314C2 (sv) 1996-10-21 1996-10-21 Anordning för att kunna lägesinställa och fasthålla minst ett mikrobyggblock såsom ett chip eller liknande på ett bärarmaterial
TW086115245A TW357425B (en) 1996-10-21 1997-10-16 Method and device for positioning and retaining micro-building-blocks
JP51928498A JP2001504271A (ja) 1996-10-21 1997-10-17 マイクロ構築ブロック位置決めおよび保持のための方法および装置
DE69730338T DE69730338T2 (de) 1996-10-21 1997-10-17 Vorrichtung zur einstellung und haltung von mikromodulen
EP97910667A EP0933012B1 (en) 1996-10-21 1997-10-17 Device for positioning and retaining micro-building-blocks
AU47972/97A AU4797297A (en) 1996-10-21 1997-10-17 Method and device for positioning and retaining micro-building-blocks
KR1019990703411A KR20000052643A (ko) 1996-10-21 1997-10-17 마이크로-내장-블록을 위치설정하고 유지하는 방법 및 장치
CN97199007A CN1112085C (zh) 1996-10-21 1997-10-17 定位和保持微组件块的方法和装置
CA002269523A CA2269523A1 (en) 1996-10-21 1997-10-17 Method and device for positioning and retaining micro-building-blocks
PCT/SE1997/001745 WO1998018304A1 (en) 1996-10-21 1997-10-17 Method and device for positioning and retaining micro-building-blocks
US08/954,731 US6137172A (en) 1996-10-21 1997-10-20 Method and device for positioning and retaining micro-building-blocks
HK00102678A HK1023685A1 (en) 1996-10-21 2000-05-03 Method and device for positioning and retaining microbuilding-blocks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9603864A SE510314C2 (sv) 1996-10-21 1996-10-21 Anordning för att kunna lägesinställa och fasthålla minst ett mikrobyggblock såsom ett chip eller liknande på ett bärarmaterial

Publications (3)

Publication Number Publication Date
SE9603864D0 SE9603864D0 (sv) 1996-10-21
SE9603864L true SE9603864L (sv) 1998-04-22
SE510314C2 SE510314C2 (sv) 1999-05-10

Family

ID=20404337

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9603864A SE510314C2 (sv) 1996-10-21 1996-10-21 Anordning för att kunna lägesinställa och fasthålla minst ett mikrobyggblock såsom ett chip eller liknande på ett bärarmaterial

Country Status (12)

Country Link
US (1) US6137172A (sv)
EP (1) EP0933012B1 (sv)
JP (1) JP2001504271A (sv)
KR (1) KR20000052643A (sv)
CN (1) CN1112085C (sv)
AU (1) AU4797297A (sv)
CA (1) CA2269523A1 (sv)
DE (1) DE69730338T2 (sv)
HK (1) HK1023685A1 (sv)
SE (1) SE510314C2 (sv)
TW (1) TW357425B (sv)
WO (1) WO1998018304A1 (sv)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6433411B1 (en) * 2000-05-22 2002-08-13 Agere Systems Guardian Corp. Packaging micromechanical devices
GB2388468B (en) * 2002-02-08 2005-05-04 Microsaic Systems Ltd Microengineered electrical connectors
AU2003219352A1 (en) * 2002-04-11 2003-10-20 Koninklijke Philips Electronics N.V. Electronic device and method of manufacturing same
US6763156B2 (en) * 2002-06-12 2004-07-13 Mcnc Flexible optoelectronic circuit and associated method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3568012A (en) * 1968-11-05 1971-03-02 Westinghouse Electric Corp A microminiature circuit device employing a low thermal expansion binder
US4435724A (en) * 1981-09-10 1984-03-06 Wells Electronics, Inc. Single piece carrier for integrated circuit devices
US4433886A (en) * 1981-12-17 1984-02-28 Elco Corporation Connector mounting for integrated circuit chip packages
SE506163C2 (sv) * 1995-04-27 1997-11-17 Ericsson Telefon Ab L M Anordning vid ett kiselsubstrat med ett urtag för upptagande av ett element jämte förfarande för framställande av en dylik anordning

Also Published As

Publication number Publication date
CN1112085C (zh) 2003-06-18
US6137172A (en) 2000-10-24
HK1023685A1 (en) 2000-09-15
JP2001504271A (ja) 2001-03-27
WO1998018304A1 (en) 1998-04-30
SE9603864D0 (sv) 1996-10-21
CN1234173A (zh) 1999-11-03
TW357425B (en) 1999-05-01
DE69730338T2 (de) 2005-09-08
KR20000052643A (ko) 2000-08-25
AU4797297A (en) 1998-05-15
SE510314C2 (sv) 1999-05-10
EP0933012A1 (en) 1999-08-04
DE69730338D1 (de) 2004-09-23
CA2269523A1 (en) 1998-04-30
EP0933012B1 (en) 2004-08-18

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