CN1234173A - 定位和保持微组件块的方法和装置 - Google Patents

定位和保持微组件块的方法和装置 Download PDF

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CN1234173A
CN1234173A CN97199007A CN97199007A CN1234173A CN 1234173 A CN1234173 A CN 1234173A CN 97199007 A CN97199007 A CN 97199007A CN 97199007 A CN97199007 A CN 97199007A CN 1234173 A CN1234173 A CN 1234173A
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micro
building
blocks
chip
carrier material
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CN97199007A
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CN1112085C (zh
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Y·贝克隆德
C·斯特兰德曼
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Telefonaktiebolaget LM Ericsson AB
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Telefonaktiebolaget LM Ericsson AB
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/002—Aligning microparts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/008—Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/05—Aligning components to be assembled
    • B81C2203/051—Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conveying And Assembling Of Building Elements In Situ (AREA)

Abstract

为了简化处理和安装芯片或片式结构/微小块,开发出一种方法和装置,根据应用的领域,可以组装一个或多个芯片,使它们一起工作,和/或使它们与其它片式结构如组装元件或微光学元件等一起工作。利用横跨在载体材料(3)中的孔或凹腔(2)上的微机械舌片(4)实际保持微组件块(1)。硅舌片例如可以是可弯曲且相当牢固的,以保持芯片。以此方式,确保实现精确地垂直和水平定位且机械保持。到芯片的电连接可利用薄膜技术或更常规的键合引线实现。

Description

定位和保持微组件块的方法和装置
本发明涉及一种定位和保持微组件块的方法及定位和保持微组件块的装置，述语“微组件块”包括电子微电路元件/芯片、微机械元件和光元件。
在光电子领域里，人们对微观力学和微结构技术的兴趣日益浓厚。该兴趣源于目前可以高精度地制造微机械结构的认识。微机械结构可以提供元件的精确定位。例如，可以利用在硅中腐蚀的V形槽实现光纤的对准。利用微结构还可以在混合安装光元件和用于改变光的角度的微机械镜面时实现对准。还已知利用小的机械支架可以在硅衬底中的V形槽内牢固地支撑和导向光纤(见瑞典专利申请95015915)。
为了简化芯片或片式结构/微小块的处理和安装，已开发出一种方法和装置，其中根据应用的领域，可以组装一个或多个芯片，以便它们一起和/或它们与如微机械组件元件或微光学元件等其它片式结构一起工作。
微组件块的实际保持的基本原则是用可以在硅中腐蚀出的微机械舌片横跨孔或凹腔(见图1)。实验表明，这些硅舌片既是可弯曲的又足够牢固，以保持例如芯片。以此方式，可以确保实现精确地垂直和水平定位及机械保持。可以利用薄膜技术或更常规的键合引线实现与芯片的电连接。
图1是根据本发明嵌入且保持在凹腔中的微组件块的局部剖面侧视图。
图2展示了利用键合引线电连接的图1中微组件块。
图3从上部展示了根据本发明的利用硅舌片嵌入并保持的微组件块。
图1-3简单地展示了如何将微组件块/芯片嵌入硅材料3中的凹腔2或孔中，其中支架结构基本上由在一侧或两侧上横跨凹腔2的微机械舌片4构成。没有舌片的相对侧5、6可以由用于准确定位芯片与凹腔底部7的参考沿/边构成。在将芯片1嵌入凹腔2时，弹性舌片4将向下弯曲，并且它们的点将芯片压靠在参考沿5、6上，从而提供芯片精确的定位和保持。另一种弹性舌片的方案，是可以使用置于底部的弹性叶片。在具有一个或多行凹腔如栅阵列的系统中，可以定位多个共同操作的微组件块，并连接它们实现协作微系统。
许多接触方法都是可以的。图2示出了如何利用键合引线8，但也可以利用薄膜技术，这是由于该组装方法使芯片与具有导体图形的外围衬底处于同一层面。
在例如电子元件、光学元件和机械元件的混合模式中，由于重点在于提高“芯片级”不同功能的集成度，所以根据本发明的安装方法相当重要。但仍没有真正很好的集成方法，并且很难在同一衬底上制造集成微系统。利用根据本发明的微系统，通过现有的方法可以分别制造系统的不同部件，并然后将它们聚在一起并置入载体材料的各凹腔中。通过以此方式将芯片组装在一起，可以进一步精确限定电源线和接触表面的设计和形状规则。
利用安装光元件/光芯片的凹腔，可以无源地(passively)与相对于凹腔光刻限定的波导对准。以相同的方式，光元件可以无源地与载体中光刻限定的导向结构中的光纤对准。
由通过多条引线连接在一起的多个芯片构成的多芯片组件(MCM)可以为具有多个凹腔的载体所取代，所说载体中分立芯片通过光刻限定法或薄膜技术设置成依次连接在一起。利用这种技术，可以建立芯片结构的栅阵列，并将它们连接在一起。从而提供具有可分别替换的微组件块的相当复杂的系统。凹腔结构还可以用作MCM芯片的测试夹具，使MCM的整个芯片组可以在利用每个芯片都有自已预定位置的凹腔结构安装之前进行测试。适于这种目的的连接夹具可暂时连接所有芯片，以便可以进行电学评估。
可以利用塑料特别是所谓的复制塑料(replicated plastic)代替硅作载体材料，从而可以提供利用其精确限定的参考沿和其底部，用或不用两凹腔之间载体材料表面的波导/光纤的镶嵌沟槽，相当好地将微组件块组固定就位。在利用复制塑料制造载体材料时，可以用设置于塑料中的非弹性作用形变突点代替弹性元件作用于芯片上，从而在将芯片压到凹腔中时将安装的芯片固定于参考沿上。

Claims (10)

1·在载体材料中设置至少一个微组件块如芯片等的方法，其特征在于，在载体材料中设置至少一个具有定位装置和保持微组件块的装置的空间，将微组件块设置于凹腔中，由此进行精确地定位。
2·在载体材料中设置至少一个微组件块如芯片等的装置，其特征在于，在至少一个设置的空间(2)中的载体材料(3)中，设置有定位装置(5,6)和保持微组件块(1)的装置(4)，由此在该空间设置微组件块(1)时，精确定位和保持微组件块。
3·根据权利要求2的装置，其特征在于，如果有多个空间，则各空间设置成一行或构成栅阵列的多个平行行。
4·根据权利要求2或3的装置，其特征在于，定位装置包括空间(2)的一个壁(5)或彼此成一定角度的两个壁(5,6)及底部(7)。
5·根据权利要求2或3的装置，其特征在于，保持装置包括用于将微组件(1)压靠到一个壁(5)或多个壁(5,6)上的一个或多个装置(4)。
6·根据权利要求4或5的装置，其特征在于，设置非弹性作用形变突点以将微组件块安装于一个或多个壁上。
7·根据权利要求2或3的装置，其特征在于，载体材料上设置有电连接到一个或多个微组件块的装置(8)。
8·根据权利要求2或3的装置，其特征在于，载体材料上设置有光学连接到一个或多个微组件块的装置。
9·根据权利要求2-8的装置，其特征在于，载体材料(3)是具有一个或多个腐蚀出的空间(2)的类型的硅。
10·根据权利要求2-8的装置，其特征在于，载体材料(3)由如复制塑料等的具有一个或多个空间(2)的塑料材料构成。
CN97199007A 1996-10-21 1997-10-17 定位和保持微组件块的方法和装置 Expired - Fee Related CN1112085C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9603864A SE510314C2 (sv) 1996-10-21 1996-10-21 Anordning för att kunna lägesinställa och fasthålla minst ett mikrobyggblock såsom ett chip eller liknande på ett bärarmaterial
SE96038641 1996-10-21

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CN1234173A true CN1234173A (zh) 1999-11-03
CN1112085C CN1112085C (zh) 2003-06-18

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US (1) US6137172A (zh)
EP (1) EP0933012B1 (zh)
JP (1) JP2001504271A (zh)
KR (1) KR20000052643A (zh)
CN (1) CN1112085C (zh)
AU (1) AU4797297A (zh)
CA (1) CA2269523A1 (zh)
DE (1) DE69730338T2 (zh)
HK (1) HK1023685A1 (zh)
SE (1) SE510314C2 (zh)
TW (1) TW357425B (zh)
WO (1) WO1998018304A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100459116C (zh) * 2002-04-11 2009-02-04 皇家飞利浦电子股份有限公司 电子器件及其制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6433411B1 (en) * 2000-05-22 2002-08-13 Agere Systems Guardian Corp. Packaging micromechanical devices
GB2388468B (en) * 2002-02-08 2005-05-04 Microsaic Systems Ltd Microengineered electrical connectors
US6763156B2 (en) * 2002-06-12 2004-07-13 Mcnc Flexible optoelectronic circuit and associated method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3568012A (en) * 1968-11-05 1971-03-02 Westinghouse Electric Corp A microminiature circuit device employing a low thermal expansion binder
US4435724A (en) * 1981-09-10 1984-03-06 Wells Electronics, Inc. Single piece carrier for integrated circuit devices
US4433886A (en) * 1981-12-17 1984-02-28 Elco Corporation Connector mounting for integrated circuit chip packages
SE506163C2 (sv) * 1995-04-27 1997-11-17 Ericsson Telefon Ab L M Anordning vid ett kiselsubstrat med ett urtag för upptagande av ett element jämte förfarande för framställande av en dylik anordning

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100459116C (zh) * 2002-04-11 2009-02-04 皇家飞利浦电子股份有限公司 电子器件及其制造方法

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CN1112085C (zh) 2003-06-18
US6137172A (en) 2000-10-24
SE9603864L (sv) 1998-04-22
HK1023685A1 (en) 2000-09-15
JP2001504271A (ja) 2001-03-27
WO1998018304A1 (en) 1998-04-30
SE9603864D0 (sv) 1996-10-21
TW357425B (en) 1999-05-01
DE69730338T2 (de) 2005-09-08
KR20000052643A (ko) 2000-08-25
AU4797297A (en) 1998-05-15
SE510314C2 (sv) 1999-05-10
EP0933012A1 (en) 1999-08-04
DE69730338D1 (de) 2004-09-23
CA2269523A1 (en) 1998-04-30
EP0933012B1 (en) 2004-08-18

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