SE9403574D0 - Optokomponentkapsel med optiskt gränssnitt - Google Patents
Optokomponentkapsel med optiskt gränssnittInfo
- Publication number
- SE9403574D0 SE9403574D0 SE9403574A SE9403574A SE9403574D0 SE 9403574 D0 SE9403574 D0 SE 9403574D0 SE 9403574 A SE9403574 A SE 9403574A SE 9403574 A SE9403574 A SE 9403574A SE 9403574 D0 SE9403574 D0 SE 9403574D0
- Authority
- SE
- Sweden
- Prior art keywords
- optocomponent
- capsule
- pct
- cavities
- guide pins
- Prior art date
Links
- 239000002775 capsule Substances 0.000 title abstract 4
- 230000003287 optical effect Effects 0.000 title abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 238000000465 moulding Methods 0.000 abstract 3
- 229920003023 plastic Polymers 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 210000002105 tongue Anatomy 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0033—Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Coupling Of Light Guides (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Optical Couplings Of Light Guides (AREA)
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9403574A SE9403574L (sv) | 1994-10-19 | 1994-10-19 | Optokomponentkapsel med optiskt gränssnitt |
ES95936160T ES2153500T3 (es) | 1994-10-19 | 1995-10-19 | Capsula para optocomponente con interfaz optica. |
JP8513830A JPH10507848A (ja) | 1994-10-19 | 1995-10-19 | オプチカルインターフェースを有する光素子カプセル |
CA002203112A CA2203112C (en) | 1994-10-19 | 1995-10-19 | Optocomponent capsule having an optical interface |
DE69519938T DE69519938T2 (de) | 1994-10-19 | 1995-10-19 | Kapsel für ein optoelektrisches bauelement mit einer optischen schnittstelle |
AU38200/95A AU3820095A (en) | 1994-10-19 | 1995-10-19 | Optocomponent capsule having an optical interface |
US08/817,422 US5985185A (en) | 1994-10-19 | 1995-10-19 | Optocomponent capsule having an optical interface |
CN95196848A CN1107982C (zh) | 1994-10-19 | 1995-10-19 | 制造封装光学部件的方法和该光学部件 |
KR1019970702589A KR100272031B1 (ko) | 1994-10-19 | 1995-10-19 | 광학 인터패이스를 갖는 광소자 캡슐 |
PCT/SE1995/001233 WO1996013069A1 (en) | 1994-10-19 | 1995-10-19 | Optocomponent capsule having an optical interface |
EP95936160A EP0787358B1 (en) | 1994-10-19 | 1995-10-19 | Optocomponent capsule having an optical interface |
FI971656A FI971656A (sv) | 1994-10-19 | 1997-04-18 | Optokomponentkapsel som har en optisk gränsyta |
HK98109027A HK1007904A1 (en) | 1994-10-19 | 1998-07-08 | Optocomponent capsule having an optical interface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9403574A SE9403574L (sv) | 1994-10-19 | 1994-10-19 | Optokomponentkapsel med optiskt gränssnitt |
Publications (2)
Publication Number | Publication Date |
---|---|
SE9403574D0 true SE9403574D0 (sv) | 1994-10-19 |
SE9403574L SE9403574L (sv) | 1996-04-20 |
Family
ID=20395668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9403574A SE9403574L (sv) | 1994-10-19 | 1994-10-19 | Optokomponentkapsel med optiskt gränssnitt |
Country Status (13)
Country | Link |
---|---|
US (1) | US5985185A (sv) |
EP (1) | EP0787358B1 (sv) |
JP (1) | JPH10507848A (sv) |
KR (1) | KR100272031B1 (sv) |
CN (1) | CN1107982C (sv) |
AU (1) | AU3820095A (sv) |
CA (1) | CA2203112C (sv) |
DE (1) | DE69519938T2 (sv) |
ES (1) | ES2153500T3 (sv) |
FI (1) | FI971656A (sv) |
HK (1) | HK1007904A1 (sv) |
SE (1) | SE9403574L (sv) |
WO (1) | WO1996013069A1 (sv) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE514116C2 (sv) * | 1994-10-19 | 2001-01-08 | Ericsson Telefon Ab L M | Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform |
SE9403575L (sv) * | 1994-10-19 | 1996-04-20 | Ericsson Telefon Ab L M | Benram för kapslad optokomponent |
SE516160C2 (sv) | 1995-04-28 | 2001-11-26 | Ericsson Telefon Ab L M | Kapslad optoelektronisk komponent |
SE9900578L (sv) * | 1999-02-19 | 2000-06-26 | Ericsson Telefon Ab L M | Fjäderklämma |
US6306331B1 (en) * | 1999-03-24 | 2001-10-23 | International Business Machines Corporation | Ultra mold for encapsulating very thin packages |
US6547452B1 (en) | 2000-05-11 | 2003-04-15 | International Business Machines Corporation | Alignment systems for subassemblies of overmolded optoelectronic modules |
WO2001093648A2 (en) * | 2000-05-31 | 2001-12-06 | Honeywell International Inc. | Filling device |
JP4182631B2 (ja) | 2000-09-11 | 2008-11-19 | 沖電気工業株式会社 | 光学装置 |
FR2815139A1 (fr) * | 2000-10-10 | 2002-04-12 | Commissariat Energie Atomique | Procede et dispositif d'alignement passif d'un connecteur optique multifibres et d'un composant optique |
US7010232B1 (en) * | 2000-12-20 | 2006-03-07 | Cisco Technology, Inc. | Removable optical interface modules |
US6799902B2 (en) | 2000-12-26 | 2004-10-05 | Emcore Corporation | Optoelectronic mounting structure |
US6583762B2 (en) | 2001-01-11 | 2003-06-24 | The Furukawa Electric Co., Ltd. | Chip antenna and method of manufacturing the same |
US7275925B2 (en) * | 2001-08-30 | 2007-10-02 | Micron Technology, Inc. | Apparatus for stereolithographic processing of components and assemblies |
US6908232B2 (en) * | 2003-03-21 | 2005-06-21 | Agilent Technologies, Inc. | Fiber optic connectors and methods of making the same |
KR101232505B1 (ko) * | 2005-06-30 | 2013-02-12 | 엘지디스플레이 주식회사 | 발광다이오드 패키지 제조방법, 백라이트 유닛 및액정표시장치 |
US20090245736A1 (en) * | 2008-03-31 | 2009-10-01 | Ahadian Joseph F | Connector attachment to a low height profile module |
CN102230991B (zh) * | 2009-10-23 | 2013-01-09 | 鸿富锦精密工业(深圳)有限公司 | 光纤耦合连接器 |
CN102189636A (zh) * | 2010-03-05 | 2011-09-21 | 杨承佳 | 具有立体标帜的壳体及其制法 |
EP2428828B1 (en) * | 2010-09-13 | 2016-06-29 | Tyco Electronics Svenska Holdings AB | Miniaturized high speed optical module |
KR101273091B1 (ko) * | 2010-11-09 | 2013-06-10 | 엘지이노텍 주식회사 | 모세관 로딩 장치 |
US8596886B2 (en) * | 2011-09-07 | 2013-12-03 | The Boeing Company | Hermetic small form factor optical device packaging for plastic optical fiber networks |
CN103777286B (zh) * | 2012-10-23 | 2017-08-04 | 赛恩倍吉科技顾问(深圳)有限公司 | 光电转换模组 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0053483B1 (en) * | 1980-11-28 | 1985-10-02 | Kabushiki Kaisha Toshiba | Method for manufacturing a module for a fiber optic link |
DE3124020C2 (de) * | 1981-06-19 | 1983-05-19 | Festo-Maschinenfabrik Gottlieb Stoll, 7300 Esslingen | Adapterblock zur Anwendung in der Fluid-Technik sowie Verfahren zur Herstellung eines derartigen Adapterblocks |
CA1302758C (en) * | 1986-11-15 | 1992-06-09 | Sumitomo Electric Industries, Ltd. | Optical connector and process for producing the same |
US5133921A (en) * | 1987-12-31 | 1992-07-28 | Sanken Electric Co., Ltd. | Method for manufacturing plastic encapsulated electronic semiconductor devices |
JP2744273B2 (ja) * | 1988-02-09 | 1998-04-28 | キヤノン株式会社 | 光電変換装置の製造方法 |
US5199093A (en) * | 1990-05-22 | 1993-03-30 | Bicc Plc. | Multi-part optical fibre connectors |
EP0484180A1 (en) * | 1990-11-01 | 1992-05-06 | Fujitsu Limited | Packaged semiconductor device having an optimized heat dissipation |
JPH04239614A (ja) * | 1991-01-23 | 1992-08-27 | Sumitomo Electric Ind Ltd | 光モジュールの製造方法 |
JPH0531077A (ja) * | 1991-02-15 | 1993-02-09 | Toomee:Kk | 眼球観察装置 |
AU635172B2 (en) * | 1991-05-13 | 1993-03-11 | Nippon Telegraph & Telephone Corporation | Multifiber optical connector plug with low reflection and low insertion loss |
US5259050A (en) * | 1991-09-04 | 1993-11-02 | The Furukawa Electric Co., Ltd. | Multicore optical connector with partitions to separate the optical fibers into groups |
US5391346A (en) * | 1991-11-20 | 1995-02-21 | Rohm Co., Ltd. | Method for making molded photointerrupters |
US5286426A (en) * | 1992-04-01 | 1994-02-15 | Allegro Microsystems, Inc. | Assembling a lead frame between a pair of molding cavity plates |
DE4300652C1 (de) * | 1993-01-13 | 1994-03-31 | Bosch Gmbh Robert | Verfahren zur Herstellung einer hybrid integrierten optischen Schaltung und Vorrichtung zur Emission von Lichtwellen |
US5420954A (en) * | 1993-05-24 | 1995-05-30 | Photonics Research Incorporated | Parallel optical interconnect |
EP0635741B1 (en) * | 1993-07-19 | 2002-11-13 | Motorola, Inc. | Optoelectronic interface and method of making |
US5482658A (en) * | 1993-08-13 | 1996-01-09 | Motorola, Inc. | Method of making an optoelectronic interface module |
SE503905C2 (sv) * | 1994-03-16 | 1996-09-30 | Ericsson Telefon Ab L M | Förfarande för framställning av en optokomponent samt optokomponent |
SE513183C2 (sv) * | 1994-03-18 | 2000-07-24 | Ericsson Telefon Ab L M | Förfarande för framställning av en optokomponent samt kapslad optokomponent |
US5774614A (en) * | 1996-07-16 | 1998-06-30 | Gilliland; Patrick B. | Optoelectronic coupling and method of making same |
-
1994
- 1994-10-19 SE SE9403574A patent/SE9403574L/sv not_active Application Discontinuation
-
1995
- 1995-10-19 JP JP8513830A patent/JPH10507848A/ja active Pending
- 1995-10-19 ES ES95936160T patent/ES2153500T3/es not_active Expired - Lifetime
- 1995-10-19 KR KR1019970702589A patent/KR100272031B1/ko not_active IP Right Cessation
- 1995-10-19 EP EP95936160A patent/EP0787358B1/en not_active Expired - Lifetime
- 1995-10-19 CN CN95196848A patent/CN1107982C/zh not_active Expired - Fee Related
- 1995-10-19 US US08/817,422 patent/US5985185A/en not_active Expired - Lifetime
- 1995-10-19 WO PCT/SE1995/001233 patent/WO1996013069A1/en active IP Right Grant
- 1995-10-19 CA CA002203112A patent/CA2203112C/en not_active Expired - Fee Related
- 1995-10-19 DE DE69519938T patent/DE69519938T2/de not_active Expired - Fee Related
- 1995-10-19 AU AU38200/95A patent/AU3820095A/en not_active Abandoned
-
1997
- 1997-04-18 FI FI971656A patent/FI971656A/sv not_active IP Right Cessation
-
1998
- 1998-07-08 HK HK98109027A patent/HK1007904A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1007904A1 (en) | 1999-04-30 |
US5985185A (en) | 1999-11-16 |
EP0787358B1 (en) | 2001-01-17 |
EP0787358A1 (en) | 1997-08-06 |
CA2203112A1 (en) | 1996-05-02 |
WO1996013069A1 (en) | 1996-05-02 |
KR100272031B1 (ko) | 2000-11-15 |
SE9403574L (sv) | 1996-04-20 |
CA2203112C (en) | 2005-04-19 |
AU3820095A (en) | 1996-05-15 |
DE69519938T2 (de) | 2001-05-17 |
FI971656A0 (sv) | 1997-04-18 |
ES2153500T3 (es) | 2001-03-01 |
CN1107982C (zh) | 2003-05-07 |
CN1170475A (zh) | 1998-01-14 |
DE69519938D1 (de) | 2001-02-22 |
JPH10507848A (ja) | 1998-07-28 |
FI971656A (sv) | 1997-06-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
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