ES2153500T3 - Capsula para optocomponente con interfaz optica. - Google Patents

Capsula para optocomponente con interfaz optica.

Info

Publication number
ES2153500T3
ES2153500T3 ES95936160T ES95936160T ES2153500T3 ES 2153500 T3 ES2153500 T3 ES 2153500T3 ES 95936160 T ES95936160 T ES 95936160T ES 95936160 T ES95936160 T ES 95936160T ES 2153500 T3 ES2153500 T3 ES 2153500T3
Authority
ES
Spain
Prior art keywords
component
mold
holes
capsule
optocomponent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95936160T
Other languages
English (en)
Inventor
Odd Steijer
Hans-Christer Moll
Paul Eriksen
Jan-Aake Engstrand
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of ES2153500T3 publication Critical patent/ES2153500T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0033—Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

EN LA ENCAPSULACION DE UN OPTOCOMPONENTE CON UN MATERIAL DE PLASTICO SE OBTIENE UNA INTERFAZ COMPATIBLE CON UN CONECTOR MT QUE TIENE ORIFICIOS (107) PARA VARILLAS DE GUIA EN LA PARED DE LA CAPSULA Y SUPERFICIES DE CONEXION OPTICA (110). ESTOS ORIFICIOS (107) SON OBTENIDOS A PARTIR DE VARILLAS DE GUIA DE LA CAVIDAD DEL MOLDE QUE SON UTILIZADAS PARA ALINEAR EL OPTOCOMPONENTE EN UNA CAVIDAD DE UN MOLDE EN LA OPERACION DE MOLDEADO DEL MATERIAL DE ENCAPSULAMIENTO SOBRE LA PARTE SUPERIOR DEL COMPONENTE. PARA CONSEGUIR UNA BUENA EXACTITUD EN EL POSICIONAMIENTO DEL COMPONENTE DURANTE LA OPERACION DE MOLDEADO LAS VARILLAS DE GUIA DEL MOLDE SON TAN CORTAS COMO SEA POSIBLE Y FINALIZAN DIRECTAMENTE POR DETRAS DEL COMPONENTE EN EL QUE ESTAN SOPORTADAS MEDIANTE PROYECCIONES QUE SE EXTIENDEN DESDE CADA MITAD DEL MOLDE. DE ESTA FORMA SE CREAN LAS CAVIDADES (109) QUE SE EXTIENDEN RECTAS A TRAVES DE LA CAPSULA (105) POR DETRAS DEL COMPONENTE. LAS CAVIDADES (109) PERMITEN QUE LOS ORIFICIOS DE GUIA (107) ESTENLIMPIOS Y QUE LOS RESIDUOS DEL MATERIAL SEAN ELIMINADOS DESPUES DE LA OPERACION DE MOLDEADO. ADEMAS, LAS CAVIDADES (109) PUEDEN UTILIZARSE PARA DISPOSITIVOS DE SUJECION DE MUELLE QUE SON UTILIZADOS PARA RETENER LA CAPSULA DEL OPTOCOMPONENTE (105) EN UN CONECTOR OPTICO QUE TENGA UNA INTERFAZ SIMILAR. LOS DISPOSITIVOS DE SUJECION PUEDEN TENER LENGUETAS QUE ESTAN INSERTADAS EN LAS CAVIDADES (109) Y QUE ADEMAS, PUEDEN ESTAR PROVISTAS DE ORIFICIOS, A TRAVES DE LOS CUALES PUEDEN EMPUJARSE LAS VARILLAS DE GUIA PARA PROTEGER EL DISPOSITIVO DE SUJECION EVITANDO QUE SE AFLOJE.
ES95936160T 1994-10-19 1995-10-19 Capsula para optocomponente con interfaz optica. Expired - Lifetime ES2153500T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9403574A SE9403574L (sv) 1994-10-19 1994-10-19 Optokomponentkapsel med optiskt gränssnitt

Publications (1)

Publication Number Publication Date
ES2153500T3 true ES2153500T3 (es) 2001-03-01

Family

ID=20395668

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95936160T Expired - Lifetime ES2153500T3 (es) 1994-10-19 1995-10-19 Capsula para optocomponente con interfaz optica.

Country Status (13)

Country Link
US (1) US5985185A (es)
EP (1) EP0787358B1 (es)
JP (1) JPH10507848A (es)
KR (1) KR100272031B1 (es)
CN (1) CN1107982C (es)
AU (1) AU3820095A (es)
CA (1) CA2203112C (es)
DE (1) DE69519938T2 (es)
ES (1) ES2153500T3 (es)
FI (1) FI971656A (es)
HK (1) HK1007904A1 (es)
SE (1) SE9403574L (es)
WO (1) WO1996013069A1 (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
SE9403575L (sv) * 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent
SE516160C2 (sv) 1995-04-28 2001-11-26 Ericsson Telefon Ab L M Kapslad optoelektronisk komponent
SE9900578L (sv) * 1999-02-19 2000-06-26 Ericsson Telefon Ab L M Fjäderklämma
US6306331B1 (en) * 1999-03-24 2001-10-23 International Business Machines Corporation Ultra mold for encapsulating very thin packages
US6547452B1 (en) 2000-05-11 2003-04-15 International Business Machines Corporation Alignment systems for subassemblies of overmolded optoelectronic modules
DE10196259T1 (de) * 2000-05-31 2003-05-15 Honeywell Int Inc Füllverfahren
JP4182631B2 (ja) 2000-09-11 2008-11-19 沖電気工業株式会社 光学装置
FR2815139A1 (fr) * 2000-10-10 2002-04-12 Commissariat Energie Atomique Procede et dispositif d'alignement passif d'un connecteur optique multifibres et d'un composant optique
US7010232B1 (en) * 2000-12-20 2006-03-07 Cisco Technology, Inc. Removable optical interface modules
US6799902B2 (en) 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
KR100849046B1 (ko) * 2001-01-11 2008-07-30 후루까와덴끼고오교 가부시끼가이샤 칩 안테나 및 그 제조방법
US7275925B2 (en) * 2001-08-30 2007-10-02 Micron Technology, Inc. Apparatus for stereolithographic processing of components and assemblies
US6908232B2 (en) * 2003-03-21 2005-06-21 Agilent Technologies, Inc. Fiber optic connectors and methods of making the same
KR101232505B1 (ko) * 2005-06-30 2013-02-12 엘지디스플레이 주식회사 발광다이오드 패키지 제조방법, 백라이트 유닛 및액정표시장치
US20090245736A1 (en) * 2008-03-31 2009-10-01 Ahadian Joseph F Connector attachment to a low height profile module
CN102230991B (zh) * 2009-10-23 2013-01-09 鸿富锦精密工业（深圳）有限公司 光纤耦合连接器
CN102189636A (zh) * 2010-03-05 2011-09-21 杨承佳 具有立体标帜的壳体及其制法
EP2428828B1 (en) * 2010-09-13 2016-06-29 Tyco Electronics Svenska Holdings AB Miniaturized high speed optical module
KR101273091B1 (ko) * 2010-11-09 2013-06-10 엘지이노텍 주식회사 모세관 로딩 장치
US8596886B2 (en) * 2011-09-07 2013-12-03 The Boeing Company Hermetic small form factor optical device packaging for plastic optical fiber networks
CN103777286B (zh) * 2012-10-23 2017-08-04 赛恩倍吉科技顾问（深圳）有限公司 光电转换模组

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3172553D1 (en) * 1980-11-28 1985-11-07 Toshiba Kk Method for manufacturing a module for a fiber optic link
DE3124020C2 (de) * 1981-06-19 1983-05-19 Festo-Maschinenfabrik Gottlieb Stoll, 7300 Esslingen Adapterblock zur Anwendung in der Fluid-Technik sowie Verfahren zur Herstellung eines derartigen Adapterblocks
EP0405620B1 (en) * 1986-11-15 1996-05-15 Sumitomo Electric Industries Limited Process for producing an optical connector
US5133921A (en) * 1987-12-31 1992-07-28 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
JP2744273B2 (ja) * 1988-02-09 1998-04-28 キヤノン株式会社 光電変換装置の製造方法
US5199093A (en) * 1990-05-22 1993-03-30 Bicc Plc. Multi-part optical fibre connectors
EP0484180A1 (en) * 1990-11-01 1992-05-06 Fujitsu Limited Packaged semiconductor device having an optimized heat dissipation
JPH04239614A (ja) * 1991-01-23 1992-08-27 Sumitomo Electric Ind Ltd 光モジュールの製造方法
JPH0531077A (ja) * 1991-02-15 1993-02-09 Toomee:Kk 眼球観察装置
AU635172B2 (en) * 1991-05-13 1993-03-11 Nippon Telegraph & Telephone Corporation Multifiber optical connector plug with low reflection and low insertion loss
US5259050A (en) * 1991-09-04 1993-11-02 The Furukawa Electric Co., Ltd. Multicore optical connector with partitions to separate the optical fibers into groups
US5391346A (en) * 1991-11-20 1995-02-21 Rohm Co., Ltd. Method for making molded photointerrupters
US5286426A (en) * 1992-04-01 1994-02-15 Allegro Microsystems, Inc. Assembling a lead frame between a pair of molding cavity plates
DE4300652C1 (de) * 1993-01-13 1994-03-31 Bosch Gmbh Robert Verfahren zur Herstellung einer hybrid integrierten optischen Schaltung und Vorrichtung zur Emission von Lichtwellen
US5420954A (en) * 1993-05-24 1995-05-30 Photonics Research Incorporated Parallel optical interconnect
EP0635741B1 (en) * 1993-07-19 2002-11-13 Motorola, Inc. Optoelectronic interface and method of making
US5482658A (en) * 1993-08-13 1996-01-09 Motorola, Inc. Method of making an optoelectronic interface module
SE503905C2 (sv) * 1994-03-16 1996-09-30 Ericsson Telefon Ab L M Förfarande för framställning av en optokomponent samt optokomponent
SE513183C2 (sv) * 1994-03-18 2000-07-24 Ericsson Telefon Ab L M Förfarande för framställning av en optokomponent samt kapslad optokomponent
US5774614A (en) * 1996-07-16 1998-06-30 Gilliland; Patrick B. Optoelectronic coupling and method of making same

Also Published As

Publication number Publication date
DE69519938T2 (de) 2001-05-17
DE69519938D1 (de) 2001-02-22
US5985185A (en) 1999-11-16
SE9403574L (sv) 1996-04-20
EP0787358B1 (en) 2001-01-17
FI971656A (fi) 1997-06-19
JPH10507848A (ja) 1998-07-28
FI971656A0 (fi) 1997-04-18
EP0787358A1 (en) 1997-08-06
AU3820095A (en) 1996-05-15
WO1996013069A1 (en) 1996-05-02
SE9403574D0 (sv) 1994-10-19
HK1007904A1 (en) 1999-04-30
KR100272031B1 (ko) 2000-11-15
CN1107982C (zh) 2003-05-07
CA2203112C (en) 2005-04-19
CN1170475A (zh) 1998-01-14
CA2203112A1 (en) 1996-05-02

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