SE9200555D0 - A method of coating a piezoelectric substrate - Google Patents

A method of coating a piezoelectric substrate

Info

Publication number
SE9200555D0
SE9200555D0 SE9200555A SE9200555A SE9200555D0 SE 9200555 D0 SE9200555 D0 SE 9200555D0 SE 9200555 A SE9200555 A SE 9200555A SE 9200555 A SE9200555 A SE 9200555A SE 9200555 D0 SE9200555 D0 SE 9200555D0
Authority
SE
Sweden
Prior art keywords
pct
semi
conducting material
date sep
substrate
Prior art date
Application number
SE9200555A
Other languages
English (en)
Swedish (sv)
Inventor
J Vonasek
Original Assignee
Markpoint Dev Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Markpoint Dev Ab filed Critical Markpoint Dev Ab
Priority to SE9200555A priority Critical patent/SE9200555D0/xx
Publication of SE9200555D0 publication Critical patent/SE9200555D0/xx
Priority to US08/290,975 priority patent/US5518952A/en
Priority to EP93905696A priority patent/EP0628091B1/en
Priority to JP5514732A priority patent/JPH07504535A/ja
Priority to DE69302569T priority patent/DE69302569T2/de
Priority to PCT/SE1993/000072 priority patent/WO1993017147A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1606—Coating the nozzle area or the ink chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B41J2002/14225—Finger type piezoelectric element on only one side of the chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SE9200555A 1992-02-25 1992-02-25 A method of coating a piezoelectric substrate SE9200555D0 (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE9200555A SE9200555D0 (sv) 1992-02-25 1992-02-25 A method of coating a piezoelectric substrate
US08/290,975 US5518952A (en) 1992-02-25 1993-02-01 Method of coating a piezoelectric substrate with a semiconducting material
EP93905696A EP0628091B1 (en) 1992-02-25 1993-02-01 A method of coating a piezoelectric substrate with a semi-conducting material and a method of producing a droplet ejector arrangement including the coating method
JP5514732A JPH07504535A (ja) 1992-02-25 1993-02-01 圧電性基体を半導体材料で被覆する方法およびこの被覆方法を含む小滴エゼクタ装置の製造方法
DE69302569T DE69302569T2 (de) 1992-02-25 1993-02-01 Verfahren zur beschichtung eines piezoelektrischen substrats mit einem halbleitermaterial und verfahren zur herstellung eines tröpfchenausstosssystems mit dem beschichtungsverfahren
PCT/SE1993/000072 WO1993017147A1 (en) 1992-02-25 1993-02-01 A method of coating a piezoelectric substrate with a semi-conducting material and a method of producing a droplet ejector arrangement including the coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9200555A SE9200555D0 (sv) 1992-02-25 1992-02-25 A method of coating a piezoelectric substrate

Publications (1)

Publication Number Publication Date
SE9200555D0 true SE9200555D0 (sv) 1992-02-25

Family

ID=20385421

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9200555A SE9200555D0 (sv) 1992-02-25 1992-02-25 A method of coating a piezoelectric substrate

Country Status (6)

Country Link
US (1) US5518952A (ja)
EP (1) EP0628091B1 (ja)
JP (1) JPH07504535A (ja)
DE (1) DE69302569T2 (ja)
SE (1) SE9200555D0 (ja)
WO (1) WO1993017147A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9318985D0 (en) * 1993-09-14 1993-10-27 Xaar Ltd Passivation of ceramic piezoelectric ink jet print heads
JP3183010B2 (ja) * 1993-12-24 2001-07-03 ブラザー工業株式会社 インク噴射装置
US6367132B2 (en) * 1998-08-31 2002-04-09 Eastman Kodak Company Method of making a print head
US6503573B1 (en) 1998-09-29 2003-01-07 The United States Of America As Represented By The Secretary Of The Navy Bomb annealing of thin films
US6848773B1 (en) 2000-09-15 2005-02-01 Spectra, Inc. Piezoelectric ink jet printing module
US7052117B2 (en) 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
US7281778B2 (en) 2004-03-15 2007-10-16 Fujifilm Dimatix, Inc. High frequency droplet ejection device and method
US8491076B2 (en) 2004-03-15 2013-07-23 Fujifilm Dimatix, Inc. Fluid droplet ejection devices and methods
KR20070087223A (ko) 2004-12-30 2007-08-27 후지필름 디마틱스, 인크. 잉크 분사 프린팅
US7988247B2 (en) 2007-01-11 2011-08-02 Fujifilm Dimatix, Inc. Ejection of drops having variable drop size from an ink jet printer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4367478A (en) * 1979-04-25 1983-01-04 Xerox Corporation Pressure pulse drop ejector apparatus
JPS58219732A (ja) * 1982-06-16 1983-12-21 Tokyo Inst Of Technol フツ素含有アモルフアス半導体の製造方法
FR2555206B1 (fr) * 1983-11-22 1986-05-09 Thomson Csf Procede de depot de silicium amorphe par decomposition thermique a basse temperature et dispositif de mise en oeuvre du procede
GB2176443B (en) * 1985-06-10 1990-11-14 Canon Kk Liquid jet recording head and recording system incorporating the same
DE3630206A1 (de) * 1985-09-06 1987-03-19 Fuji Electric Co Ltd Tintenstrahldruckkopf
US4719477A (en) * 1986-01-17 1988-01-12 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
US4762808A (en) * 1987-06-22 1988-08-09 Dow Corning Corporation Method of forming semiconducting amorphous silicon films from the thermal decomposition of fluorohydridodisilanes
SE458189B (sv) * 1987-07-13 1989-03-06 Markpoint System Ab Anordning vid skrivare utnyttjande trycksatt, vaetskeformigt medium foer uppteckning av tecken paa en informationsbaerare
JP2746703B2 (ja) * 1989-11-09 1998-05-06 松下電器産業株式会社 インクジェットヘッド装置及びその製造法
WO1992010367A1 (en) * 1990-12-06 1992-06-25 Markpoint Development Ab Drop-on-demand liquid ejector arrangement

Also Published As

Publication number Publication date
US5518952A (en) 1996-05-21
DE69302569D1 (de) 1996-06-13
JPH07504535A (ja) 1995-05-18
EP0628091A1 (en) 1994-12-14
DE69302569T2 (de) 1996-11-21
EP0628091B1 (en) 1996-05-08
WO1993017147A1 (en) 1993-09-02

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