SE8506105L - Metallnet - Google Patents

Metallnet

Info

Publication number
SE8506105L
SE8506105L SE8506105A SE8506105A SE8506105L SE 8506105 L SE8506105 L SE 8506105L SE 8506105 A SE8506105 A SE 8506105A SE 8506105 A SE8506105 A SE 8506105A SE 8506105 L SE8506105 L SE 8506105L
Authority
SE
Sweden
Prior art keywords
metallnet
net
covar
wolfram
invar
Prior art date
Application number
SE8506105A
Other languages
English (en)
Other versions
SE8506105D0 (sv
SE462071B (sv
Inventor
T Hertzberg
B Ekstrom
Original Assignee
Perstorp Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perstorp Ab filed Critical Perstorp Ab
Priority to SE8506105A priority Critical patent/SE462071B/sv
Publication of SE8506105D0 publication Critical patent/SE8506105D0/sv
Priority to EP86117470A priority patent/EP0228017A3/en
Priority to JP61316035A priority patent/JPS62202585A/ja
Publication of SE8506105L publication Critical patent/SE8506105L/sv
Priority to US07/149,928 priority patent/US4824381A/en
Publication of SE462071B publication Critical patent/SE462071B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
SE8506105A 1985-12-23 1985-12-23 Moensterkort SE462071B (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE8506105A SE462071B (sv) 1985-12-23 1985-12-23 Moensterkort
EP86117470A EP0228017A3 (en) 1985-12-23 1986-12-16 Metal net
JP61316035A JPS62202585A (ja) 1985-12-23 1986-12-23 金網
US07/149,928 US4824381A (en) 1985-12-23 1988-01-29 Circuit board containing a metal net

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8506105A SE462071B (sv) 1985-12-23 1985-12-23 Moensterkort

Publications (3)

Publication Number Publication Date
SE8506105D0 SE8506105D0 (sv) 1985-12-23
SE8506105L true SE8506105L (sv) 1987-06-24
SE462071B SE462071B (sv) 1990-04-30

Family

ID=20362582

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8506105A SE462071B (sv) 1985-12-23 1985-12-23 Moensterkort

Country Status (4)

Country Link
US (1) US4824381A (sv)
EP (1) EP0228017A3 (sv)
JP (1) JPS62202585A (sv)
SE (1) SE462071B (sv)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6465895A (en) * 1987-09-07 1989-03-13 Hitachi Cable Mesh-shaped metal core substrate
US5073840A (en) * 1988-10-06 1991-12-17 Microlithics Corporation Circuit board with coated metal support structure and method for making same
US5874776A (en) * 1997-04-21 1999-02-23 International Business Machines Corporation Thermal stress relieving substrate
JP2000012724A (ja) * 1998-06-23 2000-01-14 Nitto Denko Corp ベアチップ実装用回路基板
US6613413B1 (en) * 1999-04-26 2003-09-02 International Business Machines Corporation Porous power and ground planes for reduced PCB delamination and better reliability
JP2003136623A (ja) * 2001-08-22 2003-05-14 Tdk Corp モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法
US6900708B2 (en) * 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
US7260890B2 (en) * 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
SE524631C2 (sv) * 2002-10-18 2004-09-07 Infineon Technologies Wireless Kretskortsarrangemang med förbättrad driftsäkerhet under temperaturvariationer och metod för att framställa ett sådant arrangemang
US8345433B2 (en) * 2004-07-08 2013-01-01 Avx Corporation Heterogeneous organic laminate stack ups for high frequency applications
US7439840B2 (en) 2006-06-27 2008-10-21 Jacket Micro Devices, Inc. Methods and apparatuses for high-performing multi-layer inductors
US7808434B2 (en) * 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7989895B2 (en) * 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2688582A (en) * 1952-07-31 1954-09-07 Bell Telephone Labor Inc Method of forming laminated sheets
US2962057A (en) * 1958-02-04 1960-11-29 New York Wire Cloth Company Resin clad metal wire cloth
US3297461A (en) * 1963-05-10 1967-01-10 Us Stoneware Inc Reinforced plastic sheeting
DE1758501A1 (de) * 1968-06-14 1971-01-21 Wangner Fa Hermann Papiermaschinensieb
USRE29820E (en) * 1971-08-30 1978-10-31 Perstorp, Ab Method for the production of material for printed circuits
US3936548A (en) * 1973-02-28 1976-02-03 Perstorp Ab Method for the production of material for printed circuits and material for printed circuits
CH629057A5 (en) * 1978-08-07 1982-03-31 Contraves Ag Method for designing electrically conductive layers for producing printed circuits, as well as a multi-layer base material for carrying out the method
SE430742B (sv) * 1982-04-30 1983-12-05 Ericsson Telefon Ab L M Monsterkort for direktmonterade keramikkomponenter monsterkort for direktmonterade keramikkomponenter
JPS5993856A (ja) * 1982-11-18 1984-05-30 Nippon Seisen Kk ステンレス鋼細線
US4569692A (en) * 1983-10-06 1986-02-11 Olin Corporation Low thermal expansivity and high thermal conductivity substrate
US4754546A (en) * 1985-07-22 1988-07-05 Digital Equipment Corporation Electrical connector for surface mounting and method of making thereof
US4711804A (en) * 1986-07-02 1987-12-08 General Electric Company Circuit board construction

Also Published As

Publication number Publication date
SE8506105D0 (sv) 1985-12-23
SE462071B (sv) 1990-04-30
US4824381A (en) 1989-04-25
EP0228017A3 (en) 1989-04-19
EP0228017A2 (en) 1987-07-08
JPS62202585A (ja) 1987-09-07

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