SE8402518D0 - Forfarande for att inspektera integrerade kretsar, eller andra objekt - Google Patents

Forfarande for att inspektera integrerade kretsar, eller andra objekt

Info

Publication number
SE8402518D0
SE8402518D0 SE8402518A SE8402518A SE8402518D0 SE 8402518 D0 SE8402518 D0 SE 8402518D0 SE 8402518 A SE8402518 A SE 8402518A SE 8402518 A SE8402518 A SE 8402518A SE 8402518 D0 SE8402518 D0 SE 8402518D0
Authority
SE
Sweden
Prior art keywords
points
coordinate system
nodes
objects
determined
Prior art date
Application number
SE8402518A
Other languages
English (en)
Other versions
SE8402518L (sv
SE452526B (sv
Inventor
G Stille
Original Assignee
Stiftelsen Inst Mikrovags
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stiftelsen Inst Mikrovags filed Critical Stiftelsen Inst Mikrovags
Priority to SE8402518A priority Critical patent/SE452526B/sv
Publication of SE8402518D0 publication Critical patent/SE8402518D0/sv
Priority to US06/729,756 priority patent/US4870344A/en
Priority to JP60096854A priority patent/JPS6117075A/ja
Publication of SE8402518L publication Critical patent/SE8402518L/sv
Publication of SE452526B publication Critical patent/SE452526B/sv

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/305Contactless testing using electron beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SE8402518A 1984-05-09 1984-05-09 Forfarande for att inspektera integrerade kretsar eller andra objekt SE452526B (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE8402518A SE452526B (sv) 1984-05-09 1984-05-09 Forfarande for att inspektera integrerade kretsar eller andra objekt
US06/729,756 US4870344A (en) 1984-05-09 1985-05-02 Method for inspecting integrated circuits or other objects
JP60096854A JPS6117075A (ja) 1984-05-09 1985-05-09 集積回路の検査法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8402518A SE452526B (sv) 1984-05-09 1984-05-09 Forfarande for att inspektera integrerade kretsar eller andra objekt

Publications (3)

Publication Number Publication Date
SE8402518D0 true SE8402518D0 (sv) 1984-05-09
SE8402518L SE8402518L (sv) 1985-11-10
SE452526B SE452526B (sv) 1987-11-30

Family

ID=20355819

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8402518A SE452526B (sv) 1984-05-09 1984-05-09 Forfarande for att inspektera integrerade kretsar eller andra objekt

Country Status (3)

Country Link
US (1) US4870344A (sv)
JP (1) JPS6117075A (sv)
SE (1) SE452526B (sv)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8702874A (nl) * 1987-12-01 1989-07-03 Philips Nv Inspectie apparaat met gedigitaliseerde elektronen detectie.
US5089774A (en) * 1989-12-26 1992-02-18 Sharp Kabushiki Kaisha Apparatus and a method for checking a semiconductor
DE4027062A1 (de) * 1990-08-27 1992-04-23 Integrated Circuit Testing Verfahren und anordnung zum testen und reparieren einer integrierten schaltung
DE69227056T2 (de) * 1991-03-22 1999-05-12 Nec Corp Verfahren zur Fehleranalyse unter Verwendung eines Elektronenstrahles
JPH0823014A (ja) * 1994-07-08 1996-01-23 Fujitsu Ltd 信号波形測定装置及び信号波形測定方法
DE19526194C2 (de) * 1994-07-18 2002-11-07 Advantest Corp Verfahren zur Feststellung eines Fehlers eines ICs unter Verwendung eines Strahls geladener Teilchen
DE19802848B4 (de) 1998-01-26 2012-02-02 Display Products Group,Inc. Verfahren und Vorrichtung zum Testen eines Substrats
JP4312910B2 (ja) * 1999-12-02 2009-08-12 株式会社日立製作所 レビューsem
JP4034500B2 (ja) * 2000-06-19 2008-01-16 株式会社日立製作所 半導体装置の検査方法及び検査装置、及びそれを用いた半導体装置の製造方法
JP4336170B2 (ja) * 2003-09-10 2009-09-30 日本電産リード株式会社 基板検査装置及びレーザービーム光照射位置補正方法
JP5041937B2 (ja) * 2007-09-13 2012-10-03 株式会社日立ハイテクノロジーズ 検査装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3207904A (en) * 1962-04-09 1965-09-21 Western Electric Co Electro-optical article positioning system
DE2813947C2 (de) * 1978-03-31 1986-09-04 Siemens AG, 1000 Berlin und 8000 München Verfahren zur berührungslosen Messung des Potentialverlaufs in einem elektronischen Bauelement und Anordnung zur Durchführung des Verfahrens
US4420691A (en) * 1978-12-28 1983-12-13 Fujitsu Limited Method of aligning electron beam apparatus
DE2903077C2 (de) * 1979-01-26 1986-07-17 Siemens AG, 1000 Berlin und 8000 München Verfahren zur berührungslosen Potentialmessung an einem elektronischen Bauelement und Anordnung zur Durchführung des Verfahrens
US4318003A (en) * 1979-02-14 1982-03-02 Dainippon Screen Seizo Kabushiki Kaisha Method and machine for positioning films on base sheets
JPS5633830A (en) * 1979-08-29 1981-04-04 Fujitsu Ltd Detecting method for mark positioning by electron beam
DE3036660A1 (de) * 1980-09-29 1982-05-19 Siemens AG, 1000 Berlin und 8000 München Anordnung fuer stroboskopische potentialmessungen mit einem elektronenstrahl-messgeraet
JPS5870541A (ja) * 1981-10-23 1983-04-27 Fujitsu Ltd 集積回路の不良解析装置
JPS5931549A (ja) * 1982-08-13 1984-02-20 Hitachi Ltd ストロボ走査形電子顕微鏡の像表示装置
JPS5946026A (ja) * 1982-09-09 1984-03-15 Toshiba Corp 試料位置測定方法
JPS5976441A (ja) * 1982-10-22 1984-05-01 Fujitsu Ltd 集積回路の診断装置
JPS59189415A (ja) * 1983-04-13 1984-10-27 Hitachi Ltd 工業用ロボツトの動作教示方法および装置
JPS6010730A (ja) * 1983-06-30 1985-01-19 Toshiba Corp 半導体ウエハの位置合わせ方法

Also Published As

Publication number Publication date
SE8402518L (sv) 1985-11-10
JPS6117075A (ja) 1986-01-25
SE452526B (sv) 1987-11-30
US4870344A (en) 1989-09-26

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