SE8103427L - Sett att framstella tryckta kopplingar - Google Patents

Sett att framstella tryckta kopplingar

Info

Publication number
SE8103427L
SE8103427L SE8103427A SE8103427A SE8103427L SE 8103427 L SE8103427 L SE 8103427L SE 8103427 A SE8103427 A SE 8103427A SE 8103427 A SE8103427 A SE 8103427A SE 8103427 L SE8103427 L SE 8103427L
Authority
SE
Sweden
Prior art keywords
clutches
boreholes
holes
base material
make printed
Prior art date
Application number
SE8103427A
Other languages
English (en)
Other versions
SE460394B (sv
Inventor
H Henze
R B Capell
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of SE8103427L publication Critical patent/SE8103427L/sv
Publication of SE460394B publication Critical patent/SE460394B/sv

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789Aqueous acid solution, e.g. for cleaning or etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1415Applying catalyst after applying plating resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
SE8103427A 1980-06-06 1981-06-01 Saett foer framstaellning av tryckta kretsar SE460394B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3021896A DE3021896A1 (de) 1980-06-06 1980-06-06 Verfahren zur herstellung von gedruckten schaltungen

Publications (2)

Publication Number Publication Date
SE8103427L true SE8103427L (sv) 1981-12-07
SE460394B SE460394B (sv) 1989-10-02

Family

ID=6104356

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8103427A SE460394B (sv) 1980-06-06 1981-06-01 Saett foer framstaellning av tryckta kretsar

Country Status (12)

Country Link
US (1) US4433009A (sv)
JP (1) JPS5723298A (sv)
CA (1) CA1176759A (sv)
CH (1) CH657491A5 (sv)
DE (1) DE3021896A1 (sv)
ES (1) ES502446A0 (sv)
FR (1) FR2484183A1 (sv)
GB (1) GB2080043B (sv)
IE (1) IE51721B1 (sv)
IT (1) IT1137014B (sv)
NL (1) NL8102129A (sv)
SE (1) SE460394B (sv)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58106971U (ja) * 1982-01-14 1983-07-21 棚沢 日佐司 プリント配線基板
FR2531302A1 (fr) * 1982-07-30 1984-02-03 Xerox Corp Procedes de formation d'un circuit electrique a haute densite et d'elements d'interconnexion pour le circuit
DE3518975A1 (de) * 1985-05-25 1986-11-27 Bayer Ag, 5090 Leverkusen Kunststoffteil
US4758459A (en) * 1987-01-28 1988-07-19 Northern Telecom Limited Molded circuit board
EP2230890A1 (en) * 2009-03-20 2010-09-22 Laird Technologies AB Method for providing a conductive material structure on a carrier

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1665314C2 (de) * 1966-02-22 1978-05-24 Kollmorgen Tech Corp Basismaterial zur Herstellung gedruckter Schaltungen
GB1478341A (en) * 1973-06-07 1977-06-29 Hitachi Chemical Co Ltd Printed circuit board and method of making the same
HU168090B (sv) * 1973-11-15 1976-02-28
JPS518564A (en) * 1974-07-10 1976-01-23 Matsushita Electric Ind Co Ltd Insatsuhaisenbanno seizohoho
DE2713393C3 (de) * 1977-03-23 1980-02-28 Ruwel-Werke Spezialfabrik Fuer Hochfrequenzbauteile Gmbh, 4170 Geldern Verfahren zum Herstellen von gedruckten Schaltungen
DE2803762A1 (de) * 1978-01-28 1979-08-02 Licentia Gmbh Verfahren zur additiven nasschemischen herstellung von schaltungsnetzwerken
US4283243A (en) * 1978-10-24 1981-08-11 E. I. Du Pont De Nemours And Company Use of photosensitive stratum to create through-hole connections in circuit boards
DE2920940A1 (de) * 1979-05-21 1980-12-04 Schering Ag Verfahren zur herstellung von gedruckten schaltungen

Also Published As

Publication number Publication date
NL8102129A (nl) 1982-01-04
GB2080043B (en) 1984-07-11
DE3021896A1 (de) 1982-03-25
IE51721B1 (en) 1987-03-04
FR2484183B1 (sv) 1985-03-01
FR2484183A1 (fr) 1981-12-11
CA1176759A (en) 1984-10-23
GB2080043A (en) 1982-01-27
US4433009A (en) 1984-02-21
SE460394B (sv) 1989-10-02
JPS5723298A (en) 1982-02-06
CH657491A5 (de) 1986-08-29
IT8121668A0 (it) 1981-05-13
ES8207667A1 (es) 1982-10-01
JPH0147910B2 (sv) 1989-10-17
ES502446A0 (es) 1982-10-01
IE811248L (en) 1981-12-06
IT1137014B (it) 1986-09-03

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