GB2009515A - Method and apparatus for the production of printed circuit boards - Google Patents

Method and apparatus for the production of printed circuit boards

Info

Publication number
GB2009515A
GB2009515A GB7842178A GB7842178A GB2009515A GB 2009515 A GB2009515 A GB 2009515A GB 7842178 A GB7842178 A GB 7842178A GB 7842178 A GB7842178 A GB 7842178A GB 2009515 A GB2009515 A GB 2009515A
Authority
GB
United Kingdom
Prior art keywords
foil
copper
thickness
printed circuit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB7842178A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Publication of GB2009515A publication Critical patent/GB2009515A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)

Abstract

A printed circuit board with metallized through holes is formed by punching or drilling the base board, depositing copper electrolessly on both sides of the board and in the holes to a thickness of about 0.5 mu , increasing the copper thickness by electroplating until a thickness of the order of 25 to 35 mu is obtained, applying a photoresist foil to each side of the board under the action of pressure and temperature, negatively exposing the photoresist foil with the required conductor patterns and processing the resist so that the foil protects the desired conductor pads and paths and areas of the copper layers which are not required are exposed for etching, and etching to remove the copper not protected by the resist foil.
GB7842178A 1977-10-28 1978-10-27 Method and apparatus for the production of printed circuit boards Withdrawn GB2009515A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772748345 DE2748345A1 (en) 1977-10-28 1977-10-28 METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUIT BOARDS

Publications (1)

Publication Number Publication Date
GB2009515A true GB2009515A (en) 1979-06-13

Family

ID=6022480

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7842178A Withdrawn GB2009515A (en) 1977-10-28 1978-10-27 Method and apparatus for the production of printed circuit boards

Country Status (5)

Country Link
JP (1) JPS5471737A (en)
DE (1) DE2748345A1 (en)
FR (1) FR2407639A1 (en)
GB (1) GB2009515A (en)
SE (1) SE7811055L (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113079634B (en) * 2020-05-29 2022-11-18 新华三技术有限公司合肥分公司 Circuit board and preparation process thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3159486A (en) * 1959-08-03 1964-12-01 Rca Corp Method of making electrical conductors
FR1381882A (en) * 1963-02-06 1964-12-14 Siemens Ag Process for the manufacture of printed circuits and circuits conforming to those thus obtained
DE1490374B1 (en) * 1963-02-06 1969-11-20 Siemens Ag Process for the production of an insulating body with metal layers
US3558441A (en) * 1968-11-01 1971-01-26 Int Electronic Res Corp Method of making a metal core printed circuit board
GB1288992A (en) * 1970-06-22 1972-09-13

Also Published As

Publication number Publication date
SE7811055L (en) 1979-04-29
DE2748345A1 (en) 1979-05-03
FR2407639A1 (en) 1979-05-25
JPS5471737A (en) 1979-06-08

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)