DE1490374B1 - Process for the production of an insulating body with metal layers - Google Patents

Process for the production of an insulating body with metal layers

Info

Publication number
DE1490374B1
DE1490374B1 DE19631490374D DE1490374DA DE1490374B1 DE 1490374 B1 DE1490374 B1 DE 1490374B1 DE 19631490374 D DE19631490374 D DE 19631490374D DE 1490374D A DE1490374D A DE 1490374DA DE 1490374 B1 DE1490374 B1 DE 1490374B1
Authority
DE
Germany
Prior art keywords
adhesive
insulating body
mixture
percent
butadiene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19631490374D
Other languages
German (de)
Inventor
Siegfried Haid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of DE1490374B1 publication Critical patent/DE1490374B1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/36—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of phenols with aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/2033—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
    • H01B3/485—Other fibrous materials fabric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0565—Resist used only for applying catalyst, not for plating itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1415—Applying catalyst after applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Description

Die Erfindung betrifft ein Verfahren zur Herstellung eines Isolierstoffkörpers mit Metallauflagen, die auf ihm durch Klebemittel befestigt sind.The invention relates to a method for producing an insulating body with metal pads attached to it by adhesive.

Isolierstoffkörper im Sinne der Erfindung können Platten aus Isolierstoffmaterial sein, wie beispielsweise Phenoplastschichtstoffe mit Papier als Harzträger; es sind aber auch andere Körperformen möglich, wie beispielsweise aus Isoliermaterial gegossene Blöcke. In erster Linie betrifft die Erfindung Isolierstoffkörper, die in der Technik der gedruckten Schaltung verwendet werden, wobei die Isolierstoffkörper als Träger für Leitungsbahnen dienen. Hierbei ist es gleichgültig, ob die Leitungsbahnen auf einer Platte oder auf der Oberfläche eines ausgehärteten Kunststoffblockes angebracht sind, in welchem Miniaturbauelemente eingegossen sind, wobei die Leitungsbahnen zur Verschaltung der einzelnen Bauelemente der Miniaturbaugruppen dienen.Insulating bodies within the meaning of the invention can be plates made of insulating material such as phenolic laminates with paper as a resin backing; there are but other body shapes are also possible, such as cast from insulating material Blocks. First and foremost, the invention relates to insulating bodies used in technology the printed circuit are used, with the insulating body as a carrier serve for ducts. It does not matter whether the conductor tracks are on a plate or attached to the surface of a hardened plastic block are, in which miniature components are cast, with the conductor tracks serve to interconnect the individual components of the miniature assemblies.

Für die Herstellung gedruckter Schaltungen ist es bekannt, auf einem Isolierstoffkörper eine Metallauflage durch Klebemittel zu befestigen. Die Metallauflagen können hierbei und im Sinne der Erfindung sowohl Metallfolien als auch stromlos, insbesondere durch chemische Zersetzung, hergestellte Metallschichten sein. Isolierstoffkörper mit derartigen, durch Kleber auf ihnen befestigten Metallauflagen dienen in der Regel als Halbfertigprodukte bei der Herstellung gedruckter Schaltungen, insbesondere dann, wenn als Metall Kupfer verwendet wird. Es sind aber auch andere Anwendungen möglich, z. B. die, daß die Metallauflage als elektrische Abschirmung dient.For the production of printed circuits, it is known on a Insulating body to attach a metal support by adhesive. The metal pads can here and in the sense of the invention both metal foils and electroless, metal layers produced by chemical decomposition in particular. Insulating body with such metal supports attached to them by adhesive are used in the Usually as semi-finished products in the manufacture of printed circuits, in particular when copper is used as the metal. But there are also other applications possible, e.g. B. that the metal plating serves as an electrical shield.

Das Klebemittel hat mehrere Aufgaben zu erfüllen, die mit folgenden Angaben gekennzeichnet werden sollen: Gute mechanische Bindung zwischen Metallauflage und Träger; Ausgleich bzw. Aufnahme der unterschiedlichen linearen Ausdehnungskoeffizienten von Trägermaterial und Metallauflage und der dadurch bedingten mechanischen Spannungen, nicht nur bei der Herstellung des Halbfertigproduktes, sondern auch bei seiner weiteren technologischen Verarbeitung und im Einsatz; Säurebeständigkeit; möglichst geringe Wasseraufnahme; ausreichende Wärmebeständigkeit; elektrische und dielektrische Eigenschaften, die nicht schlechter als diejenigen des Trägermaterials sein sollen.The adhesive has several tasks to fulfill, with the following Information to be marked: Good mechanical bond between metal support and carrier; Compensation or recording of the different linear expansion coefficients of carrier material and metal coating and the resulting mechanical stresses, not only in the manufacture of the semi-finished product, but also in its further technological processing and in use; Acid resistance; as low as possible Water absorption; sufficient heat resistance; electrical and dielectric properties, which should not be inferior to those of the carrier material.

Man hat schon versucht, diese Vielfalt von Aufgaben durch Spezialkleber zu lösen. Ein hierbei bekanntgewordener Kleber hat jedoch nicht zu ausreichend großer Heftfestigkeit geführt, insbesondere dann. wenn zugbeanspruchte Lötstellen auf der Metallauflage vorgesehen sind. Andere bekannte Vorschläge sehen vor, daß die Haftfestigkeit der Metallauflage auf dem Isolierstoffkörper durch Anwendung hoher Preßdrücke erhöht wird. Das Anpressen der Metallauflage an den Isolierstoffkörper bringt jedoch neben einem höheren Aufwand an technischen Mitteln auch Gefahren für die Materialien mit sich.Attempts have already been made to tackle this variety of tasks using special adhesives to solve. However, an adhesive that has become known here does not have to be sufficiently large Tackle strength out, especially then. if tensile soldered joints on the Metal support are provided. Other known proposals provide that the adhesive strength the metal layer on the insulating body is increased by using high pressing pressures will. However, the pressing of the metal layer on the insulating body brings additional a higher expenditure of technical means also dangers for the materials themselves.

Es ist auch ein Verfahren zum Herstellen gedruckter Schaltungen bekannt, bei dem auf eine nicht durchgehärtete Isolierstoffunterlage mittels Leim eine Metallfolie geklebt wird: Auch hier erfolgt die eigentliche Verbindung zwischen Träger und Metallfolie durch Aushärten bei Druck und Hitze; es treten somit auch bei diesem Verfahren die obenerwähnten Nachteile auf.There is also known a method for producing printed circuits, in which a metal foil is glued onto a non-hardened insulating material base is glued: Here, too, the actual connection between the carrier and the metal foil takes place by curing under pressure and heat; there are thus also in this process the disadvantages mentioned above.

Der Erfindung liegt daher die Aufgabe zugrunde, mit einfachen Mitteln, d. h. zum Beispiel ohne Anwendung von Preßdruck, hohe Haftfestigkeiten der Metallauflagen am Isolierstoffkörper zu erzielen, die es gestatten, zugbeanspruchte Lötstellen an derartigen Metallauflagen anzubringen.The invention is therefore based on the object, with simple means, d. H. For example, without the use of pressure, high adhesive strengths of the metal layers to achieve on the insulating body, which allow tensile stressed soldering points to be attached to such metal supports.

Das Verfahren zur Herstellung eines Isolierstoffkörpers mit Metallauflage ist erfindungsgemäß dadurch gekennzeichnet, daß auf die aufgerauhte Oberfläche des zu metallisierenden Isolierstoffkörpers ein erster Kleber mit einer hohen Haftfestigkeit zum Isolierstoffkörper aufgetragen und dieser vorgehärtet wird, daß darauf ein zweiter Kleber, der elastisch ist und eine hohe Haftfestigkeit zur Metallauflage besitzt, aufgetragen und vorgehärtet wird, wobei die Haftfestigkeit zwischen den beiden Kleberschichten etwa den jeweiligen anderen Haftfestigkeiten entspricht, und daß danach die Metallauflage aufgebracht wird und die Endhärtung erfolgt.The process for producing an insulating body with a metal coating is according to the invention characterized in that the roughened surface of the to be metallized insulating body a first adhesive with a high adhesive strength applied to the insulating body and this is pre-cured that a second Adhesive that is elastic and has a high adhesive strength to the metal support, is applied and pre-cured, the adhesive strength between the two adhesive layers corresponds approximately to the respective other adhesive strengths, and that then the metal coating is applied and the final curing takes place.

Die Haftfestigkeiten der einzelnen Kleber am Isolierstoffkörper bzw. an der Metallauflage und untereinander können durch einfache Versuche ermittelt werden.The adhesive strength of the individual adhesive on the insulating body or on the metal plating and among each other can be determined through simple experiments will.

Für Phenoplastschichtstoffe mit Papier als Harzträger eignet sich besonders als erster Kleber ein Polyamid-Epoxyd-Gemisch und als zweiter Kleber bei einer Kupfer-Metall-Auflage ein Kleber, der auf der Grundlage von Polybutadien aufgebaut ist.It is suitable for phenolic laminates with paper as the resin carrier especially a polyamide-epoxy mixture as the first adhesive and a second adhesive a copper-metal layer an adhesive based on polybutadiene is.

Das Auftragen der Kleber kann beispielsweise durch Aufstreichen oder Aufspritzen erfolgen. Es hat sich jedoch als besonders zweckmäßig erwiesen, das Auftragen der Kleberschichten durch Aufschleudern vorzunehmen. Dies geschieht dadurch, daß in einer an sich bekannten Schleudervorrichtung die mit Kleber zu versehenen Isolierstoffkörper tangential zur Drehrichtung der Schleudervorrichtung aufgestellt werden und dann das Aufschleudern erfolgt, indem bei einem Radius von etwa 15 cm und einer Umdrehungsgeschwindigkeit von 200 U/min die einzelnen Kleber von der Mitte der Schleudervorrichtung aus verteilt werden.The adhesive can be applied, for example, by brushing on or Spraying done. However, it has been found to be particularly useful that Apply the adhesive layers by spin coating. This is done by that in a known centrifugal device to be provided with glue Insulating body set up tangentially to the direction of rotation of the centrifugal device and then the spinning is done by at a radius of about 15 cm and at a speed of rotation of 200 rpm, remove the individual adhesives from the center be distributed from the spinner.

Als erster Kleber hat sich ein Gemisch aus etwa 45 Gewichtsprozent Epoxydharz, etwa 30 Gewichtsprozent Polyamid und etwa 25 Gewichtsprozent Methyläthylketon als Lösungsmittel besonders bewährt. Für den zweiten Kleber wird als bevorzugte Zusammensetzung ein Butadien-Acrylnitril-Kleber vorgeschlagen, der mit einem Gemisch aus gleichen Teilen Methyläthylketon und Methylisobutylketon in Verhältnissen von 3 :1 bis 1:1 verdünnt ist.A mixture of about 45 percent by weight has proven to be the first adhesive Epoxy resin, about 30 percent by weight of polyamide and about 25 percent by weight of methyl ethyl ketone particularly proven as a solvent. The second glue is preferred Composition of a butadiene-acrylonitrile adhesive proposed with a mixture from equal parts of methyl ethyl ketone and methyl isobutyl ketone in proportions of 3: 1 to 1: 1 is diluted.

Die einzelnen Kleber werden nach ihrem Auftragen bei 55 bis 65° C in jeweils etwa 30 Minuten vorgehärtet.The individual adhesives are after their application at 55 to 65 ° C pre-cured in about 30 minutes each.

Wie Versuche gezeigt haben, werden durch diesen an sich einfach durchzuführenden Erfindungsvorschlag Haftfestigkeiten der Metallauflage am Isolierstoffkörper erreicht, die allen bisher bekanntgewordenen und erprobten Klebverbindungen überlegen sind.As experiments have shown, this in itself is easy to carry out Invention proposal achieves adhesive strength of the metal coating on the insulating body, which are superior to all previously known and tested adhesive connections.

Die Zeichnung zeigt die erfindungsgemäße Klebverbindung an einem Ausführungsbeispiel.The drawing shows the adhesive connection according to the invention in an exemplary embodiment.

Mit 1 ist der Oberflächenteil eines Isolierstoffkörpers bezeichnet, dessen Oberfläche 2 insbesondere mechanisch aufgerauht ist. Auf diese Oberfläche ist der erste Kleber 3 aufgetragen und auf diesem wiederum der zweite Kleber 4. Die Metallauflage 5 bildet schließlich die Metallisierung. In dieser FormThe surface part of an insulating body is designated by 1 , the surface 2 of which is, in particular, mechanically roughened. The first adhesive 3 is applied to this surface and the second adhesive 4 in turn is applied to this surface. Finally, the metal coating 5 forms the metallization. In this form

Claims (10)

Patentansprüche: 1. Verfahren zur Herstellung eines Isolierstoffkörpers mit auf ihm durch Klebemittel befestigter Metallauflage, dadurch gekennzeichnet, daß auf die aufgerauhte Oberfläche (2) des zu metallisierenden isolierstoffkörpers (1) ein erster Kleber (3) mit einer hohen Haftfestigkeit zum Isolierstoffkörper (1) aufgetragen und dieser vorgehärtet wird. daß darauf ein zweiter Kleber (4), der elastisch ist und eine hohe Haftfestigkeit zur Metallauflage (5) besitzt, aufgetragen und vorgehärtet wird, wobei die Haftfestigkeit zwischen den beiden Kleberschichten (3, 4) etwa den jeweiligen anderen Haftfestigkeiten entspricht, und daß danach die Metallauflage (5) aufgebracht wird und die Endhärtung erfolgt. Claims: 1. A method for producing an insulating body with a metal support attached to it by adhesive, characterized in that that on the roughened surface (2) of the insulating body to be metallized (1) a first adhesive (3) with high adhesive strength to the insulating body (1) applied and this is pre-cured. that on it a second adhesive (4), which is elastic and has a high adhesive strength to the metal coating (5) and is pre-cured, the adhesive strength between the two adhesive layers (3, 4) corresponds approximately to the respective other adhesive strengths, and that after that the Metal coating (5) is applied and the final hardening takes place. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Aufrauhen mechanisch erfolgt. 2. Procedure according to Claim 1, characterized in that the roughening takes place mechanically. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß auf den zweiten Kleber Kupfer durch chemische Zersetzung einer Kupferverbindung aufgetragen wird. 3. Procedure according to claim 1 or 2, characterized in that copper is applied to the second adhesive is applied by chemical decomposition of a copper compound. 4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß als Material für den Körper Phenoplastschichtstoff mit Papier als Harztr*i_cr verwendet wird. 4. Procedure according to one of claims 1 to 3, characterized in that the material for the Body phenoplastic laminate with paper used as Harztr * i_cr. 5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß als erster Kleber ein Polyamid-Epoxyd-Gemisch und als zweiter Kleber ein auf der Grundlace von Polvbutadien aufgebauter Kleber verwendet wird. J 5. Procedure according to one of claims 1 to 4, characterized in that the first adhesive a polyamide-epoxy mixture and a second adhesive on the base of polybutadiene built-up adhesive is used. J 6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß als erster Kleber ein Gemisch aus etwa 45 Gewichtsprozent Epoxydharz, etwa 30 Gewichtsprozent Polyamid und etwa 25 Gewichtsprozent Methyläthylketon verwendet wird. 6. The method according to any one of claims 1 to 5, characterized in that the first adhesive is a mixture of about 45 percent by weight Epoxy resin, about 30 percent by weight of polyamide and about 25 percent by weight of methyl ethyl ketone is used. 7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß als zweiter Kleber ein Butadien-Acrylnitril-Kleber verwendet wird, der mit einem Gemisch aus gleichen Teilen MethyIäthyIketon und Methylisobutylketon in Verhältnissen von etwa 3 :1 bis 1: 1 verdünnt ist. B. 7. The method according to any one of claims 1 to 6, characterized in, that a butadiene-acrylonitrile adhesive is used as the second adhesive, which with a Mixture of equal parts of methyl ethyl ketone and methyl isobutyl ketone in proportions is diluted from about 3: 1 to 1: 1. B. Verfahren nach Anspruch 7, dadurch gekennzeichnet, daß als Butadien-Acrylnitril-Kleber ein Gemisch aus etwa gleichen Teilen Butadien und Acrylnitril verwendet wird. Method according to claim 7, characterized in that that the butadiene-acrylonitrile adhesive is a mixture of approximately equal parts of butadiene and acrylonitrile is used. 9. Verfahren nach Anspruch 6, 7 und gegebenenfalls 8, dadurch gekennzeichnet, daß das Vorhärten bei 55 bis 65° C in jeweils etwa 30 Minuten erfolgt. 9. The method according to claim 6, 7 and optionally 8, characterized in that the pre-hardening at 55 to 65 ° C in each case about 30 Minutes. 10. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß das Auftragen der Kleberschichten durch Aufschleudern erfolgt. kann der Isolierstoffkörl)cr als Halbfertigprodukt, beispielsw,cise für die Herstellung %-on gedruckten Schaltungen, vcrw,endet werden.
10. The method according to claim 1 or 2, characterized in that the adhesive layers are applied by spin-coating. the Isolierstoffkörl) cr can be used as a semi-finished product, for example, cise for making% -on printed Circuits, vcrw, are ended.
DE19631490374D 1963-02-06 1963-02-06 Process for the production of an insulating body with metal layers Pending DE1490374B1 (en)

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Application Number Priority Date Filing Date Title
DES0083617 1963-02-06
DES0083618 1963-02-06

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DE1496984A Expired DE1496984C3 (en) 1963-02-06 1963-02-06 Process for the production of printed circuits with galvanically generated conductor tracks according to the build-up method
DE19631490374D Pending DE1490374B1 (en) 1963-02-06 1963-02-06 Process for the production of an insulating body with metal layers

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AT (1) AT253031B (en)
CH (1) CH424891A (en)
DE (2) DE1496984C3 (en)
GB (1) GB1013606A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2239829A1 (en) * 1972-08-12 1974-02-14 Aeg Isolier Kunststoff METHOD OF MANUFACTURING A BASE MATERIAL FOR PRINTED CIRCUITS

Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
DE1665314C2 (en) * 1966-02-22 1978-05-24 Kollmorgen Tech Corp Base material for the production of printed circuits
DE2131205C3 (en) * 1971-06-23 1981-07-30 International Electronic Research Corp., Burbank, Calif. Process for the production of a printed circuit with a metal core
DE2748345A1 (en) * 1977-10-28 1979-05-03 Blaupunkt Werke Gmbh METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUIT BOARDS
DE3408630A1 (en) * 1984-03-09 1985-09-12 Hoechst Ag, 6230 Frankfurt METHOD AND LAYER MATERIAL FOR THE PRODUCTION OF CONTACTED ELECTRICAL CIRCUITS
DE3576900D1 (en) * 1985-12-30 1990-05-03 Ibm Deutschland METHOD FOR PRODUCING PRINTED CIRCUITS.
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes

Citations (1)

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Publication number Priority date Publication date Assignee Title
DE1129198B (en) * 1957-06-07 1962-05-10 Philips Nv Process for making a printed circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1129198B (en) * 1957-06-07 1962-05-10 Philips Nv Process for making a printed circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2239829A1 (en) * 1972-08-12 1974-02-14 Aeg Isolier Kunststoff METHOD OF MANUFACTURING A BASE MATERIAL FOR PRINTED CIRCUITS

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GB1013606A (en) 1965-12-15
AT253031B (en) 1967-03-28
DE1496984A1 (en) 1969-11-06
CH424891A (en) 1966-11-30
DE1496984C3 (en) 1974-01-24
DE1496984B2 (en) 1970-07-02

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