SE8006355L - Rengoring av kiselbrickor - Google Patents

Rengoring av kiselbrickor

Info

Publication number
SE8006355L
SE8006355L SE8006355A SE8006355A SE8006355L SE 8006355 L SE8006355 L SE 8006355L SE 8006355 A SE8006355 A SE 8006355A SE 8006355 A SE8006355 A SE 8006355A SE 8006355 L SE8006355 L SE 8006355L
Authority
SE
Sweden
Prior art keywords
solution
film
wafers
volume
silicon
Prior art date
Application number
SE8006355A
Other languages
English (en)
Inventor
S Shwarzman
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of SE8006355L publication Critical patent/SE8006355L/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SE8006355A 1979-09-25 1980-09-11 Rengoring av kiselbrickor SE8006355L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/078,795 US4261791A (en) 1979-09-25 1979-09-25 Two step method of cleaning silicon wafers

Publications (1)

Publication Number Publication Date
SE8006355L true SE8006355L (sv) 1981-03-26

Family

ID=22146275

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8006355A SE8006355L (sv) 1979-09-25 1980-09-11 Rengoring av kiselbrickor

Country Status (5)

Country Link
US (1) US4261791A (sv)
JP (1) JPS5655053A (sv)
DE (1) DE3035020A1 (sv)
IT (1) IT1141041B (sv)
SE (1) SE8006355L (sv)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4615762A (en) * 1985-04-30 1986-10-07 Rca Corporation Method for thinning silicon
EP0286855A1 (de) * 1987-04-15 1988-10-19 BBC Brown Boveri AG Verfahren zum Aetzen von Vertiefungen in ein Siliziumsubstrat
JP2639008B2 (ja) * 1988-10-25 1997-08-06 富士通株式会社 半導体基板の洗浄方法
US4964919A (en) * 1988-12-27 1990-10-23 Nalco Chemical Company Cleaning of silicon wafers with an aqueous solution of KOH and a nitrogen-containing compound
US5250836A (en) * 1989-12-20 1993-10-05 Fujitsu Limited Semiconductor device having silicon-on-insulator structure
JP2777920B2 (ja) * 1989-12-20 1998-07-23 富士通株式会社 半導体装置及びその製造方法
JP2787788B2 (ja) * 1990-09-26 1998-08-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 残留物除去方法
JPH05121390A (ja) * 1991-10-29 1993-05-18 Koujiyundo Silicon Kk 酸の除去方法
WO1995004372A1 (en) * 1993-07-30 1995-02-09 Semitool, Inc. Methods for processing semiconductors to reduce surface particles
US5632866A (en) * 1994-01-12 1997-05-27 Fsi International, Inc. Point-of-use recycling of wafer cleaning substances
US5911889A (en) * 1995-05-11 1999-06-15 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Aktiengesellschaft Method of removing damaged crystal regions from silicon wafers
US6004399A (en) * 1996-07-01 1999-12-21 Cypress Semiconductor Corporation Ultra-low particle semiconductor cleaner for removal of particle contamination and residues from surface oxide formation on semiconductor wafers
US6090726A (en) * 1996-07-05 2000-07-18 National Science Council Pretreatment method of a silicon wafer using nitric acid
US6240933B1 (en) 1997-05-09 2001-06-05 Semitool, Inc. Methods for cleaning semiconductor surfaces
US5837662A (en) * 1997-12-12 1998-11-17 Memc Electronic Materials, Inc. Post-lapping cleaning process for silicon wafers
US6143663A (en) * 1998-01-22 2000-11-07 Cypress Semiconductor Corporation Employing deionized water and an abrasive surface to polish a semiconductor topography
US6200896B1 (en) 1998-01-22 2001-03-13 Cypress Semiconductor Corporation Employing an acidic liquid and an abrasive surface to polish a semiconductor topography
US6171180B1 (en) 1998-03-31 2001-01-09 Cypress Semiconductor Corporation Planarizing a trench dielectric having an upper surface within a trench spaced below an adjacent polish stop surface
US6232231B1 (en) 1998-08-31 2001-05-15 Cypress Semiconductor Corporation Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect
US5972124A (en) 1998-08-31 1999-10-26 Advanced Micro Devices, Inc. Method for cleaning a surface of a dielectric material
US6534378B1 (en) 1998-08-31 2003-03-18 Cypress Semiconductor Corp. Method for forming an integrated circuit device
US6037271A (en) * 1998-10-21 2000-03-14 Fsi International, Inc. Low haze wafer treatment process
US6566249B1 (en) 1998-11-09 2003-05-20 Cypress Semiconductor Corp. Planarized semiconductor interconnect topography and method for polishing a metal layer to form wide interconnect structures
US6274504B2 (en) * 1999-06-15 2001-08-14 Advanced Micro Devices, Inc. Minimizing metal corrosion during post metal solvent clean
US6526995B1 (en) 1999-06-29 2003-03-04 Intersil Americas Inc. Brushless multipass silicon wafer cleaning process for post chemical mechanical polishing using immersion
US6969684B1 (en) 2001-04-30 2005-11-29 Cypress Semiconductor Corp. Method of making a planarized semiconductor structure
US6828678B1 (en) 2002-03-29 2004-12-07 Silicon Magnetic Systems Semiconductor topography with a fill material arranged within a plurality of valleys associated with the surface roughness of the metal layer
JP4817291B2 (ja) * 2005-10-25 2011-11-16 Ｏｋｉセミコンダクタ株式会社 半導体ウェハの製造方法
DE102007030957A1 (de) * 2007-07-04 2009-01-08 Siltronic Ag Verfahren zum Reinigen einer Halbleiterscheibe mit einer Reinigungslösung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE543254A (sv) * 1954-12-01
US3102061A (en) * 1960-01-05 1963-08-27 Texas Instruments Inc Method for thermally etching silicon surfaces
US3224904A (en) * 1963-03-18 1965-12-21 Bell Telephone Labor Inc Semiconductor surface cleaning
US3813311A (en) * 1973-01-24 1974-05-28 Gen Motors Corp Process for etching silicon wafers
US4026741A (en) * 1976-06-16 1977-05-31 Bell Telephone Laboratories, Incorporated Technique for preparation of stoichiometric III-V compound semiconductor surfaces

Also Published As

Publication number Publication date
IT1141041B (it) 1986-10-01
DE3035020A1 (de) 1981-04-09
JPS5655053A (en) 1981-05-15
IT8024611A0 (it) 1980-09-11
US4261791A (en) 1981-04-14

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