SE8002444L - Elektro-optiskt kopplingsdon - Google Patents

Elektro-optiskt kopplingsdon

Info

Publication number
SE8002444L
SE8002444L SE8002444A SE8002444A SE8002444L SE 8002444 L SE8002444 L SE 8002444L SE 8002444 A SE8002444 A SE 8002444A SE 8002444 A SE8002444 A SE 8002444A SE 8002444 L SE8002444 L SE 8002444L
Authority
SE
Sweden
Prior art keywords
electro
optical
optical connector
electrical
housing
Prior art date
Application number
SE8002444A
Other languages
English (en)
Other versions
SE455243B (sv
Inventor
S Halbach
Original Assignee
Nkf Groep Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nkf Groep Bv filed Critical Nkf Groep Bv
Publication of SE8002444L publication Critical patent/SE8002444L/sv
Publication of SE455243B publication Critical patent/SE455243B/sv

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
SE8002444A 1979-04-03 1980-03-31 Elektro-optiskt kopplingsdon innefattande ett holje som omsluter ett elektrooptiskt element, vilket holje inrymmer en optiskt aktiv kavitet fylld med ett transparent lim SE455243B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2913262A DE2913262C2 (de) 1979-04-03 1979-04-03 Elektro-optische Verbindungsvorrichtung

Publications (2)

Publication Number Publication Date
SE8002444L true SE8002444L (sv) 1980-10-04
SE455243B SE455243B (sv) 1988-06-27

Family

ID=6067264

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8002444A SE455243B (sv) 1979-04-03 1980-03-31 Elektro-optiskt kopplingsdon innefattande ett holje som omsluter ett elektrooptiskt element, vilket holje inrymmer en optiskt aktiv kavitet fylld med ett transparent lim

Country Status (5)

Country Link
JP (2) JPS5612780A (sv)
DE (1) DE2913262C2 (sv)
FR (1) FR2453555A1 (sv)
GB (1) GB2046472B (sv)
SE (1) SE455243B (sv)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3113146C2 (de) * 1981-04-01 1985-03-28 Siemens AG, 1000 Berlin und 8000 München Elektro-optischer Modulsteckverbinder
FR2533710A1 (fr) * 1982-09-24 1984-03-30 Radiotechnique Compelec Procede d'assemblage d'un dispositif de transmission par fibre optique
DE3302373A1 (de) * 1983-01-25 1984-07-26 WAGO Verwaltungsgesellschaft mbH, 4950 Minden Schaltanlagen-reihenklemme
CA1247902A (en) * 1983-09-30 1989-01-03 Timothy R. Ponn Fiber optic connector assembly
DE3513229A1 (de) * 1985-04-12 1986-10-16 Schott Glaswerke, 6500 Mainz Lichtzuendbarer thyristor
JPH0830776B2 (ja) * 1986-01-31 1996-03-27 京セラ株式会社 光通信用モジュール
DE3736026A1 (de) * 1987-10-24 1989-05-03 Standard Elektrik Lorenz Ag Optoelektrisches bauelement und verfahren zu dessen herstellung
GB2230349A (en) * 1989-04-08 1990-10-17 Oxley Dev Co Ltd "fibre optic/led coupling".
EP0450560B1 (en) * 1990-04-03 1998-07-22 Sumitomo Electric Industries, Ltd. An optical device
JP2792722B2 (ja) * 1990-07-16 1998-09-03 三菱電機株式会社 半導体発光装置
DE4114156A1 (de) * 1991-04-30 1992-11-05 Burndy Deutschland Steckverbinder fuer lichtwellenleiter
DE19541139C1 (de) 1995-10-27 1997-05-15 Siemens Ag Aufnahmeanordnung und Verfahren zum Herstellen einer Aufnahmeanordnung für mindestens einen umhüllten Lichtwellenleiter
GB9608381D0 (en) * 1996-04-23 1996-06-26 Baillie Hamilton William J Combined light emitting and light guide collection and output device
GB2365990A (en) * 2000-08-04 2002-02-27 Kymata Ltd Optical device with strengthening member and guide formations
DE10257128B3 (de) * 2002-12-05 2004-05-27 Schott Glas Vorrichtung zur Einkopplung von Licht in einen Lichtleiter
JP2005353816A (ja) 2004-06-10 2005-12-22 Olympus Corp 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE794374A (fr) * 1972-02-03 1973-07-23 Trefilunion Machine et procede de fabrication d'un treillis cylindrique expansible notament pour la realisation d'une armature de tuyau a emboitement, et treillis obtenu
DE2207900B1 (de) * 1972-02-19 1972-10-12 Messerschmitt-Bölkow-Blohm GmbH, 8000 München Kupplungselement für Lichtleitfaserkabel
US3938177A (en) * 1973-06-25 1976-02-10 Amp Incorporated Narrow lead contact for automatic face down bonding of electronic chips
US3840741A (en) * 1973-09-18 1974-10-08 Bell Telephone Labor Inc Semiconductor delay line detector for equalization of optical fiber dispersion
US4076376A (en) * 1973-10-16 1978-02-28 Bicc Limited Optical transmission systems
GB1461693A (en) * 1974-01-15 1977-01-19 Marconi Co Ltd Fibre optic couplers
FR2262407B1 (sv) * 1974-02-22 1977-09-16 Radiotechnique Compelec
GB1557685A (en) * 1976-02-02 1979-12-12 Fairchild Camera Instr Co Optically coupled isolator device
GB1569615A (en) * 1976-10-19 1980-06-18 Standard Telephones Cables Ltd Coupling optical fibres
US4144541A (en) * 1977-01-27 1979-03-13 Electric Power Research Institute, Inc. Light-activated semiconductor device package unit
DE2707190B2 (de) * 1977-02-18 1979-05-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur optoelektronischen Kopplung von eigensicheren und nichteigensicheren Stromkreisen, insbesondere in Schlagwetter- oder explosionsgeschützten Anlagen
DE2724850A1 (de) * 1977-06-02 1978-12-07 Bosch Gmbh Robert Elektrooptische anordnung

Also Published As

Publication number Publication date
SE455243B (sv) 1988-06-27
FR2453555A1 (fr) 1980-10-31
DE2913262C2 (de) 1982-04-29
GB2046472A (en) 1980-11-12
DE2913262A1 (de) 1980-10-09
JPS63100855U (sv) 1988-06-30
JPS5612780A (en) 1981-02-07
FR2453555B1 (sv) 1984-12-14
GB2046472B (en) 1983-01-26

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