FR2453555A1 - Dispositif de liaison electro-optique - Google Patents

Dispositif de liaison electro-optique

Info

Publication number
FR2453555A1
FR2453555A1 FR8007462A FR8007462A FR2453555A1 FR 2453555 A1 FR2453555 A1 FR 2453555A1 FR 8007462 A FR8007462 A FR 8007462A FR 8007462 A FR8007462 A FR 8007462A FR 2453555 A1 FR2453555 A1 FR 2453555A1
Authority
FR
France
Prior art keywords
electro
optical
connection device
optical connection
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8007462A
Other languages
English (en)
Other versions
FR2453555B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NKF Groep BV
Original Assignee
NKF Groep BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NKF Groep BV filed Critical NKF Groep BV
Publication of FR2453555A1 publication Critical patent/FR2453555A1/fr
Application granted granted Critical
Publication of FR2453555B1 publication Critical patent/FR2453555B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

Dispositif de liaison électro-optique dans lequel un élément électro-optique 4 est placé dans un boîtier 1. Pour obtenir des surfaces de contact aussi peu étendues que possible et à qualités optiques et électriques convenables, le boîtier est muni d'ouvertures 2a, 2b pour les constituants électriques et optiques, ces ouvertures comportant des moyens de guidage à l'aide desquels l'élément électrique 6, 7 à introduire est orienté de façon sûre par rapport à l'élément optique 4 à introduire. Application : commutation par voie optique.
FR8007462A 1979-04-03 1980-04-02 Dispositif de liaison electro-optique Granted FR2453555A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2913262A DE2913262C2 (de) 1979-04-03 1979-04-03 Elektro-optische Verbindungsvorrichtung

Publications (2)

Publication Number Publication Date
FR2453555A1 true FR2453555A1 (fr) 1980-10-31
FR2453555B1 FR2453555B1 (fr) 1984-12-14

Family

ID=6067264

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8007462A Granted FR2453555A1 (fr) 1979-04-03 1980-04-02 Dispositif de liaison electro-optique

Country Status (5)

Country Link
JP (2) JPS5612780A (fr)
DE (1) DE2913262C2 (fr)
FR (1) FR2453555A1 (fr)
GB (1) GB2046472B (fr)
SE (1) SE455243B (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3113146C2 (de) * 1981-04-01 1985-03-28 Siemens AG, 1000 Berlin und 8000 München Elektro-optischer Modulsteckverbinder
FR2533710A1 (fr) * 1982-09-24 1984-03-30 Radiotechnique Compelec Procede d'assemblage d'un dispositif de transmission par fibre optique
DE3302373A1 (de) * 1983-01-25 1984-07-26 WAGO Verwaltungsgesellschaft mbH, 4950 Minden Schaltanlagen-reihenklemme
CA1247902A (fr) * 1983-09-30 1989-01-03 Timothy R. Ponn Connecteur de fibres optiques
DE3513229A1 (de) * 1985-04-12 1986-10-16 Schott Glaswerke, 6500 Mainz Lichtzuendbarer thyristor
JPH0830776B2 (ja) * 1986-01-31 1996-03-27 京セラ株式会社 光通信用モジュール
DE3736026A1 (de) * 1987-10-24 1989-05-03 Standard Elektrik Lorenz Ag Optoelektrisches bauelement und verfahren zu dessen herstellung
GB2230349A (en) * 1989-04-08 1990-10-17 Oxley Dev Co Ltd "fibre optic/led coupling".
DE69129817T2 (de) * 1990-04-03 1999-01-07 Sumitomo Electric Industries Optische Vorrichtung
JP2792722B2 (ja) * 1990-07-16 1998-09-03 三菱電機株式会社 半導体発光装置
DE4114156A1 (de) * 1991-04-30 1992-11-05 Burndy Deutschland Steckverbinder fuer lichtwellenleiter
DE19541139C1 (de) 1995-10-27 1997-05-15 Siemens Ag Aufnahmeanordnung und Verfahren zum Herstellen einer Aufnahmeanordnung für mindestens einen umhüllten Lichtwellenleiter
GB9608381D0 (en) * 1996-04-23 1996-06-26 Baillie Hamilton William J Combined light emitting and light guide collection and output device
GB2365990A (en) * 2000-08-04 2002-02-27 Kymata Ltd Optical device with strengthening member and guide formations
DE10257128B3 (de) * 2002-12-05 2004-05-27 Schott Glas Vorrichtung zur Einkopplung von Licht in einen Lichtleiter
JP2005353816A (ja) 2004-06-10 2005-12-22 Olympus Corp 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3938177A (en) * 1973-06-25 1976-02-10 Amp Incorporated Narrow lead contact for automatic face down bonding of electronic chips
GB1461693A (en) * 1974-01-15 1977-01-19 Marconi Co Ltd Fibre optic couplers
US4076376A (en) * 1973-10-16 1978-02-28 Bicc Limited Optical transmission systems

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE794374A (fr) * 1972-02-03 1973-07-23 Trefilunion Machine et procede de fabrication d'un treillis cylindrique expansible notament pour la realisation d'une armature de tuyau a emboitement, et treillis obtenu
DE2207900B1 (de) * 1972-02-19 1972-10-12 Messerschmitt-Bölkow-Blohm GmbH, 8000 München Kupplungselement für Lichtleitfaserkabel
US3840741A (en) * 1973-09-18 1974-10-08 Bell Telephone Labor Inc Semiconductor delay line detector for equalization of optical fiber dispersion
FR2262407B1 (fr) * 1974-02-22 1977-09-16 Radiotechnique Compelec
GB1557685A (en) * 1976-02-02 1979-12-12 Fairchild Camera Instr Co Optically coupled isolator device
GB1569615A (en) * 1976-10-19 1980-06-18 Standard Telephones Cables Ltd Coupling optical fibres
US4144541A (en) * 1977-01-27 1979-03-13 Electric Power Research Institute, Inc. Light-activated semiconductor device package unit
DE2707190B2 (de) * 1977-02-18 1979-05-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur optoelektronischen Kopplung von eigensicheren und nichteigensicheren Stromkreisen, insbesondere in Schlagwetter- oder explosionsgeschützten Anlagen
DE2724850A1 (de) * 1977-06-02 1978-12-07 Bosch Gmbh Robert Elektrooptische anordnung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3938177A (en) * 1973-06-25 1976-02-10 Amp Incorporated Narrow lead contact for automatic face down bonding of electronic chips
US4076376A (en) * 1973-10-16 1978-02-28 Bicc Limited Optical transmission systems
GB1461693A (en) * 1974-01-15 1977-01-19 Marconi Co Ltd Fibre optic couplers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/79 *

Also Published As

Publication number Publication date
SE455243B (sv) 1988-06-27
FR2453555B1 (fr) 1984-12-14
DE2913262C2 (de) 1982-04-29
SE8002444L (sv) 1980-10-04
DE2913262A1 (de) 1980-10-09
GB2046472B (en) 1983-01-26
JPS5612780A (en) 1981-02-07
JPS63100855U (fr) 1988-06-30
GB2046472A (en) 1980-11-12

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Legal Events

Date Code Title Description
ST Notification of lapse