GB2046472A - Electro-optical connector - Google Patents

Electro-optical connector Download PDF

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Publication number
GB2046472A
GB2046472A GB8010815A GB8010815A GB2046472A GB 2046472 A GB2046472 A GB 2046472A GB 8010815 A GB8010815 A GB 8010815A GB 8010815 A GB8010815 A GB 8010815A GB 2046472 A GB2046472 A GB 2046472A
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GB
United Kingdom
Prior art keywords
optical
housing
connector
electro
chip
Prior art date
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Granted
Application number
GB8010815A
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GB2046472B (en
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NKF Groep BV
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NKF Groep BV
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Publication date
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Publication of GB2046472A publication Critical patent/GB2046472A/en
Application granted granted Critical
Publication of GB2046472B publication Critical patent/GB2046472B/en
Expired legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

An electro-optical connector is provided in which an electro-optical element 4, accommodated in a housing 1, may be coupled to a light-conductive element 11. In order to obtain a small contact region with suitable optical and electrical conditions, the housing 1 is provided with openings 2, 2b for accommodating the electrical and optical parts which comprise guide means 3, 2a, 2d which reliably align the electrical and the light-conductive element 4, 11 with respect to each other (Figure 1). <IMAGE>

Description

SPECIFICATION Electro-optical connector The invention relates to an electro-optical connector for an optical fibre, comprising a housing which encloses an electro-optical element and which comprises at least two electrical connections and at least one optical connection.
It is known to couple circuits to a further circuit by way of a light transmitter, a light-conductive element and a light receiver, so that the signals derived from the transmitting circuit are transferred to the receiving circuit (German Offenlegungsschrift 2707 190).
This proposal leaves the choice of the technical means for the light/electrical coupling open. A relevant proposal is made in German Offenlegungsschrift 27 24850. This proposal concerns an opto-electronic arrangement for the detachable connection of an electric circuit to a light-conductive element. The described element is voluminous, and its manufacture requires many individual parts and process steps. Moreover, only a simple connection is described.
German Offenlegungsschrift 27 36460 describes an opto-electric arrangement which comprises a guide tube and a housing in which a lens is accomodated. This arrangement is again voluminous. Further details of such arrangements are contained in German Offenlegungsschriften 2444 144,3703465 and 2746497. All said Offenlegungsschriften provide complex, detailed solutions.
It is also known to prepare a light-emitting diode (LED) for the coupling to light-conductive elements so that the plastics housing of an LED constructed for illumination purposes is partly destroyed, the optical fibre being manually connected to the fragmented surfaces in two bonding operations, see Opto-electronics Applications Manual, 1977, Hewlett-Packard Company, No. 34567890, HDHD 78654321098, page 2.53. The arrangement shown requires high accuracy and a substantial amount of time, and can virtually be realized only with thick optical fibres having a diameter of approximately 1 mm.
It is also known to bond light-sensitive or lightemitting chips to a metal plate and to feed out the required leads through the metal plate. In a known case, the front side of the chip is passed through a seal of transparent epoxy glass so that a plane parallel surface with respect to the chip is formed.
The mounting of the optical fibre in front of the chip requires high accuracy and a complex construction, because the light-emitting surface area of the chip is very small.
Mechanized mounting of the optical fibres is also known; on the metal bottom there is then provided a suitable metal tube on the light-emitting side of the chip, an optical fibre being glued in said tube in an insulating manner. This arrangement is complex as a result of the many separate parts and the necessary, mutually adapted process steps.
Also known is a proposal where a hole is etched into the light-emitting chip so that the optical fibre can be inserted into this hole. Arrangements of this kind can be used only for laboratory purposes, because series-wise application is precluded because of the great effort required.
The bodies to be exactly aligned with respect to each other in practice consist of very small chip plates comprising emitting or light-receiving surfaces on the one hand and the end surfaces of the optical fibres on the other hand. In order to obtain suitable coupling, a single matching medium should be present between the two surfaces, if possible. In the case of an emitting or receiving surface of GaAs, having a refractive index n=3.6 on the one side, and an end face of a quartz or plastics fibre on the other side, the desirable refractive index n of the matching medium is 1.8. Because such a refractive index cannot be readily realized from a technical point of view, an effect which is not as good but which is still acceptable is obtained with a somewhat lower refractive index, for example, n=1.54, for example, by means of epoxy resin.For the technical realization, moreover, a problem is encountered in realizing the conditions, theoretically known already from said German Offenlegungsschriften, to obtain suitable contact. This involves the limited space in an electronic circuit, notably when a group of optical conductors is to be coupled from this circuit instead of only a single optical conductor.
Therefore, the invention has for its object to provide, while maintaining optimum optical conditions on the one hand and while utilizing known manufacturing techniques for opto-electronic elements (chips) on the other hand, a contact region of small volume which can be accomodated in the small spaces available in electronic circuits in the case of a single optical conductor as well as in the case of several optical conductors.
This object in accordance with the invention is achieved in that the housing in constructed as one integral unit, consists of an electrically and possibly optically insulating material, and comprises at least two openings for accommodating the electrical and optical connections which are arranged axially one behind the other and which comprise guide means for mutual alignment of an electro-optical element and and a light-conductive element to be introduced.
A preferred embodiment in accordance with the invention is characterized in that in the opening for accommodating the electro-optical element there are provided abutments for the element or for its connections.
In accordance therewith abutments for the optical conductor may be provided in the openings accommodating said optical conductor.
In order to prevent losses, inside the housing there may be provided an optically active cavity which is filled with a transparent adhesive.
The refractive index of the material of the housing may be chosen in accordance with the invention so that it is lower than the refractive index of the adhesive which joins the surfaces, so that a total reflective intermediate element (link) is formed in the cavity between the fibre end face and the lightsensitive or light-emitting surface.
The housing may be made of materials having a refractive index which is lower than that of the adhesive. Proposed in this respect are: polyethylene, polypropylene, polytetrafluoroethylene, fluoroethylene-propylene, polyvinylchloride, silicon rubber, while the material of the adhesive, which at the same time fills the space between the fibre end face and the light-emitting or light receiving surface, may consist of expoxy resin or polyester resin. An outer body of metal, such as a zinc die cast, is also possible; the necessary electrical insulation is then provided by the epoxy resin adhesive.
The housing may be constructed to be so small that it can be fitted in a normal grid, for example, 1/10 inch grid or 2/10 inch grid in the case of transverse arrangement.
The contact pins, electrodes etc. emerging from the housing towards the electrical side can be bent to form an angular circuit, so that they fit within the standard dimensions of the board grid. The dimensions for chips and fibres are in the range of less than 1 mm, so that small deviations of the axes with respect to each other can already cause substantial variations of the coupling. Therefore, in order to fix the position of the parts with respect to each other, a collar having the size of a chip can be provided inside the housing, the chip being inserted in said collar so that the centre of the chip, the longitudinal axis of the housing and the axis of the fibre are identical. The exterior surfaces of the housing may be provided with connecting means for the linking of identical housings.
Some embodiments of the electro-optical connector in accordance with the invention will be described in detail hereinafter.
Figure 1 is a sectional view, at an increased scale, of an electro-optical connector in accordance with the invention.
Figure 2 shows, at a further increased scale, a second, special embodiment in accordance with the invention at the area of an LED and a glass fibre.
Figure 3 shows a part, at an increased scale, of a third, prepared electro-optical connector comprising the electrical part, but not the optical part.
Figure 4 is a plan view of a plurality of electrooptical connectors mounted on a printed circuit board.
Figure 5 is a side elevation of the electro-optical connectors shown in Figure 4.
Figure 6 shows an array of a plurality of interconnected connectors with a modified housing.
Figure 1 shows a housing 1 of a synthetic material which comprises a continuous bore 2. The bore 2 consists of a section 2a having a comparatively small diameter, and a section 2b having a larger diameter which amounts to a multiple of the smaller diameter.
The section 2a emerges as a funnel from the housing 1.
Between the sections 2a and 2b there is a further section 2d having an intermediate diameter, thus forming a shoulder 3.
In the section 2b of the bore 2 there is arranged an electro-optical transmission/receive element in the form of a chip 4, such as a diode or similar, so that it is situated exactly opposite the section 2a. On the one side, the chip 4 is connected, by means of an electric conductor Sin the form of a gold wire, to an electrode 6 by bonding, said electrode serving as a connection contact. On the other side, the chip 4 is electrically conductively bonded to an electrode 7.
The chip 4 is accommodated in a cavity 8 of the electrode 7 which acts as a concave mirror. The electrode 7 also comprises a retaining tooth 9. The electrodes 6 and 7 are initially held together by means of a comb 10 which is removed after mounting in the housing 1.
In order to establish the electro-optical connection, an optical fibre 11 is slid into the bore 2 so that it just projects into the section 2d. Axial fixation is realized by bonding to the section 2a of the bore 2. The chip 4 is introduced into the section 2b together with the electrodes 6 and 7 until the electrodes 6 and 7 abut against the shoulder 3 and the chip 4 is situated opposite the end face 11 a of the optical fibre 11.
After axial fixation, the sections 2b and 2d of the bore 2 are filled with an optically conductive adhesive 12. If desired, the fixation of the optical fibre 11 and the chip 4 can also be simultaneously performed in one step. When housing 1 is of a transparent material such as polystyrene, polymethylmethacrylate or similar, the instantaneous position of all parts with respect to each other can be observed very well during mounting. The section 2d of the bore 2 prevents the electrical conductor 5 from causing a short-circuit between the electrodes 6 and 7.
Figure 2 shows a modification of the housing 1 in accordance with the invention. Parts corresponding to Figure 1 are denoted by corresponding reference numerals, be it that they are provided with an index.
Between the sections 2a' and 2b' of the bore 2' a projecting collar 20 is formed. In the collar 20 there is provided a slit 21 for the electrical conductor 5' which is accommodated therein during mounting; thus, no short-circuiting can occur between the electrodes 6' and 7'. The cavity 8' is shown in a partly broken away view. The collar 20 projects slightly into the cavity 8' and comprises a flat protrusion 2e. The chip 4' is thus enclosed partly by the cavity 8' and partly by the protrusion 2e.
The end face 11 a' of the optical fibre 11 ' is situated directly over the chip 4'. The conductor 5' is bonded laterally, so that, unlike in Figure 1, the optical fibre 11' can be directly arranged on the surface of the chip 4', i.e. without an intermediate other medium.
This is also referred to as a "butt joint". The cladding 1 Ibis slightly shorter than the core 1 1c of the optical fibre 11'.
By choosing suitable materials having a different refractive index, it can be achieved that the bore 2a, i.e. the inner wall, has a refractive index n at the collar 20 which is lower than that of the adhesive 12' which fills the intermediate spaces. As a result, total reflection occurs. Joint differences between the optical fibre 11' and the surface of the chip 4' at the end face 11 a' are thus compensated for to such an extent that any energy radiated beyond the end face 11 a' of the optical fibre 11' is reflected inwards again and is at least partly radiated into the optical fibre 11 again.
The entire cavity is filled with the optically conductive adhesive 12' as has already been described with reference to Figure 1. The lower part of the bore 2' is narrowed for the guiding of the optical fibre 11'. The bore 2' may be filled with a different type of adhesive if it benefits the manufacturing efficiency to introduce first one of the two parts and fix it in advance.
Suitable adhesives in this respect are particularly fast adhesives on the basis of cyanocrylate.
Figure 3 shows a prepared, pre-assembled electrooptical connection which already contains the electrical parts but in which the optical fibre is still absent. Connectors of this kind can be prefabricated so that the required connections can be realized without difficulty outside the factory. The components corresponding to the Figures 1 and 2 are denoted by the same reference numerals, provided with an index.
The housing 1" comprises a bore 2" which changes over, via a conical transition zone 31, into an accurately proportioned cylindrical or conical neck bore 32. The section 2b' contains the electrode 7", the holding cavity 8" of which surrounds the chip 4" via the bonding mass. The bore 2b" is filled with a clear adhesive 12" which penetrates as far as the surface 33 in the bore 32. The adhesive 12" itself contains a wire bond 34. The housing 1" comprises a projecting collar 20' which retains the chip 4" in a recess 2e'. The adhesive 12" not only hermetically seals the chip 4", but also forms, by a suitable choice of the material, a short intermediate piece 35 which is formed above the surface of the chip 4" by the adhesive 12" by partial filling of the bore 32.If desired, the intermediate piece 35 can also be formed on the chip 4 prior to the introduction of the electrical part for protection purposes of said chip.
The material used for the housing 1" is a material having a refractive index which is lower than that of the adhesive 12". As a result, total reflection for energy rays emerging from the surface of the chip 4" occurs at the ends of the neck bore 32 underneath the surface 33. The surface 33 may be curved in order to obtain a lens effect.
If the electro-optical connector is used for optical reception, the reflection in the surface 33, the neck bore 32 and in the intermediate space 35 may be such that light rays emerging from the optical fibre, not shown in the drawing, are reflected onto the chip 4".
The electro-optical connector thus prepared in accordance with Figure 3 can be mounted in any environment simply by the filling of the bore 2" with adhesive and the subsequent introduction of the optical fibre. The surface 33 of the intermediate space 35 or the surface of the chip 4" which is critical for an optical connection is adequately protected by the bore 32. The adhesive used for bonding the optical fibre in the bore 2", moreover, may be optically adapted so that undesirable escaping of the light signal through the bore is reliably prevented.
The Figures 4 and 5 show a preferred arrangement of electro-optical connectors on a printed circuit board. The printed circuit board 41 comprises holes 42 and 43 which are constructed to form electrically conductive connection points by means of deposited copper tracks. The electrodes 11 and 13 are bent at right angles, as is shown from the side in Figure 5.
The bent electrodes are inserted into the holes 42 and 43 in whcih they are soldered down.
In Figure 6, on the sides of the housing 1"' there are provided connection means in the form of dovetail shaped recesses and projections 60; as a result, a connector housing can be composed, for example, for a multi-conductor flat lead or similar.

Claims (14)

1. An electro-optical connector, comprising a housing which encloses an electro-optical element and which comprises at least two electrical connections and at least one optical connection, characterized in that the housing is constructed as one integral unit, consists of an electrically and possibly optically insulating material, and comprises at least two openings for accommodating the electrical and optical connections which are arranged axially one behind the other and which comprise guide means for mutual alignment of the electro-optical element and a light-conductive element to be introduced.
2. A connector as claimed Claim 1, characterized in that in the opening for accommodating the electro-optical element there are provided abutments for the element or its connections.
3. A connector as claimd in Claim 1 or 2, characterized in that in the opening for accommodating the optical conductor there are provided abutments for the insulation thereof.
4. A connector as claimed in any of the Claims 1 to 3, characterized in that within the housing there is provided an optically active cavity which is filled with a transparent adhesive.
5. A connector as claimed in any of the Claims 1 to 4, characterized in that the refractive index of the material of the housing is lower than the refractive index of the adhesive which joins the surfaces, so that the cavity between the fibre end face and the light-sensitive or light-emitting surface shows total reflective walls.
6. A connector as claimed in any of the Claims 1 to 5, characterized in that the housing is made of materials having a refractive index which is lower than that of the adhesive.
7. A connector as claimed in any of the Claims 1 to 6, characterized in that the housing is adapted to a standard board-grid (1/10 inch grid or 2/10 inch grid).
8. A connector as claimed in Claim 7, characterized in that the contact pins emerging from the housing towards the electrical side are bent to obtain an angular circuit.
9. A connector as claimed in any of the Claims 1 to 8, characterized in that inside the housing there is provided a collar which has the size of a chip and in which the chip can be inserted, so that the axes of the chip, the housing and the optical fibre are identical.
10. A connector as claimed in any of the Claims 1 to 9, characterized in that on the exterior surfaces of the housing there are provided connection means (recesses, projections) for connection to identical housings.
11. An electro-optical connector substantially as described with reference to Figure 1 of the accom panying drawings.
12. An electro-optical connector substantially as described with reference to Figure 2 of the accompanying drawings.
13. An electro-optical connector substantially as described with reference to Figure 3 of the accompanying drawings.
14. An electro-optical connector substantially as described with reference to Figures 4 and 5 of the accompanying drawings.
GB8010815A 1979-04-03 1980-03-31 Electrooptical connector Expired GB2046472B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2913262A DE2913262C2 (en) 1979-04-03 1979-04-03 Electro-optical connector

Publications (2)

Publication Number Publication Date
GB2046472A true GB2046472A (en) 1980-11-12
GB2046472B GB2046472B (en) 1983-01-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB8010815A Expired GB2046472B (en) 1979-04-03 1980-03-31 Electrooptical connector

Country Status (5)

Country Link
JP (2) JPS5612780A (en)
DE (1) DE2913262C2 (en)
FR (1) FR2453555A1 (en)
GB (1) GB2046472B (en)
SE (1) SE455243B (en)

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EP0200021A1 (en) * 1985-04-12 1986-11-05 Schott Glaswerke Light-activated thyristor
EP0313956A2 (en) * 1987-10-24 1989-05-03 Alcatel SEL Aktiengesellschaft Optoelectric component and manufacturing method therefore
GB2230349A (en) * 1989-04-08 1990-10-17 Oxley Dev Co Ltd "fibre optic/led coupling".
US4968114A (en) * 1982-09-24 1990-11-06 U.S. Philips Corp. Method of manufacturing an optical transmitter or receiver device
EP0450560A2 (en) * 1990-04-03 1991-10-09 Sumitomo Electric Industries, Ltd. An optical device
EP0466975A1 (en) * 1990-07-16 1992-01-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor light-emitting device
WO1997015844A2 (en) * 1995-10-27 1997-05-01 Siemens Aktiengesellschaft Support arrangement for at least one sheathed optical fiber and method of producing the same
GB2312526A (en) * 1996-04-23 1997-10-29 Baillie Hamilton William John Light emitting device housed in a containment
WO2002012940A1 (en) * 2000-08-04 2002-02-14 Alcatel Optronics Uk Limited Device with optical fibre bending above minimum bend radius
EP1426802A3 (en) * 2002-12-05 2004-09-22 Schott Glas Apparatus for coupling of light into a lightguide

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DE3113146C2 (en) * 1981-04-01 1985-03-28 Siemens AG, 1000 Berlin und 8000 München Electro-optical module connector
DE3302373A1 (en) * 1983-01-25 1984-07-26 WAGO Verwaltungsgesellschaft mbH, 4950 Minden Switching installation terminal block
CA1247902A (en) * 1983-09-30 1989-01-03 Timothy R. Ponn Fiber optic connector assembly
JPH0830776B2 (en) * 1986-01-31 1996-03-27 京セラ株式会社 Optical communication module
DE4114156A1 (en) * 1991-04-30 1992-11-05 Burndy Deutschland CONNECTOR FOR LIGHTWAVE GUIDE
JP2005353816A (en) * 2004-06-10 2005-12-22 Olympus Corp Light emitting device, method for manufacturing the same, illuminant using the same, and projector

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DE2207900B1 (en) * 1972-02-19 1972-10-12 Messerschmitt-Bölkow-Blohm GmbH, 8000 München Coupling element for fiber optic cables
US3938177A (en) * 1973-06-25 1976-02-10 Amp Incorporated Narrow lead contact for automatic face down bonding of electronic chips
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US4968114A (en) * 1982-09-24 1990-11-06 U.S. Philips Corp. Method of manufacturing an optical transmitter or receiver device
EP0200021A1 (en) * 1985-04-12 1986-11-05 Schott Glaswerke Light-activated thyristor
EP0313956A2 (en) * 1987-10-24 1989-05-03 Alcatel SEL Aktiengesellschaft Optoelectric component and manufacturing method therefore
EP0313956A3 (en) * 1987-10-24 1990-02-07 Standard Elektrik Lorenz Aktiengesellschaft Optoelectric component and manufacturing method therefore
GB2230349A (en) * 1989-04-08 1990-10-17 Oxley Dev Co Ltd "fibre optic/led coupling".
EP0392741A2 (en) * 1989-04-08 1990-10-17 Oxley Developments Company Limited Fibre optic/LED coupling
EP0392741A3 (en) * 1989-04-08 1990-11-28 Oxley Developments Company Limited Fibre optic/led coupling
EP0450560A3 (en) * 1990-04-03 1992-05-20 Sumitomo Electric Industries, Ltd. An optical device
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EP0466975A1 (en) * 1990-07-16 1992-01-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor light-emitting device
US5105237A (en) * 1990-07-16 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor light-emitting device with partial encapsulation
WO1997015844A2 (en) * 1995-10-27 1997-05-01 Siemens Aktiengesellschaft Support arrangement for at least one sheathed optical fiber and method of producing the same
WO1997015844A3 (en) * 1995-10-27 1997-08-14 Siemens Ag Support arrangement for at least one sheathed optical fiber and method of producing the same
US6249637B1 (en) 1995-10-27 2001-06-19 Infineon Technologies Ag Holding configuration and method for producing a holding configuration for at least one sheathed optical fiber conductor
US6606445B2 (en) 1995-10-27 2003-08-12 Infineon Technologies Ag Method for producing a holding configuration for at least one sheathed optical fiber conductor
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Also Published As

Publication number Publication date
JPS63100855U (en) 1988-06-30
SE455243B (en) 1988-06-27
FR2453555A1 (en) 1980-10-31
GB2046472B (en) 1983-01-26
FR2453555B1 (en) 1984-12-14
JPS5612780A (en) 1981-02-07
DE2913262C2 (en) 1982-04-29
SE8002444L (en) 1980-10-04
DE2913262A1 (en) 1980-10-09

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