JP2001296457A - Optical transmitter-receiver - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small sized optical transmitter-receiver wherein an interval between a light emitting element and a light receiving element is narrowed and also to provide structure wherein a stable operation is realized even in a region exceeding 1 Gbps. SOLUTION: The optical transmitter-receiver 1 is provided with a receiving sub-module 4, a transmitting sub-module 2 and a housing 6 for housing these. The receiving sub-module 4 is provided with a receiving electronic circuit substrate 47 in which the light receiving element for receiving optical signals and an electronic circuit for processing output signals from the light receiving element are formed. The transmitting sub-module 2 is provided with a transmitting electronic circuit substrate 27 in which a light emitting element for transmitting optical signals and an electronic circuit for processing input signals to the light emitting element are formed. The housing 6 is provided with a receptacle 61 into which an optical connector accepting a receiving optical fiber and a transmitting optical fiber is fitted and also the receiving sub-module 4 and the transmitting sub-module 2 are attached to the housing. The receiving electronic circuit substrate 47 and the transmitting electronic circuit substrate 27 are oppositely arranged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical transceiver having a light emitting element and a light receiving element.

[0002]

2. Description of the Related Art An optical transceiver including a light receiving module for converting an optical signal transmitted by an optical fiber into an electric signal and outputting the same, and a light emitting module for converting an electric signal into an optical signal and sending it to the optical fiber, It is used for a data link using light as an information transmission medium, an optical communication system such as an optical LAN, and the like. As such a conventional optical transceiver, there is one having a configuration shown in FIG.

An optical transceiver 280 shown in FIG. 22 processes a TO type metal package 283, which is a semiconductor package fitted with an optical connector, and processes an electric signal corresponding to an optical signal transmitted to the optical connector or received from the optical connector. An electronic circuit board 281 on which an electronic circuit to be formed is formed, a resin mold portion 282 for fixing the TO-type metal package 283 and the electronic circuit board 281, and a lead pin 284 for connecting the electronic circuit board 281 to an external mounting board. It is configured. Although the light emitting element and the light receiving element are not shown in FIG. 22, they are respectively housed in the TO type metal package 283 and are protected from external electromagnetic noise.

[0004]

However, in the conventional optical transmitter / receiver 80, the electronic circuit board 81 extends in the plane direction, that is, the direction in which the light emitting element and the light receiving element are arranged. The spacing could not be reduced. As a result, there has been a problem that it is not possible to cope with a small optical connector.

Further, when the speed of the transmitted optical signal becomes higher than 1 Gbps, mutual electromagnetic noise between the light emitting element and the light receiving element or between the light emitting element driving circuit and the light receiving element driving circuit. Becomes remarkable, affecting the receiving sensitivity characteristics.

Accordingly, the present invention solves the above-mentioned problems, and provides a small-sized optical transceiver in which the distance between the light-emitting element and the light-receiving element is reduced, and also provides a structure that realizes stable operation even in a region exceeding 1 Gbps. The purpose is to:

[0007]

An optical transceiver according to the present invention includes a receiving sub-module, a transmitting sub-module, and a housing for housing these. The receiving sub-module has a receiving electronic circuit board on which a light receiving element for receiving an optical signal from a receiving optical fiber and an electronic circuit for processing an output signal from the light receiving element are formed. The transmitting sub-module has a transmitting electronic circuit board on which a light emitting element for transmitting an optical signal to a transmitting optical fiber and an electronic circuit for processing an input signal to the light emitting element are formed. The housing has a receptacle portion into which an optical connector that receives the receiving optical fiber and the transmitting optical fiber is fitted, and mounts the receiving sub-module and the transmitting sub-module. The optical transceiver is characterized in that the electronic circuit board for reception and the electronic circuit board for transmission are arranged to face each other. In this way, by opposing the electronic circuit board for reception and the electronic circuit board for transmission, the electronic circuit board for reception and the electronic circuit board for transmission can be arranged close to each other.

[0008] The optical transceiver may further include an electric shield disposed between the receiving sub-module and the transmitting sub-module. By providing the electric shielding plate in this way, it is possible to reduce the influence of electromagnetic noise generated between the receiving sub-module and the transmitting sub-module. It is preferable that the electric shield plate is constituted by a conductive plate having a ground terminal.

In the above optical transmitter / receiver, the housing is combined with the base portion for covering the receiving sub-module and the transmitting sub-module for mounting the receiving sub-module and the transmitting sub-module. And a conductive housing cover, the housing cover having a ground terminal. As described above, the receiving sub-module and the transmitting sub-module are covered with the conductive housing cover, and the housing cover has the grounding terminal. Can be reduced.

In the above-mentioned optical transceiver, the receiving sub-module is a metallic receiving sub-assembly having a receiving sleeve for accommodating a light receiving element and engaging a receiving ferrule provided at the tip of a receiving optical fiber. The transmitting sub-module further includes a metallic transmitting sub-assembly having a transmitting sleeve for housing the light emitting element and engaging with a transmitting ferrule provided at the tip of the transmitting optical fiber. Preferably, the receptacle part is fitted with an optical connector that receives the reception ferrule and the transmission ferrule.

In the above optical transceiver, the receiving subassembly may include a metal stem, a metal lens holder which is resistance-welded to the metal stem, and a metal receiving sleeve. .

By adopting a configuration in which metal members are combined as described above, the work of aligning the light receiving element and the optical fiber is facilitated, and also effective against electromagnetic noise.

[0013] In the above optical transceiver, the light receiving element may be mounted on a parallel plate capacitor mounted on a metal stem.

By mounting the light receiving element on the parallel plate capacitor as described above, it is possible to reduce the area of the stem and to effectively perform the electromagnetic noise bypass function even for signals exceeding 1 Gbps. .

In the above-mentioned optical transceiver, the receiving sub-assembly has five external lead pins, and the receiving electronic circuit board and the receiving electronic circuit board are arranged such that the length of the grounding lead pin provided at the center of the metal stem is minimized. May be connected.

By adopting such a configuration, 1
Immunity to high-frequency electromagnetic noise exceeding Gbps can be improved.

In the above optical transceiver, it is preferable that the receiving assembly and the transmitting subassembly have an operation speed of 1.00 Gbps or more.

In the above optical transceiver, the transmitting subassembly includes: a metal stem; a metal lens holder resistance-welded to the metal stem; an alignment member laser-welded to the metal lens holder; A transmission sleeve laser-welded to the member may be provided.

By adopting such a configuration, the work of aligning the light emitting element and the optical fiber becomes easy, and the light emitted from the light emitting device can be efficiently guided to the optical fiber. In addition, the configuration in which metal members are combined effectively acts on electromagnetic noise.

In the above optical transceiver, the transmission sleeve preferably includes a fiber stub, a sleeve for holding the fiber stub, a metal bush for holding the sleeve, and a protection member for holding the bush and the sleeve.

In the above-mentioned optical transceiver, a central portion of the metal stem may be inclined with respect to a common optical axis connecting the sleeve, the fiber stub, and the lens holder.

By adopting such a configuration, the reflected light from the surface of the light receiving device mounted on the inclined surface for monitoring the back light of the light emitting device does not return to the light emitting device again. Therefore, the light emitting device can be stably operated even in a high frequency range.

In the above optical transceiver, it is preferable that the metal stem has at least three lead pins, and at least one of the lead pins is electrically connected directly to the metal stem. Also, the transmission subassembly is 1.0 Gbps
It is preferable to have the above operation speed.

According to a fifteenth aspect of the present invention, there is provided an optical transceiver comprising: (1) a first optical-electrical conversion device;
A housing. The first optical-to-electrical conversion device can convert one of the optical signal and the electrical signal to the other. (2) the housing comprises: (2a) a first receptacle provided to receive the optical connector; (2b)
A first receptacle for electrically shielding the first receptacle;
And (2c) a second shield member for electrically shielding the first photoelectric conversion device. In this optical transceiver, the first shield member is separated from the second shield member.

A first shield member for electrically shielding the first receptacle is electrically separated from a second shield member for electrically shielding the first photoelectric conversion device. With the provision, the electromagnetic influence exerted on the first shield member can be reduced from being directly transmitted to the second shield member.

The features according to the present invention described below can be arbitrarily combined, whereby the respective actions and effects and the actions and effects obtained by the combination can be enjoyed.

In the optical transceiver according to the present invention, (2) the housing may include (2c) an insulating member for electrically insulating the first shield member from the second shield member. The electrical insulation between the first shield member and the second shield member can be reliably performed by the insulating member.

In the optical transceiver according to the present invention, (2) the housing includes (2d) a receptacle member provided with the first receptacle, and (2e) a mounting member for mounting the first optical-electrical conversion device; Can be provided. The first shield member may include a conductive member provided on the receptacle member. If the first shield member is provided on the receptacle member, the first shield member serves to reduce noise radiated from the receptacle. Further, the second shield member may include a conductive cover member that sandwiches the first photoelectric conversion device between the second shield member and the mounting member. If the second shield member has a covering member,
This is effective for reducing radiation noise from the first photoelectric conversion device.

In the optical transceiver according to the present invention, the second shield member may have a terminal provided so as to protrude from the board mounting surface of the housing. This terminal can be used to connect the second shield member to a reference potential line of a mounting member on which the optical transceiver is to be mounted. In the optical transceiver according to the present invention, the second shield member may be connected to a reference potential line of the first photoelectric conversion device. Stable shielding performance can be obtained regardless of the electrical arrangement of the optical transceiver.

In the optical transceiver according to the present invention, (2) the housing may have (2f) a conductive terminal member. (2f) The terminal member may have a contact portion provided so as to be electrically connectable to the first shield member, and a terminal provided so as to protrude from the board mounting surface of the housing. The terminal member can be used to electrically connect the first shield member to a reference potential line of a housing of the device that houses the optical transceiver.

In the optical transceiver according to the present invention, (3) the second
May further be provided.
(2) The housing has a second receptacle provided so as to receive the (2g) optical connector. The second opto-electronic conversion device can convert an optical signal and an electric signal from one to the other. The second opto-electrical conversion device is housed in the housing so as to be optically connectable in the second receptacle. The second receptacle is electrically shielded by the first shield member. The second photoelectric conversion device is electrically shielded by the second shield member.

With this configuration, even in an optical transceiver including a plurality of optical-electrical conversion devices, the first shield member for electrically shielding the first receptacle is affected by the first optical member. -Direct propagation to the second shield member for electrically shielding the electronic conversion device can be reduced.

In the optical transceiver according to the present invention, the first shield member is provided so as to be able to electrically shield between the first optical-electrical conversion device and the second optical-electrical conversion device. ing. Thereby, while reducing the radiation noise from the first and second photoelectric conversion devices,
Mutual interference between the first photoelectric conversion device and the second photoelectric conversion device is also reduced.

In the optical transceiver according to the present invention, the first shield member may include a plating film provided on the receptacle member. A conductor for shielding can be realized by the conductive film provided on the surface of the receptacle member. This configuration is effective for reducing radiation noise from the receptacle.

[0035]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an optical transceiver according to the present invention will be described below in detail with reference to the drawings. In the description of the drawings, the same elements will be denoted by the same reference symbols, without redundant description. Also, the dimensional ratios in the drawings do not always match those described.

(First Embodiment) FIG. 1 is a perspective view showing an optical transceiver 1 according to this embodiment, and FIG. 2 is an exploded perspective view of the optical transceiver 1 according to this embodiment.

First, the outline of the optical transceiver 1 of the present embodiment will be described. As shown in FIG. 1, the optical transceiver 1 of the present embodiment has a substantially rectangular parallelepiped shape, and a receptacle provided at one end thereof. It has a portion 61 and external lead pins 44 protruding from the lower surface in FIG.

Next, each component of the optical transceiver 1 will be described. As shown in FIG. 2, an optical transceiver 1 according to the present embodiment includes a transmitting sub-module 2 for transmitting an optical signal, a receiving sub-module 4 for receiving an optical signal, and a housing 6 (a housing main body 60) to which these are mounted. And a receptacle portion 61 and a cover 70).

The transmission sub-module 2 includes a cylindrical metal sleeve (corresponding to a “transmission sleeve” in the claims) 22, and a cylindrical metal sleeve integrated with the sleeve 22. The transmission sub-assembly 25 includes a lens holder 21, a disk-shaped metal stem 23, and a transmission circuit board 27. The transmission subassembly 25 and the transmission circuit board 27 are electrically connected by a plurality (three in this case) of external lead pins 24 protruding from the metal stem 23 of the transmission subassembly 25. Here, the sleeve 22
It has an inner diameter into which a ferrule having a diameter of 1.25 mm can be inserted.

The receiving sub-module 4 comprises a cylindrical metal sleeve 42, a cylindrical metal lens holder 41 connected to the sleeve 42, and a disk-shaped metal stem 43. Assembly 45
And a receiving circuit board 47. The receiving sub-assembly 45 and the receiving circuit board 47 are electrically connected by a plurality (here, five) of external lead pins 48 protruding from the metal stem 43 of the sub-assembly 45. Here, the sleeve 42 has the same inner diameter as the sleeve 22 provided on the transmission subassembly 25.

Next, the receiving sub-assembly (ROSA) 45 will be described with reference to FIG.

FIG. 3 is a partial sectional view showing the receiving sub-assembly 45. The receiving sub-assembly 45 has a structure in which a metal sleeve 42, a metal lens holder 41, and a metal stem 43 are stacked along one optical axis X2. Opening 42a of sleeve 42
In order to smoothly engage the ferrule, the inner diameter of the ferrule extends outward (upward in FIG. 3). The center portion 42b has a constant diameter, and the inner diameter is the narrowest at the deepest portion 42c. A step is provided at the boundary between the central portion 42b and the deepest portion 42c, and when the tip of the ferrule abuts on the step surface 42d,
The position of the tip surface of the optical fiber is determined. Sleeve 42
Is generally used as the material.

The lens holder 41 has a cylindrical shape.
It has an opening 41a and a central portion 41b. The lens 46 is housed in the opening 41a. As the lens 46, a glass lens, a plastic lens, or the like can be employed. FIG. 3 shows a case of a spherical lens, but the lens 46 is not limited to a spherical lens. Lens 46
Is fixed to the lens holder 41 with an adhesive.
Electronic components such as a light receiving element 49a, a receiving preamplifier 49b, and a die cap are housed in the hollow portion 41b. The fixing of the lens holder 41 and the sleeve 42
The welding is performed by welding three places on the outer periphery of the second part. The material of the lens holder 41 is generally stainless steel.

A stem 43 made of metal is connected to the rear of the lens holder 41 (below in FIG. 3). Stem 4
3, a semiconductor light receiving element 49a, a light receiving preamplifier 49
b and other electronic components. A plurality of (five in this case) lead pins 48a to 48
e is protruding. Lead pin 48c at the center of stem 43
Are in direct electrical contact with the stem 43, but the other lead pins (48a, 48b, 48d, 48e) are insulated from the stem 43.

FIG. 4 is a view showing electronic components arranged on the stem 43. Of the lead pins (48a to 48e), four lead pins (48a, 48b, 48d, 48) other than the pin 48c electrically connected directly to the stem 43.
e) protrudes above the stem 43. The insulation between the lead pin and the stem 43 is performed by a known technique, for example, a method such as glass sealing. Four electronic components are mounted on the stem 43. That is, the light receiving element 49a,
A receiving preamplifier 49b and two parallel plate capacitors (49c, 49d). The light receiving element 49a is the first
Is mounted on the parallel plate capacitor 49c. A metal wiring pattern is formed on the upper surface electrode of the capacitor 49c, and the light receiving element 49a is mounted on the wiring pattern.

The light receiving element 49a is a surface light receiving type InGaAs.
It is an s-PIN photodiode or the like and has sensitivity to light having a wavelength in the 1.3 μm band. By adjusting the composition using the same material, a photodiode having sensitivity to light in the 1.55 μm band can be obtained. The surface of the light receiving element 49a has a light receiving surface 49g, a first electrode 49e, and a second electrode 49f. Since the diameter of the light receiving surface 49g is 50 μm, the junction capacity can be reduced.

The first electrode 49e of the light receiving element 49a is wire-bonded to the upper electrode of the first capacitor. The second electrode 49f is directly wire-bonded to one of the surface metal patterns of the receiving preamplifier 49b. Two of the surface metal patterns of the receiving preamplifier 49b are wire-bonded to the lead pins 48a and 48b, and an output signal can be taken out from the two lead pins 48a and 48b. Preamplifier for reception 4
The other metal pattern 9b is directly wire-bonded to the stem 43, electrically connected to a lead pin 48c (not shown in FIG. 4), and supplies a negative power supply to the amplifier 49b. The power supply on the positive side is a lead pin 48e,
The receiving preamplifier 4 is connected via the second capacitor 49d.
9b.

As described above, the two capacitors 49c, 49
d, a light receiving element 49a and a receiving preamplifier 49b
In addition to supplying power to the lens, the light receiving element 49a is mounted on the parallel plate capacitor 49c, the stem 43 is made of metal, and the lens holder 41 that covers the space for mounting these electronic devices is also made of metal. The electromagnetic shielding function is exhibited. This makes it possible to stabilize the operation of the light receiving subassembly (ROSA) even at a signal speed exceeding 1 Gbps.

FIG. 5 is a diagram showing a circuit diagram of the receiving subassembly 45. When the signal light is input to the light receiving element 49a, the input signal light is subjected to optical-electrical conversion and output as a photocurrent signal. The output photocurrent signal is input to the receiving preamplifier 49b. Preamplifier for reception 4
9b, at the same time as performing the current-voltage conversion, generates complementary signals having a phase different from that of the photocurrent signal by 180 °, and outputs the signals as Out and OutB, respectively. The power supply voltage Vpd is supplied to the cathode of the light receiving element 49a via the lead pin 48d.
Is supplied. On the other hand, the power supply voltage Vcc on the positive side of the receiving preamplifier 49b is supplied from the lead pin 48e. The negative power supply voltage Vee is supplied from a lead pin 48c directly connected to the stem 43.

FIG. 6 is a sectional view showing the structure of the transmitting subassembly 25. Three lead pins 24a to 24c
A metal stem 23 having a metal lens holder 2
1, a sleeve 22, and an alignment member 28. These components share the optical axis X1. The surface of the stem 23 is provided with a device mounting convex portion 23a for aligning the light emitting end surface of the edge light emitting device with the optical axis, and the convex portion 23a is provided on the light emitting element 23 via a chip carrier 23d.
b. The surface of the stem 23 facing the optical axis X1 is inclined with respect to the optical axis X1, and the light emitting element 23b
The light receiving photodiode 23c for monitoring the back light of the light source is mounted on the inclined surface. Since the light receiving photodiode 23c is mounted on the inclined surface, the light receiving photodiode 23c is mounted.
The back light reflected on the surface of the light emitting element 23c
It is possible to suppress returning to.

On the stem 23, the semiconductor device 23
A metal lens holder 21 having a space for accommodating b and 23c is resistance-welded. A glass ball lens 26 is fixed to a position corresponding to the optical axis X of the lens holder 21 by a seal glass 26a. Seal glass 26
a completely seals the device storage space. For this reason,
The semiconductor devices 23b and 23c are not exposed to the air or the like, and the long-term reliability of the transmission subassembly 25 can be improved. The material of the lens holder 21 is generally stainless steel.

A centering member 28 is fixed so as to cover the upper part of the lens holder 21. The centering member 28 has a first opening facing the lens holder 21 and the fiber stub 22a.
It has a second opening facing (described later). The inner diameter of the first opening substantially matches the outer diameter of the lens holder 21, and the lens holder 21 is housed in the first opening.
By finely moving the lens holder 21 along the optical axis X in the first opening, the distance between the end face of the fiber stub 22a and the light emitting end face of the light emitting element 23b can be adjusted, and the Z axis ( (In the direction parallel to the optical axis X1). After the alignment, the alignment member 28 and the lens holder 21 are fixed by laser welding the thin portion 28a of the alignment member 28.

The sleeve 22 is fixed on the upper surface of the alignment member 28. The sleeve 22 has a fiber stub 22a having an end face aligned with zirconia by penetrating the optical fiber 22b from the inside into a central portion of a material using an oxide such as zirconia (ZrO) and polishing the same simultaneously with zirconia;
Split sleeve 22 having this fiber stub 22a penetrated
c and a bush 22d for protecting the split sleeve 22c
And a protection member 22e. The length of the fiber stub 22a is approximately half the length of the split sleeve 22c. The end face of the fiber stub 22a facing the lens 26 is polished so as to have a significant angle with respect to the optical axis. Even if the light emitted from the light emitting element 23b is reflected by this end face, the optical axis X1 The light is reflected in a direction different from that of the light emitting element 23b to prevent the reflected light from returning to the light emitting element 23b. The insertion and fixing of the fiber stub 22a to the split sleeve 22c, the insertion and fixing of the split sleeve 22c to the bush 22d, the insertion and fixing of the split sleeve 22c, and the fixing of the split sleeve 22c to the protection member 22e are all performed by press fitting.

The alignment of the sleeve 22 and the alignment member 28 is performed by the following method. First, stem 23
The light emitting element 23b mounted thereon is actually caused to emit light, and this light is monitored from an optical fiber via a connector (not shown) engaged with the sleeve 22. And sleeve 2
2 is a direction (XY) perpendicular to the optical axis X1 on the alignment member 28.
To determine the maximum optical coupling position. In this state, the bush 22d of the sleeve 22 and the upper surface of the alignment member 28 are laser-welded. Subsequently, the fixed sleeve 22 and the entire alignment member 28 are moved in a direction parallel to the optical axis X in the alignment member 28.
Of the lens holder 21 to perform fine adjustment in the Z-axis direction. When the optimum optical coupling position is determined, the thin portion 28a of the alignment member 28 and the lens holder 21 are laser-welded. In order to prevent misalignment due to mechanical distortion during welding, it is desirable to perform laser welding at a position symmetrical to the optical axis X1.

Description will be made with reference to FIGS. 1 and 2 again. The housing 6 in which the optical connector is fitted includes a housing main body 60 on which the sub-modules 2 and 4 are mounted, a receptacle portion 61 engaged with the housing main body 60, the transmission sub-module 2 and the reception sub-module 4, And a cover 70 for covering. The housing 6 has a substantially rectangular parallelepiped shape in a state where the cover 70 is combined with the housing main body 60. The housing body 60 is formed of an insulating plastic resin, and the cover 70 is formed of metal. The receptacle portion 61 has through holes 67 and 68 penetrating the inside and outside of the housing 6 in a direction parallel to the axis X3 shown in FIG. The outside of the housing 6 of the through holes 67 and 68 is shaped to fit with the optical connector.
The inside of the housing 6 has a shape into which the sleeves 22 and 42 provided in the transmission sub-module 2 and the reception sub-module 4 can be inserted. Two stat pins 63 (only one is visible in the figure) for fixing the optical transceiver 1 to a circuit board (not shown) are provided below the housing body 60 near the receptacle 61. . The stat pin 63 will be described later.

The transmitting sub-module 2 and the receiving sub-module 4 are respectively provided with the sleeves 2 provided therein.
As shown in FIG. 2, the transmission electronic circuit board 27 and the reception electronic circuit board 47 are arranged to face each other in order to reduce the distance between the electronic circuit boards 2 and 42. The sleeves 22 and 42 are inserted into the receptacle 61 from inside the housing 6, respectively. The external lead pin 44 is connected to the housing 6 through the opening.
It protrudes outside. The center interval between the sleeves 25 and 45 in the optical transceiver 1 of the present embodiment is 6.25 m.
m.

Between the transmitting sub-module 2 and the receiving sub-module 4 arranged as described above, a partition wall 64 which is a part of the housing body 60 is formed as shown in FIG. I have. A metal shield 65 made of a thin metal plate is fixed along the partition wall 64 on the side of the partition wall 64 where the receiving sub-module 4 is mounted.
As shown in FIG. 7, the metal shield 65 is integrated with a metal conductive member 66 provided at a lower portion of the housing main body 60 and the above-described stat pin 63 provided on the conductive member 66. The stat pin 63 also serves as a ground terminal for the metal shield 65.

As shown in FIG. 2, a metal cover 70 for covering the transmitting sub-module 2 and the receiving sub-module 4 has a ground terminal 71 to serve as an electromagnetic shield. . In the optical transceiver 1 of the present embodiment,
Although the cover 70 has the ground terminal 71, the cover 70 and the metal shield 65 may be brought into contact with each other at a predetermined position, so that the ground terminal may be the stat pin 63 alone.

As described above, the transmitting sub-module 2 and the receiving sub-module 4 are mounted on the housing body 60. Then, in this state, the cover 70 is closed so as to cover the transmission sub-module 2 and the reception sub-module 4, and the optical transceiver 1 of the present embodiment as shown in FIG. 1 is configured.

Next, the operation of the optical transceiver 1 according to this embodiment will be described. The optical transceiver 1 according to the present embodiment includes an optical LA
In an optical communication system such as N, it is used for an interface portion for transmitting and receiving an optical signal passing through an optical fiber. That is, the optical transceiver 1 is fitted with an optical connector in which the receptacle 61 receives the optical fiber, and the lead pins 44 projecting from the lower part of the optical transceiver 1 are electrically connected to the circuit board on which the optical transceiver 1 is mounted. Connected.

The optical signal passing through the optical fiber is received by the receiving sub-module 4 and converted into an electric signal, and the converted electric signal is transmitted to the circuit board through the lead pin 44. The transmission sub-module 2 converts an electric signal transmitted through a lead pin (not shown) of the transmission sub-module 2 into an optical signal, and converts the converted optical signal into an optical connector fitted to the receptacle 61. Through the optical fiber.

In the optical transceiver 1 of the present embodiment, the transmission sub-module 2 and the reception sub-module 4 have the electronic circuit boards 27 and 47 respectively provided facing each other. In the transmission sub-module 2, the transmission sub-assembly 25 and the transmission electronic circuit board 27 are arranged on the axis X1. In the receiving sub-module 4, the receiving sub-assembly 45 and the receiving electronic circuit board 47 are arranged on the axis X2. Therefore, the respective electronic circuit board surfaces 27, 4
The gap between the transmitting sub-assembly 25 and the receiving sub-assembly 45 can be narrowed by making the 7 oppose.
Thereby, the through hole 67 for inserting the sleeve 22 of the transmitting sub-module 2 and the receiving sub-module 4
The space between the through holes 68 for inserting the sleeve 42 can be narrowed, and the receptacle 61 can be made compact. As in the optical transceiver 1 of the present embodiment, the center distance between the sleeves is 6.25 mm, and the inner diameter of the sleeve is 1.25 m.
The optical transceiver 1 can be fitted with an LC connector which is widely used at present, as long as the ferrule has a size capable of inserting the m ferrule.
Can be realized.

The optical transceiver 1 of this embodiment has a metal shield 65 between the transmission sub-module 2 and the reception sub-module 4. Thus, when the optical signal is converted to an electric signal, the electromagnetic noise generated in the receiving sub-module 4 affects the transmitting sub-module 2, and conversely, when the electric signal is converted to the optical signal, the transmitting sub-module 2 can reduce the influence of the electromagnetic noise generated in the receiving sub-module 4 on the receiving sub-module 4. This is because when the electronic circuit boards 27 and 47 included in the transmission sub-module 2 and the reception sub-module 4 are opposed to each other and are arranged close to each other as in the optical transceiver 1 of the present embodiment, This is particularly effective because the effect of electromagnetic noise is expected to be large.

In the optical transceiver 1 of this embodiment, a cover 70 for covering the transmitting sub-module 2 and the receiving sub-module 4 is formed of metal, and this cover 70 has a ground terminal 71. ing. This makes it possible to reduce the influence of external electromagnetic noise on the transmission sub-module 2 and the reception sub-module 4 as compared with the case where the housing 6 is made of only plastic resin. In addition, a conventional light emitting element and a light receiving element have been used to protect the light emitting element and the light receiving element from external electromagnetic noise.
It is not necessary to use a semiconductor package of a die type, and the distance between the light emitting element and the light receiving element is not limited by the size of the semiconductor package.

(Second Embodiment) Next, an optical transceiver according to a second embodiment of the present invention will be described. The optical transceiver according to the second embodiment differs from the optical transceiver according to the first embodiment in that the optical elements and the electronic circuit board of the transmission sub-module and the reception sub-module are resin-molded.

FIG. 8 is a perspective view showing the optical transceiver 101 of this embodiment, FIG. 9 is an exploded perspective view of the optical transceiver 101 of this embodiment, FIG.
FIG. 11 is a partially exploded perspective view of the receiving assembly 4.

First, the outline of the optical transceiver 101 of this embodiment will be described. As shown in FIG. 8, the optical transceiver 101 of this embodiment has a substantially rectangular parallelepiped shape, and a receptacle provided at one end thereof. The external lead pin 44 protrudes from the lower surface in FIG. 8 (actually, the external lead pin 29 (see FIG. 9) also protrudes from the lower surface in FIG. 8, but cannot be seen in FIG. 8).

Next, each component of the optical transceiver 101 will be described. As shown in FIG. 9, the optical transceiver 101 of the present embodiment includes a transmission assembly 2 for transmitting an optical signal.
And a receiving assembly 4 for receiving an optical signal, and a housing 6 (consisting of a housing main body 60 and a housing cover 70) for mounting the same.

The transmitting assembly 2 includes a substantially flat electronic circuit sealing resin body 121 and a sleeve 1 extending from one side thereof in the longitudinal direction (the direction of the axis X1 in FIG. 9).
25, ten external lead pins 29 protruding from the electronic circuit sealing resin body 121 in a direction substantially perpendicular to the axis X1, and a side surface of the electronic circuit sealing resin body 121 substantially parallel to a transmission electronic circuit board 27 described later. It is composed of a volume adjusting electronic circuit board 122 adhered thereto and eight lead pins 123 bent at substantially right angles to fix the electronic circuit board 122 to the electronic circuit sealing resin body 121. Here, the sleeve 125 has an inside diameter into which a ferrule having a diameter of 1.25 mm can be inserted.

Next, the electronic circuit sealing resin body 121 will be described with reference to FIG. FIG. 10 is an exploded perspective view of the inside of the electronic circuit sealing resin body 121. The lead pins 123 and 29, which are not supported in FIG. 10, are fixed to the transmission electronic circuit board 27 by soldering. It is supported by the resin constituting the resin body 121.

The electronic circuit sealing resin body 121 of the transmission assembly 2 includes a light emitting element 129, a mount member 128 for mounting the light emitting element 129, and a transmission electronic element on which an electronic circuit for processing an electric signal input to the light emitting element 129 is formed. Circuit board 27
And a lead frame 130 as a transmission base on which these are mounted are sealed with resin. Light emitting element 129
Are mounted on a light emitting element mounting portion 131 provided on a lead frame 130 via a mounting member 128.
The light emitting surface 129a of the light emitting element 129 has an optical axis of emitted light directed in a direction along the axis X1.
9 and the sleeve 125 shown in FIG. 9 are connected by an optical waveguide (not shown). Here, as the light emitting element 129, InGaAs that outputs an optical signal in a 1.3 μm wavelength band is used.
A P light emitting diode, an InGaAs laser diode, or the like is used. Electronic circuit components such as ICs are mounted on the upper surface 27a of the transmission electronic circuit board 27 mounted on the substrate support 132 provided on the lead frame 130, and have a predetermined wiring pattern (schematically shown in FIG. 10). Are shown). This transmission electronic circuit board 2
7 and the substrate support 132 are bonded by a conductive adhesive or solder.

The electronic circuit board 122 for volume adjustment (see FIG. 9) and the electronic circuit board 27 for transmission
Is connected by a lead pin 123, and the volume of the light output from the light emitting element 129 can be adjusted by the volume adjustment electronic circuit board 122 even after the transmission electronic circuit board 27 is sealed with resin.

Next, the receiving assembly 4 will be described. As shown in FIG. 9, the receiving assembly 4 includes a light receiving unit 149 including a light receiving element 149a and a first-stage amplifier 149b.
Light-receiving element sealing resin body 141 sealing (see FIG. 11)
A substantially flat electronic circuit sealing resin body 142 sealing the electronic circuit board 47 for reception, and the light receiving element sealing resin body 14
1 and a sleeve 145 extending in the longitudinal direction of the electronic circuit sealing resin body 142 (the direction of the axis X2 in FIG. 9), and ten sleeves projecting from the electronic circuit sealing resin body 142 in a direction substantially perpendicular to the axis X2. The light-receiving element sealing resin body 141 and the electronic circuit sealing resin body 142 are electrically and mechanically connected by five hook-shaped lead pins 146. Further, the sleeve 145 has the same inner diameter as the sleeve 125 provided in the transmitting assembly 2.

Next, referring to FIG. 11, the light receiving element sealing resin body 141 and the electronic circuit sealing resin body 142 (hereinafter, the light receiving element sealing resin body 141 and the electronic circuit sealing resin body 142 are referred to as “sealing resin part”. "). FIG. 11 is an exploded perspective view showing the inside of the sealing resin portion. In FIG. 11, the lead pins 44 which are not supported are fixed to the receiving electronic circuit board 47 by soldering, and the resin constituting the sealing resin portion is used. Supported.

The sealing resin portion of the receiving assembly 4 includes a light receiving element 149a, a first-stage amplifier 149b, a mount member 148 for mounting the same, and an electronic circuit for processing an electric signal output from the first-stage amplifier 149b. The receiving electronic circuit board 47 and the lead frame 150 which is a receiving base on which these are mounted are sealed. FIG.
As can be understood from FIG. 11, the components inside the light receiving element sealing resin body 141 and the electronic circuit sealing resin body 142 are both mounted on one lead frame 150, and the light receiving element 149a
A part of the lead frame 150 is bent to direct the light receiving surface of the lead frame 150 in a direction perpendicular to the axis X2. This portion is the internal lead pin 146 in FIG. The light receiving element 149a is mounted on a light receiving element mounting portion 151 provided on the lead frame 150 via a mount member 148. As a result of the light receiving section 149 being mounted on the light receiving element mounting section 151, the optical axis of the light to be received by the light receiving element 149a is directed in the direction along the axis X2. Here, as the light receiving element 149a, an InGaAs-PIN type photodiode having sensitivity to an optical signal in a 1.3 μm wavelength band or the like is used. Also, the light receiving element sealing resin body 141
Is formed of a resin transparent to light in the 1.3 μm wavelength band, which is the light receiving wavelength of the light receiving element 149a. Also,
On the upper surface 47a of the receiving electronic circuit board 47 placed on the board supporting portion 152 provided on the lead frame 150,
An electronic circuit component such as an IC is mounted, and a predetermined wiring pattern (schematically shown in FIG. 11) is formed.
The receiving electronic circuit board 47 and the board support 152 are
It is bonded by a conductive adhesive or solder.

A description will be given with reference to FIGS. 8 and 9 again. The housing 6 into which the optical connector is fitted includes a housing body 60 having a receptacle 61 on one side, and a housing cover 70 covering the transmitting assembly 2 and the receiving assembly 4. The housing cover 70 has a substantially rectangular parallelepiped shape with the united state. Here, the housing body 60 is formed of an insulating plastic resin, and the housing cover 70 is formed of metal. The receptacle portion 61 provided on one side of the housing main body 60 has through holes 67 and 68 penetrating the inside and outside of the housing 6 in a direction parallel to the axis X3 shown in FIG. The outside of the housing 6 of the through holes 67 and 68 is shaped to fit with the optical connector, and the through holes 67 and 68
Inside the housing 6 of the transmission assembly 2 and the sleeve 125 provided on the reception assembly 4 respectively.
5 is insertable. Receptacle part 61
An optical transmitter / receiver 101 is provided below the housing body 60 in the vicinity.
Are provided with two stat pins 63 (only one of them is visible in the figure) for fixing the ッ ト to a circuit board (not shown). The stat pin 63 will be described later.

Transmission assembly 2 and reception assembly 4
Means the sleeve 1 provided on the transmitting assembly 2
25 and sleeve 1 provided on receiving assembly 4
As shown in FIG. 9, the surface 27a of the transmission electronic circuit board and the surface 47a of the reception electronic circuit board 47 are arranged to reduce the distance between the electronic circuit board 45 and the electronic circuit board 45. In FIG. 9, in order to clarify the direction in which the transmitting assembly 2 and the receiving assembly 4 are mounted on the housing 6, the transmitting electronic circuit board 27 and the receiving electronic circuit board 47 are each sealed with a resin. Although the bodies 21 and 42 are individually written, they are actually sealed in the electronic circuit sealing resin body 121 and the electronic circuit sealing resin body 142 in the illustrated direction, respectively. The sleeves 125 and 145 are the receptacle 6
1 is inserted from the inside of the housing 6 into the external lead pins 2.
Reference numerals 9 and 44 protrude outside the housing 6 from openings formed in the lower portion of the housing 6 main body. Note that the center interval between the sleeves 125 and 145 in the optical transceiver 101 of the present embodiment is 6.25 mm.

Between the transmitting assembly 2 and the receiving assembly 4 arranged as described above, a partition wall 64 which is a part of the housing body 60 is formed as shown in FIG. As in the case of the optical transceiver 1 according to the first embodiment, a metal shield 65 made of a thin metal plate is provided on the side of the partition wall 64 where the receiving assembly 4 is mounted.
Are fixed along the partition wall 64. Further, as shown in FIG. 9, the metal housing cover 70 covering the transmitting assembly 2 and the receiving assembly 4 has a ground terminal 71 to serve as an electromagnetic shield.

As described above, the transmitting assembly 2 and the receiving assembly 4 are mounted on the housing body 60, and in this state, the housing cover 70 is closed so as to cover the transmitting assembly 2 and the receiving assembly 4. The optical transceiver 101 of the present embodiment as shown in FIG.

Next, the operation of the optical transceiver 101 of this embodiment will be described. Optical transceiver 101 of the present embodiment
Is used for an interface for transmitting and receiving an optical signal passing through an optical fiber in an optical communication system such as an optical LAN. That is, the optical transceiver 101 has an optical connector in which the receptacle 61 receives the optical fiber, and the lead pins 29 and 44 projecting from the lower part of the optical transceiver 101 are mounted on the circuit board on which the optical transceiver 101 is mounted. Is electrically connected to

An optical signal passing through the optical fiber connected to the receptacle section 61 is received by the receiving assembly 4 and converted into an electric signal, and the converted electric signal is transmitted to the optical transceiver 1.
The signal is transmitted to the circuit board to which the optical transceiver 101 is connected through the lead pins 44 of the receiving assembly 4 of No. 01.
Further, the electric signal transmitted through the lead pin 29 of the transmitting assembly 2 is converted into an optical signal by the transmitting assembly 2, and the converted optical signal is transmitted from the optical connector fitted to the receptacle 61 to the optical fiber. .

In the optical transceiver 101 of this embodiment, the transmission assembly 2 and the reception assembly 4 have the electronic circuit boards 27 and 47 of the transmission assembly 2 and the reception assembly 4 facing each other. The transmitting assembly 2 includes a sleeve 125, a light emitting element 129, and a transmitting electronic circuit board 27 arranged on an axis X1, and the receiving assembly 4 includes a sleeve 145, a light receiving element 149a, and a transmitting electronic circuit board 47. Since they are arranged on X2, the space between the sleeves 125 and 145 can be reduced by making the respective electronic circuit board surfaces 27 and 47 face each other. Thereby, the through-hole 67 into which the sleeve 125 of the transmitting assembly 2 provided in the receptacle portion 61 is inserted and the sleeve 14 of the receiving assembly 4
The interval between the through holes 68 into which the holes 5 are inserted can be reduced. If the ferrule having a sleeve center interval of 6.25 mm and an inner diameter of the sleeve of 1.25 mm can be inserted as in the optical transceiver 101 of the present embodiment, it can be fitted with an LC connector currently widely used. The optical transceiver 101 can be realized.

Further, the optical transceiver 101 of the present embodiment
A metal shield 65 is provided between the transmitting assembly 2 and the receiving assembly 4. As a result, the electromagnetic noise generated in the receiving assembly 4 when converting the optical signal into the electric signal affects the transmitting assembly 2 and, conversely, the electromagnetic noise generated in the transmitting assembly 2 when converting the electric signal into the optical signal. The effect of the electromagnetic noise on the receiving assembly 4 can be reduced. This is because when the electronic circuit boards 27 and 47 of the transmission assembly 2 and the reception assembly 4 are opposed to each other and are arranged close to each other as in the optical transceiver 101 of the present embodiment, the electromagnetic noise This is particularly effective because the impact of the application is expected to be large.

The optical transceiver 101 of the present embodiment
A housing cover 70 that covers the transmitting assembly 2 and the receiving assembly 4 is formed of metal, and the housing cover 70 has a terminal 71 for grounding. This makes it possible to reduce the influence of external electromagnetic noise on the transmitting assembly 2 and the receiving assembly 4 as compared with the case where the housing 6 is made of only plastic resin. This eliminates the necessity of using a TO type semiconductor package which has been conventionally used to protect the light emitting element and the light receiving element from external electromagnetic noise, and the distance between the light emitting element and the light receiving element is reduced. You are no longer limited by size.

In the second embodiment, a transparent resin is used for the molding of the receiving electronic circuit board 47 constituting the receiving assembly 4, but an opaque black resin or the like may be used. When the receiving electronic circuit board 47 is molded with the transparent resin, the molding of the receiving electronic circuit board 47 and the molding of the light receiving element that needs to be molded with the transparent resin can be performed simultaneously. The black resin has better moisture resistance than the transparent resin, and has higher reliability against temperature change.

Further, it goes without saying that the inner diameter of the sleeve and the center distance of the sleeve may be changed.

(Third Embodiment) Next, an optical transceiver according to a third embodiment of the present invention will be described. FIGS. 12 to 14 show an optical transceiver 201 according to an embodiment of the present invention.

The optical transceiver 201 includes a housing 202
, A first optical-electrical conversion device 212, and a second optical-electrical
And an electric conversion device 214. Housing 20
2 is the housing member 204 and the receptacle member 20
6. The housing member 204 has a first
And second optical-to-electrical conversion devices 212 and 214 are supported. The receptacle member 206 is provided with receptacles 224 and 226 extending along a predetermined axis. The receptacles 224 and 226 are optical connectors
(For example, 252 in FIG. 17). The housing member 204 has a mounting member 208 and a cover member 210. The mounting member 208 mounts the light-electric conversion devices 212 and 214. Cover member 21
Numeral 0 is installed so as to sandwich the optical-electrical conversion devices 212 and 214 with the mounting member 208.

The housing 202, that is, the receptacle member 206, the mounting member 208, and the cover member 210
The optical-to-electrical conversion devices 212 and 2 are optically coupled to the optical connectors at the receptacles 224 and 226.
An accommodation space for accommodating 14 is defined.

The receptacle member 206 has an outer wall 228a and a partition wall 228b provided along a predetermined axis so as to define the receptacles 224 and 226. The partition wall 228b cooperates with the outer wall 228a to form the receptacle 2
24, 226 are provided. Each of the receptacles 224 and 226 has a guide hole 230 extending along a predetermined axis at a bottom portion 228c. The guide hole 230 guides the heads of the light-to-electricity conversion devices 212 and 214 so as to protrude into the receptacles 224 and 226 along a predetermined axis. The material of the receptacle member 206 is preferably formed of a synthetic resin material such as a liquid crystal polymer because it is easy to form a fine form.
A conductive member may be provided on the receptacle member 206 to enable electrical shielding. It is preferable that the receptacle member 206 be covered with a conductive film such as a plating film. Preferably, receptacle member 206 has its entire surface covered with a conductive material. Further, the receptacle member 206 can be formed of a metal material.

The receptacle member 206 can have a wall surface 228e provided between the heads of the photoelectric conversion devices 212 and 214 inserted into the respective guide holes 230. This wall surface 228e is effective for electrically shielding between the optical-electrical conversion devices 212 and 214.

[0092] The receptacle member 206 can have a recess 234a on one surface of the outer wall. The recess 234a can have a first engagement portion 234b for latching, and the first engagement portion includes, for example, at least one of a hole and a projection. The first engagement portion 234b can be used when the receptacle member 206 is fitted and fixed to the mounting member 208.

The receptacle member 206 is provided with an optical-electrical conversion device 212,
14 has a protection part 235 for protecting it. Protection part 2
Reference numeral 35 extends along a predetermined reference plane, and has a second engagement portion 235a for latch. In the second engagement portion 235a,
At least one of a hole and a projection is included. In the present embodiment, the second engaging portion is, but not limited to, an engaging hole. The protection unit 235 includes the mounting member 2
08 is guided to a guide recess provided on the outer wall of the mounting portion 208a. The engaging portion 235a is fitted to an engaging portion provided on an outer wall of the mounting portion 208a of the mounting member 208. The engaging portion includes at least one of a hole and a projection.

The mounting member 208 has a mounting portion 208a extending along a predetermined reference plane. The mounting section 208a includes:
It has a series of terminal pins 232a to enable electrical connection of the light-to-electric conversion devices 212, 214. The terminal pins 232a are provided on the bottom surface (substrate mounting surface) of the mounting portion 208a facing the mounting substrate (not shown).
It is bent at a predetermined position from the mounting surface a. The terminal pins 232a are arranged along the arrangement direction of the wiring boards 218, 222. In the present embodiment, the terminal pins 232
a is provided along a predetermined axis.

The mounting member 208 may have a wall 208b extending along a plane intersecting a predetermined reference plane. The wall 208b is provided on the mounting surface.
The wall 208b is provided with a light-to-electric conversion device 212, 214.
Are provided so as to separate the accommodation spaces. Therefore, if a conductive member (not shown) is provided along the wall 208b, it is effective to reduce the electric influence between the photoelectric conversion devices 212 and 214.

The mounting member 208 has a latch 208c supported at one end of the wall 208b. The latch portion 208c is provided with a latch piece extending along a predetermined reference plane, and the latch piece includes a receptacle member 20c.
No. 6 can have an engaging portion 208d fitted with the latching engaging portion 234b. This engaging portion 208d
May be at least one of an engagement hole and an engagement protrusion. The recess 234a of the receptacle member 206 serves to guide the latch piece.

First and second photoelectric conversion devices 2
Each of the 12, 214 is capable of converting one of the optical and electrical signals to the other. These include a semiconductor light receiving device that converts an optical signal into an electric signal and a semiconductor light emitting device that converts an electric signal into an optical signal. The semiconductor light receiving device can include a photoelectric conversion element unit and a first wiring board arranged along a predetermined axis. The semiconductor light emitting device can include an electro-optical conversion element unit and a second wiring board arranged along a predetermined axis.

The wiring boards 218 and 222 have component mounting surfaces 218a and 222a on which various electronic components are mounted and opposing surfaces 218b and 222b. Component mounting surface 218
a, 222a and the opposing surfaces 218b, 222b extend along a predetermined axis. The facing surfaces 218b and 222b
A conductive layer can be provided on almost the entire surface. This conductive layer is preferably connected to a reference potential line. The component mounting surfaces 218a and 222a are provided with a wiring layer for enabling electrical connection between the mounted components. The wiring boards 218 and 222 are also provided with connection pins (2 in FIGS. 16A and 16B) of the photoelectric conversion element or the photoelectric conversion element.
50) are inserted into first holes 218c and 222c, and second holes 218d and 222d into which lead terminals 232a provided in the housing member 204 are inserted. First hole 218c, 222c and second hole 218d, 222d
Penetrates from one of the component mounting surface and the opposing surface to the other. The first holes 218c and 222c are
8, 222 are provided on one side along a predetermined axis.
The second holes 218d and 222d are provided at one end of the wiring board extending along a predetermined axis.

The wiring boards 218 and 222 are
Preferably, 18a and 222a are arranged so as to face the side surface of the wall 208b. Thereby, radiation noise from components on the component mounting surfaces 218a and 222a is reduced by the conductive layers on the opposing surfaces 218b and 222b. The wiring boards 218 and 222 are arranged side by side with the wall 208b interposed therebetween. This is supported by the terminal pins 232a provided on the mounting member 208, and the cover member 21
This is realized by being sandwiched between the conductive piece 210f and the support portions 208h, 208i, 208j of the mounting member 208 by the elastic force of the conductive piece 210f of zero. Terminal pin 232a
Is connected to the conductive layers of the wiring boards 218 and 222, and thus can be used to connect the conductive layers of the wiring boards 218 and 222 to the reference potential line.

The cover member 210 and the mounting member 208 together with the first and second photoelectric conversion devices 21
2, 214 are sandwiched. The cover member 210 is preferably formed of a conductive material, or can include a conductive material on at least the surface. by this,
The cover member 210 serves to electrically shield the first and second photoelectric conversion devices 212 and 214 such as the wiring substrates 218 and 222.

The covering member 210 has side surfaces 210a, 21
0b, a lid 210c, and a rear surface 210d.
The side portions 210a and 210b are provided on the wall 2 of the mounting member 208.
08b along the optical-electrical conversion device 212,2
Fourteen wiring boards 218 and 222 are sandwiched from both sides.
Further, the side portions 210a and 210b are connected to the wiring board 218,
222 can be arranged to face the opposing surfaces 218b, 222b. The lid part 210c is mounted on the mounting part 208.
a and the side portion 21 on both sides of the lid portion 210c facing each other.
0a and 210b. The rear part 210d is
It is adjacent to the side portions 210a, 210b and the lid 210c, and intersects a predetermined axis along the direction in which the receptacles 224, 226 extend. The cover member 210 can also include a connection terminal 210e provided on at least one of the side surfaces 210a and 210b and the rear surface 210d. The connection terminal 210e is connected to the optical transceiver 20.
1 is provided so as to be connected to a reference potential line of the mounting substrate when the device 1 is mounted on the mounting substrate. by this,
Since the reference potential is applied to the cover member 210, the electric shield characteristics are reliably exhibited. Connection terminal 210e
Project from the substrate installation surface.

The side portions 210a and 210b are provided with one or a plurality of conductive pieces 210f. Conductive piece 210
f is bent from the plane including the side surface into the storage space.
This bending is caused by the fact that the conductive piece 210f is
Can be brought into contact with the opposing surfaces 218b and 222b of the By this contact, the conductive layer on the opposing surfaces 218b and 222b of the wiring boards 218 and 222 and the cover member 210
Are electrically connected.

The cover 210c has one or more openings 2
10 g is provided, and the opening 210 g preferably has a shape extending in a direction along a predetermined axis. Rear part 210
d is provided with one or a plurality of openings 210h,
10h preferably has a shape extending in a direction from the lid 210c to the mounting member 208. Referring to FIG. 14, one or more openings 208 are provided in the mounting portion 208a.
e are provided, and the openings 208 e are
Extending along the arrangement direction.

The covering member 210 is formed by wiring boards 218 and 22
Terminals can be provided for connection to the two ground potential lines, and the wiring boards 218 and 222 can be provided with connection electrodes for this purpose. Thereby, the optical transceiver 2
01, the cover member 210 and the signal ground line can be electrically connected.

Referring to FIGS. 15A to 15D,
The optical transceiver 201 includes a terminal member 236. The terminal member 236 has conductivity and is made of metal (for example, phosphor bronze).
It is preferable to be formed of such a conductive material. Thereby, a predetermined mechanical strength can be obtained while securing electrical connection.

The terminal member 236 includes a pair of connection terminals 236.
a, a pair of side portions 236b, a bridge portion 236c, and fixing portions 236d and 236e. The terminal member 236 is
The receptacles 224 and 226 are arranged so as to contact along the outer surface of the bottom portion 228c. Thus, the terminal member 236 is used to connect the receptacle member 206 to the reference potential line of the mounting board. Therefore, the terminal member 236 includes one or more connection terminals 236a extending in a direction along the terminal pins 232a. Connection terminal 2
36a is called a stud pin. For the terminal member 236 as in the present embodiment, the receptacle member 20
6 has a bridge portion 236c connecting the pair of terminals 236a through the bottom surface. The bridge portion 236c is housed in a concave portion 228f provided on the bottom surface of the receptacle member 206.

The terminal member 236 has a pair of side portions 236b having a contact surface that comes into contact with the outer frame of the guide hole 230. The pair of contact surfaces face each other, and the guide holes 2
Thirty outer frames are sandwiched from both sides. Side part 236b
Is connected at one end to the bridging portion 236c and extends in a direction crossing the bridging portion 236c. Side 236
b is provided to connect the pair of connection terminals 236a. With the side portion 236b, the bridge portion 2
36c and the connection terminal 236a can be spaced from each other.
36c can be determined independently. Further, the arrangement position of the connection terminal 236a can be determined without being limited by the shape of the receptacle member 206. The terminal member 236 further includes fixing portions 236d and 236e. The fixing portions 236d and 236e are provided at the other ends of the pair of side surface portions 236b. Fixed part 236d, 2
36e each has a fixing piece extending from one side toward the other side. One side of the fixing piece is in contact with the outer frame of the guide hole 230. The fixing piece, together with the bridging portion 236c, sandwiches the outer frame of the guide hole 230 from both sides.

In the terminal member 236, the bridge portion 236c is accommodated in the concave portion 228f, and the side portion 236a is formed in the guide hole 230.
And the fixing portion 236d,
One side of 236e is in contact with the outer frame of the guide hole 230, and is thereby held by the receptacle member 206.

Referring again to FIG. 13 and FIG.
An optical transceiver 201 in which the parts shown in FIG. 12 are assembled and completed is shown. Such an optical transceiver 2
1 schematically illustrates the procedure required to obtain 01. First, the semiconductor light receiving device and the semiconductor light emitting devices 212 and 2
Assemble 14 respectively. For this assembly, the photoelectric conversion element is fixed to the wiring board, and the electro-optical conversion element is fixed to the wiring board (arrow A in FIG. 12). Next, the receptacle member 206 and the terminal member 26 are plated respectively, and the receptacle member 206 and the terminal member 236 are assembled. The semiconductor light receiving device and the semiconductor light emitting devices 212 and 214 are attached to the mounting member 208 (arrow B in FIG. 12). Subsequently, these devices 212 and 21
The mounting member 208 with the attached 4 is fitted to the receptacle member 206 (arrow C in FIG. 12). Thereafter, the cover member 210 is fitted to the receptacle member 206 and the mounting member 208 so as to form an accommodation space (FIG. 1).
2 arrow D). This fitting is performed by the engaging portion 208g (for example, one of the concave portion and the convex portion) of the mounting member 208 and the engaging portion 210i (for example, one of the concave portion and the convex portion) shown in FIG.
Using the other of the concave portion and the convex portion).

In the preferred embodiment, the receptacle member 20
6 has a plating film on its surface, and the cover member 210 is formed of metal. The plating film is a receptacle 22
4, 226 serve as a first shield member for electrically shielding. The metal cover member 210 serves as a second shield member for electrically shielding the photoelectric conversion device. Also in such an embodiment, the mounting member 208 is formed of an insulating material. The mounting member 208 has an insulating projection 208f that electrically insulates the plating film of the receptacle member 206 and the metal covering member 210 in the assembled optical transceiver 201, and thus functions as an insulating member. are doing. That is, the first shield member and the second shield member are electrically separated by the mounting member 208. With this electrical separation,
A second electromagnetic shield is provided for electrically shielding the photoelectric conversion devices 224 and 226 due to the electromagnetic influence of the first shield member.
That is directly transmitted to the shield member.

Referring to FIGS. 16 (a) and 16 (b), first and second opto-electric conversion devices 212, 2
-Electric conversion element and electro-optical conversion element 2 included in 14
40 is shown. As an example of the photoelectric conversion element 244, there is a semiconductor light receiving element such as a photodiode (a pin photodiode or an avalanche photodiode). If the electro-optical conversion element 244 is illustratively shown,
There are semiconductor light emitting devices such as light emitting diodes and semiconductor lasers.

Photoelectric conversion element and electro-optical conversion element 24
4 can each be contained in a container 242, such as a package. The container 242 includes an element housing 242.
a, a guide portion 242b.

A photoelectric conversion element and an electro-optical conversion element 244 are hermetically sealed in the element accommodating portion 242a of the container 242. The element housing portion 242a has a base 242c formed of a metal material such as Kovar. Base 242
On c, a lens cap 242d made of a metal material such as stainless steel is mounted. Element housing 242
a has a window 24 fixed to a lens cap 242d.
8 are provided. The window 248 allows light associated with the photoelectric conversion element and the electro-optical conversion element 244 to pass therethrough, and may include a condenser lens. Lens cap 2
42d is inserted into a base 242c made of a metal material such as stainless steel. The base 242c can also have a connection pin 250 for making an electrical connection between the photoelectric conversion element and the photoelectric conversion element 244. The container 242 includes a wiring board 218 for each,
It is fixed to 222 via connection pins 250. The connection pins 250 are bent such that the optical axis 246 of the element 244 is along a predetermined axis.

The guide portion 242b has a guide member 242e made of a metal material such as stainless steel. The guide member 242e is fixed on the holder 242d.
A sleeve 242f made of a metal material such as stainless steel is arranged outside the guide member 242e. A split sleeve 242g formed of a material such as zirconia is housed in the guide member 242e. The split sleeve 242g is a stub 242 containing an optical fiber.
h is positioned. The split sleeve 242g is fixed to the sleeve 242f via a fixing member 242i.

FIG. 17 is a diagram of the optical transceiver 201 according to the present embodiment as viewed from the side. The optical connector 252 is inserted into the optical transceiver 201 from the direction of the arrow 251.

FIG. 18 shows a drawing of a section II in FIG. As is clear from this cross section,
The assembled optical transmitter / receiver 201 includes a mounting member 208, as clearly indicated as A and B in the figure.
The receptacle member 206 and the cover member 210 are electrically insulated, and similarly, the terminal member 236 and the cover member 210 are also electrically insulated. This optical transceiver 201
In this embodiment, an insulating convex portion 208f is provided between the receptacle member 206 and the cover member 210. The projection 208f is provided with the receptacle member 6, the mounting member 208,
When the cover member 210 is assembled and the housing is formed, the receptacle member 206 and the cover member 210 are formed.
To ensure insulation between them.

In the preferred embodiment, according to this embodiment, the plating film (first
237) and a metal cover member (second shield member) 210 are electrically separated. This electrical separation is effective for reducing noise emitted by the optical transceiver 201 and reducing bit errors due to external electrostatic noise.

As shown in FIG. 18, the shield member 23 extends along the wall 228e of the receptacle member 206.
8 is preferably provided. This shield member 238
Is disposed between the optical-electrical conversion devices 212 and 214, so that mutual interference between the optical-electrical conversion devices 212 and 214 can be reduced. by this,
Bit errors during reception and transmission are reduced.

According to the preferred embodiment, the shield 238 can be realized by a plating film formed on the surface of the receptacle member 206, or can be provided as a part of the terminal member 236. As the shield member 238, a conductive member separate from the receptacle member 206 and the terminal member 236 can be applied. In addition, another shield member can be provided along the wall 208b of the mounting member 208. With this shield, mutual interference between the optical-electrical conversion devices 212 and 214 is further reduced.

Referring to FIGS. 19A and 19B, the mounting board 262 is installed in the device 260. The optical transceiver 201, the electronic component 264, and the connection connector 266 are mounted on the mounting board 262. The connection connector 266 supplies a power supply and a ground potential to the mounting board 262 via the cable 268, and enables input / output of an electric signal. Apparatus 260 includes a conductive panel 260a having a panel opening 26 therein.
0b is provided. The opening of the receptacle member 206 of the optical transceiver 201 appears in the opening 260b. The mounting board 262 is fixed to the panel 260a by a conductive fixing member 270.

FIG. 19B is a cross-sectional view of the device 260 shown in the II-II cross section of FIG. 19A. Mounting board 2
Two electrically insulated grounded conductive layers 272 and 274 are formed on the back surface of 62. This mounting board 262
The optical transceiver 201 is mounted on the mounting surface of the optical transceiver 201.
The terminal pins 232a are respectively connected to a conductive layer for signals, a conductive layer for power supply, and a conductive layer 272 for grounding, and the connection terminal 210e is connected to the conductive layer 272 for grounding.
It is connected to the. Also, the connection terminal 2 of the terminal member 236
36a is connected to the conductive layer 274 for grounding.

As described above with reference to the preferred embodiment, the optical transceiver 201 includes the receptacle member 206 having the plating film 237 and the metal cover member 2.
10 are insulated from each other by an insulating mounting member 208. Therefore, the plating film 237 serving as a shield member of the receptacle member 206 is connected to the ground conductive layer 274, and the conductive layer 274 is connected to the panel 260 a via the fixing member 270. Optical-electrical conversion device 21
A cover member 210 for shielding the signal lines 2 and 214 is connected to a signal ground line 272, and is connected to a reference potential line via a connector 266 and a cable 268.

In the arrangements shown in FIGS. 19A and 19B, the electrostatic noise (ESD) resistance of the optical transceiver 201 according to the present embodiment was examined. This experiment measures an error bit when the capacitor is charged to a predetermined potential and the charged electric charge is discharged to the panel 260a in the above arrangement. In the measurement, the number of error bits for 10 discharge pulses was counted for several charging voltages. The polarity of the charge was taken to be positive and negative with respect to the reference potential. The results are shown in FIGS. 20 (a) and 20 (b). The circles indicate data of the optical transceiver that employs the shield separation structure as in the embodiment. On the other hand, the symbol ▲ indicates an experimental result for an optical transceiver without a shield separation structure. In an optical transceiver without separation, the applied voltage 20
When the voltage exceeded 0 V, a bit error occurred. However, in the optical transceiver of the present embodiment, the applied voltage 10
No bit error occurred until the voltage exceeded 00V.

FIGS. 21A and 21B show the results of measuring the noise radiation (EMI) characteristics of the optical transceiver according to the present embodiment. In these drawings, the horizontal axis represents the frequency, and the vertical axis represents the noise level in the unit of dB μV / m. This measurement was performed in an anechoic chamber, and the transmission and reception bit rates of the optical transceiver were 1.25 Gbps. The distance between the measurement sample and the measurement antenna was set to 3 m, and experiments were performed for the case where the antenna polarization plane was horizontal (Fig. 21 (a)) and the case where the antenna polarization plane was vertical (Fig. 21 (b)). It was conducted.

In FIGS. 21 (a) and 21 (b), level A indicates an allowable value when an operation margin for the optical transceiver is expected, and level B indicates an allowable value when no margin is expected. . In each case, the characteristics are at a practical level.

The embodiment described above has been made based on the following studies by the inventor. The examination is
It relates to how to balance EMI and ESD.

From the viewpoint of radiation noise (EMI) characteristics of the optical transceiver, the entire optical transceiver is covered with an electromagnetic shield member, and the opening of the device is closed with a receptacle member. It is desirable to connect the member to the ground potential line of the device housing.

On the other hand, from the standpoint of noise immunity (ESD) characteristics of the optical transceiver, it is desirable that the electromagnetic shield covering the optical transceiver is electrically separated from the housing ground line of the device.

However, there has been no optical transceiver that satisfies these two requirements. Thus, the present invention has been made to solve the problems thus found. The optical transceiver according to the preferred embodiment obtained as a result of this study can reduce the radiation noise from the panel opening of the device in which the optical transceiver is mounted, and has improved external noise resistance. . Further, the reduction in the receiving sensitivity of the receiving assembly due to noise from the transmitting assembly is reduced.

The inventor believes that the effects of the embodiment of the invention will be described as follows. In terms of radiated noise, the optical transceiver is a noise source that emits noise from the openings in the panel of the device. For this reason, the opening of the device panel should be as small as possible. However, there is a limit to reducing the opening. To achieve this, the receptacle is covered with a shield member. As a result, the effective aperture area for noise radiation can be reduced without reducing the aperture. On the other hand, from the viewpoint of resistance to electrostatic discharge, it is necessary to electrically separate a device housing such as a device panel to which a high voltage is likely to be applied from an electric circuit for handling small signals.
SD tolerance is improved. In order to realize a configuration satisfying this, the shield member for the receptacle and the photoelectric conversion device is separated.

As described above, the embodiments of the present invention have been described in detail, but the present invention is not limited to the above embodiments.

[0132]

According to the present invention, the transmission electronic circuit board, which is a component of the transmission sub-module, and the reception electronic circuit board, which is a component of the reception sub-module, can be arranged to face each other. . Thus, the transmission electronic circuit board and the reception electronic circuit board can be arranged close to each other, and the distance between the light emitting element and the light receiving element can be reduced.

A conductive plate is provided between the transmitting sub-module and the receiving sub-module, and a ground terminal is provided on the conductive plate. Thereby, the conductive plate acts as an electric shielding plate, and it is possible to reduce the influence of electromagnetic noise that the transmitting sub-module and the receiving sub-module mutually affect.

Further, the housing cover of the housing constituting the optical transceiver is conductive, and this cover is provided with a ground terminal. Thus, the influence of external electromagnetic noise on the transmission assembly and the reception assembly can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an optical transceiver according to a first embodiment.

FIG. 2 is an exploded perspective view of the optical transceiver according to the first embodiment.

FIG. 3 is a partially exploded perspective view of a receiving sub-module.

FIG. 4 is a diagram showing an electronic component mounted on a stem.

FIG. 5 is a circuit diagram of a receiving sub-module.

FIG. 6 is a partially exploded perspective view of a transmission sub-module.

FIG. 7 is an exploded perspective view of a housing body.

FIG. 8 is a perspective view illustrating an optical transceiver according to a second embodiment.

FIG. 9 is an exploded perspective view of the optical transceiver according to the second embodiment.

FIG. 10 is a partially exploded perspective view of a transmission assembly.

FIG. 11 is a partially exploded perspective view of the receiving assembly.

FIG. 12 is a view showing main components constituting an optical transceiver according to a third embodiment.

FIG. 13 is a diagram illustrating an optical transceiver according to a third embodiment.

FIG. 14 is a diagram illustrating an optical transceiver according to a third embodiment.

FIGS. 15A to 15D are views showing a connection member and a receptacle member.

16 (a) and (b) are drawings showing an optical-electrical conversion device.

FIG. 17 is a side view showing an optical transceiver according to a third embodiment.

FIG. 18 is a cross-sectional view of the optical transceiver according to the third embodiment taken along line II.

FIGS. 19 (a) and (b) are diagrams showing an embodiment in which the optical transceiver according to the embodiment is mounted on an apparatus.

FIGS. 20 (a) and (b) are drawings relating to noise resistance of an optical transceiver according to a third embodiment.

FIGS. 21 (a) and (b) are drawings relating to radiation noise characteristics of an optical transceiver according to a third embodiment.

FIG. 22 is a perspective view showing a conventional optical transceiver.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Optical transceiver, 2 ... Transmission submodule, 4 ...
Reception sub-module, 6 ... Housing, 21 ... Lens holder, 26 ... Glass ball lens, 26a ... Seal glass, 22 ... Sleeve, 22a ... Fiber stub, 2
2b ... optical fiber, 22c ... split sleeve, 22d ...
Bush, 22e: Protective member, 23: Stem, 23a
... Device mounting protrusions, 23 b.
c: light receiving photodiode, 23d: chip carrier, 24a to 24c: lead pin, 25: transmission subassembly, 26: lens, 26a: seal glass,
27 ... transmission circuit board, 28 ... alignment member, 28a ...
Thin portion, 29: external lead pin, 41: lens holder, 42: sleeve, 43: stem, 44: external lead pin, 45: receiving sub-assembly, 46: lens 47, receiving circuit board, 48a to 48e, lead pin, 49a, light receiving element, 49b, receiving preamplifier, 49c, 49d, parallel plate capacitor, 49e,
A first electrode, 49f... A second electrode, 49g.
60 ... housing body, 61 ... receptacle part, 63
... Stat pin, 64 ... Partition wall, 65 ... Metal shield, 66 ... Conductive member, 67, 68 ... Through hole, 70 ...
Cover, 201: optical transceiver, 202: housing, 2
04 ... accommodation member, 206 ... receptacle member, 208 ...
Mounting member, 210: covering member, 212, 214: light-electric conversion device, 218, 222: wiring board, 224,
226 ... receptacle, 234 ... terminal member.

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Toshio Mizue 1-term Taya-cho, Sakae-ku, Yokohama-shi, Kanagawa F-term (reference) in Yokohama Works, Sumitomo Electric Industries, Ltd. 2H037 AA01 BA03 BA12 DA04 DA05 DA06 DA15 DA33 DA35 DA40 5F073 AB15 AB27 AB28 CA07 EA14 EA27 FA02 FA06 GA24 5F088 AA01 BA02 BA03 BA15 BB01 JA12 JA14 JA20 LA01 5K002 AA05 AA07 BA31 CA02 DA05 FA01

Claims (24)

[Claims] 1. A receiving sub-module comprising: a light receiving element for receiving an optical signal from a receiving optical fiber; and a receiving electronic circuit board on which an electronic circuit for processing an output signal from the light receiving element is formed; A transmitting sub-module having a transmitting electronic circuit board on which a light emitting element for transmitting an optical signal to an optical fiber and an electronic circuit for processing an input signal to the light emitting element, the receiving optical fiber and the transmitting light An optical connector that receives a fiber has a receptacle part fitted therein, and further includes a housing in which the reception sub-module and the transmission sub-module are mounted.The reception electronic circuit board and the transmission electronic circuit board, Are arranged facing each other. 2. The optical transceiver according to claim 1, further comprising an electric shield disposed between the reception sub-module and the transmission sub-module. 3. The optical transceiver according to claim 2, wherein the electric shielding plate is a conductive plate having a ground terminal. 4. The housing is united with the base portion to cover the receiving sub-module and the transmitting sub-module, and to cover the receiving sub-module and the transmitting sub-module. The optical transceiver according to any one of claims 1 to 3, further comprising: a conductive housing cover, wherein the housing cover has a ground terminal. 5. The receiving sub-module is a metallic receiving sub-assembly having a receiving sleeve for accommodating the light receiving element and engaging a receiving ferrule provided at a tip of the receiving optical fiber. The transmitting sub-module further includes a metallic transmitting sub-assembly having a transmitting sleeve for accommodating the light emitting element and engaging with a transmitting ferrule provided at a tip of the transmitting optical fiber. 3. The optical transceiver according to claim 2, wherein the receptacle part is fitted with an optical connector that receives the reception ferrule and the transmission ferrule. 4. 6. The receiving subassembly according to claim 6, further comprising: a metallic stem; a metallic lens holder resistance-welded to the metallic stem; and the metallic receiving sleeve. 6. The optical transceiver according to 5. 7. The optical transceiver according to claim 5, wherein the light receiving element is mounted on a parallel plate capacitor mounted on the metal stem. 8. The receiving sub-assembly includes five external lead pins, and is connected to the receiving electronic circuit board so that the length of a grounding lead pin provided at the center of the metal stem is minimized. The optical transceiver according to claim 5, wherein the optical transceiver is connected between the optical transceivers. 9. The transceiver according to claim 5, wherein the receiving assembly and the transmitting sub-assembly have an operation speed of 1.00 Gbps or higher. 10. The transmission sub-assembly, a metal stem, a metal lens holder resistance-welded to the metal stem, an alignment member laser-welded to the metal lens holder, and the alignment. The optical transceiver according to claim 5, further comprising: the transmission sleeve laser-welded to a member. 11. The transmission sleeve includes: a fiber stub; a sleeve for holding the fiber stub; a metal bush for holding the sleeve; and a protection member for holding the bush and the sleeve. The optical transceiver according to claim 10, wherein: 12. The apparatus according to claim 11, wherein a central portion of the metal stem is inclined with respect to a common optical axis connecting the sleeve, the fiber stub, and the lens holder. 12. The optical transceiver according to 11. 13. The optical transceiver according to claim 10, wherein the metal stem has at least three lead pins, and at least one of the lead pins is electrically connected directly to the metal stem. vessel. 14. The transmission subassembly may include a 1.0 G
14. The optical transceiver according to claim 10, having an operation speed of bps or more. 15. A first optical-electrical conversion device capable of converting one of an optical signal and an electric signal to the other, a first receptacle provided to receive an optical connector, and the first receptacle. A first shield member for electrically shielding the receptacle, and a second shield member for electrically shielding the first photoelectric conversion device, wherein the first receptacle is provided. And a housing accommodating the first optical-electrical conversion device so as to be optically connectable to the optical connector. The first shield member is separated from the second shield member. , Optical transceiver. 16. The optical transceiver according to claim 15, wherein the housing has an insulating member that electrically insulates the first shield member from the second shield member. 17. The housing according to claim 17, wherein the housing includes a receptacle member provided with the first receptacle,
The optical transceiver according to claim 15, further comprising: a mounting member on which the optical-electrical conversion device is mounted, wherein the first shield member includes a conductive member provided on the receptacle member. 18. The housing according to claim 18, wherein the housing includes a receptacle member provided with the first receptacle;
A mounting member for mounting the optical-electrical conversion device, wherein the second shield member includes a conductive cover member that sandwiches the first optical-electrical conversion device with the mounting member. The optical transceiver according to claim 15. 19. The optical transceiver according to claim 15, wherein the second shield member has a terminal provided so as to protrude from a substrate installation surface of the housing. 20. The device according to claim 20, wherein the second shield member is provided with the first shield member.
The optical transceiver according to any one of claims 15 to 18, wherein the optical transceiver is connected to a reference potential line of the photoelectric conversion device. 21. The housing has a conductive terminal member, and the terminal member is formed from a contact portion provided so as to be electrically connectable to the first shield member, and a board mounting surface of the housing. The optical transceiver according to any one of claims 15 to 20, further comprising a terminal provided so as to protrude. 22. A light-to-electricity conversion device capable of converting one of an optical signal and an electric signal into another, wherein the housing is provided to receive an optical connector. A receptacle, wherein the second optical-to-electrical conversion device is housed in the housing so as to be optically connectable to an optical connector in the second receptacle; The optical transceiver according to any one of claims 15 to 21, wherein the optical sensor is electrically shielded by a shield member, and the second photoelectric conversion device is electrically shielded by the second shield member. vessel. 23. The first shield member, wherein:
23. The optical transceiver according to claim 22, wherein an electrical shield is provided between the optical-to-electrical conversion device and the second optical-to-electrical conversion device. 24. The first shield member includes a plating film provided on the receptacle member.
The optical transceiver according to any one of claims 7 to 23.