JP2007134992A - Optical transmitter-receiver - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical transmitter-receiver which can be mounted on an electronic substrate without depending on the shape of a fixing part connecting an optical transmission-reception module to the electronic substrate and generates no stress at a joint part of the optical transmission-reception module. <P>SOLUTION: The optical transmitter-receiver is provided with: a BOSA component 2 where an LD module 3 and a PD module 4 shares a WDM filter 8; an electronic substrate 5 which controls the LD module 3; an electronic substrate 6 which controls the PD module 4 and a flexible substrate 7 which connects at least the LD module 3 to electronic substrate 5 or the PD module 4 to electronic substrate 6 each other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical transceiver including a BOSA (Bi-directional Optical Sub-Assembly).

  An example of a conventional bidirectional optical transceiver is disclosed in Patent Document 1, for example. In this optical transceiver, an optical device to which BOSA or the like can be applied is mounted and mounted on two rigid electronic boards corresponding to a transmission unit and a reception unit. An optical transceiver is assembled by arranging two rigid electronic boards respectively connected to a PD (photodiode) module and an LD (laser diode) module so as to be parallel to each other in the housing of the optical transceiver (for example, (See FIG. 12).

  In Patent Document 2, in order to relieve mechanical stress between the optical transceiver and the electronic substrate, the lead terminal of the optical transceiver is connected to the electronic substrate via a flexible substrate (for example, FIG. 1). The flexible substrate absorbs mechanical strain generated at the connection portion between the optical transceiver and the electronic substrate, thereby improving the reliability of the connection portion between the optical transceiver and the electronic substrate.

JP 2001-296457 A Japanese Patent Laid-Open No. 2004-241915

  In a conventional optical transceiver, the PD module or LD module is directly attached to a rigid electronic board, and parts selection cannot be made flexibly. When using parts from multiple manufacturers for each specification, There was a problem that adjustment and manufacturing management became complicated.

  In particular, there are individual differences in BOSA parts for each manufacturer. For example, a fiber ferrule for fixing a WDM (Wavelength Division Multiplexer) filter and an optical fiber is created with specifications for each manufacturer. For this reason, specialized technology for each manufacturer is required to adjust the WDM filter and the fiber ferrule when the optical transceiver employing the BOSA component is configured.

  Further, when manufacturing an optical transceiver that employs BOSA parts from a plurality of BOSA manufacturers, it is necessary to mount a dedicated electronic board for each BOSA parts manufacturer. For this reason, the cost of the electronic substrate in manufacturing the optical transceiver is inevitably increased. Furthermore, since an electronic board for each BOSA component manufacturer is mounted, manufacturing management for each BOSA component manufacturer is required, and manufacturing management of the optical transceiver becomes complicated.

  The present invention has been made to solve the above-described problems, and can be mounted on an electronic board regardless of the shape of a fixing portion that connects the optical transmission / reception module and the electronic board. It is an object of the present invention to obtain an optical transmitter / receiver having a configuration in which stress is not generated in a connection portion.

  An optical transceiver according to the present invention includes an optical transmission module that converts an electrical signal into an optical signal, an integrated optical transceiver module in which an optical reception module that converts an optical signal into an electrical signal shares an optical filter, and an optical transmission module At least one of the first electronic board for controlling the optical module, the second electronic board for controlling the optical receiver module, the optical transmitter module and the first electronic board, and the optical receiver module and the second electronic board. And a flexible substrate to be connected.

  According to the present invention, an optical transmission module that converts an electrical signal into an optical signal, an optical reception module that converts an optical signal into an electrical signal, and an integrated optical transceiver module that share an optical filter, and the optical transmission module are controlled. Flexible connecting at least one of the first electronic board, the second electronic board for controlling the optical receiver module, the optical transmitter module and the first electronic board, and the optical receiver module and the second electronic board. Since it includes the substrate, it can be connected to the electronic substrate regardless of the shape of the fixed portion of the optical transceiver module, and the generation of stress at the joint portion of each module can be suppressed. As a result, there is no need to prepare an electronic board for each BOSA component manufacturer, so that the mounting can be simplified, and the secondary effect of reducing the manufacturing cost can be achieved. Further, manufacturing management for each part of a plurality of BOSA parts manufacturers can be omitted, and the management cost can be reduced.

Embodiment 1 FIG.
1A and 1B are diagrams showing a configuration of an optical transceiver using BOSA according to Embodiment 1 of the present invention. FIG. 1A is a side view of both an LD module and a PD module, and FIG. 1B is a PD module side. FIG. The portion of the flexible substrate 7 indicated by a broken line in the drawing indicates that it is connected to the upper surface side of the rigid substrate 6. In the optical transceiver 1 according to the first embodiment, the LD module 3 of the BOSA component 2 is connected to the rigid substrate (first electronic substrate) 5 and the PD module (optical receiver module) 4 of the BOSA component 2 is rigid. The electronic substrate (second electronic substrate) 6 and the flexible substrate 7 are connected.

  In the BOSA component 2, the optical paths of the LD module 3 and the PD module 4 intersect in the casing, and a WDM filter 8 that is an optical filter shared by both the modules 3 and 4 is provided at the intersection. In addition, the flexible board | substrate 7 uses what an internal wiring layer impedance-matches so that a characteristic may not shift | deviate with the structure connected to the rigid electronic board 6 without going through this.

  In FIG. 1, rigid electronic boards (hereinafter referred to as rigid boards) 5 and 6 are fixedly mounted on a housing (not shown) of an optical transceiver via connectors 13 and 12. As a result, the positions of the rigid substrates 5 and 6 are uniquely determined. Here, the LD module (optical transmission module) 3 of the BOSA component 2 has a shortest lead pin, that is, the distance between the BOSA component 2 and the rigid substrate 5 is the size of the fixed portion 10 (in FIG. 1A). The BOSA component 2 is attached to the rigid substrate (first electronic substrate) 5 so as to be approximately the size indicated by the symbol A).

  On the other hand, the PD module 4 of the BOSA component 2 is connected to one end of the flexible substrate 7 and the other end is attached to the rigid substrate 6. At this time, the arrangement position of the rigid substrate 6 is closer to the position (position closer to the PD module 4 side) than the dimension of the fixing portion 11 on the PD module 4 side (the dimension given the symbol B in FIG. 1A). Even if it is fixed or fixed at a position far from the dimension of the fixing portion 11 on the PD module 4 side (position away from the PD module 4), the PD module 4 and the rigid board are interposed with the flexible substrate 7 interposed therebetween. 6 is connected.

  For example, the lead terminal of the PD module 4 of the BOSA component 2 is connected to one end of the flexible substrate 7, and the other end of the flexible substrate 7 is connected to the upper surface of the rigid substrate 6, or is connected to the lower surface of the rigid substrate 6. Thereby, even if it is a rigid board | substrate of the dimension which does not correspond to the specification of a BOSA component manufacturer, an optical transmitter / receiver can be comprised. Further, the difference in the dimensions of the rigid substrate does not affect the adjustment of the WDM (Wavelength Division Multiplexer) filter 8 and the fiber ferrule for fixing the optical fiber 9 when the optical transceiver 1 is configured.

  2A and 2B are diagrams showing another configuration of the optical transceiver using the BOSA according to the first embodiment. FIG. 2A is a perspective view of both the LD module and the PD module, and FIG. FIG. The portion of the flexible substrate 7 indicated by a broken line in the drawing indicates that it is connected to the upper surface side of the rigid substrate 6. Unlike FIG. 1, the PD module 4 and the rigid substrate 6 are connected via a twisted flexible substrate 7.

  In the illustrated example, the flexible substrate 7 is attached to the rigid substrate 6 in a state twisted 90 degrees from the C direction to the D direction. As a result, the movable area of the flexible substrate 7 extends not only in the direction C but also in the direction D, so that mounting is possible regardless of the position of the PD module 4 of the BOSA component 2. The degree of twisting may be twisted by 90 degrees from the C direction to the D direction as shown in the figure. For example, the twisting angle may be changed according to the fixed position of the rigid board in the housing.

  As described above, according to the first embodiment, the integrated optical transceiver module in which the LD module 3 that converts an electrical signal into an optical signal and the PD module 4 that converts an optical signal into an electrical signal share the WDM filter 8. The BOSA component 2, the electronic substrate 5 that controls the LD module 3, the electronic substrate 6 that controls the PD module 4, and the flexible substrate 7 that connects between the PD module 4 and the electronic substrate 6, are provided. Regardless of the shape of the fixed portion of the module 4, it can be connected to the electronic substrate 6, and the generation of stress at the connecting portion of the module can be suppressed. As a result, mounting can be performed without preparing an electronic board that matches the specifications of each BOSA component manufacturer, and the manufacturing cost can be reduced. Further, manufacturing management for each part of a plurality of BOSA parts manufacturers can be omitted, and the management cost can be reduced.

  In the first embodiment, when the flexible substrate 7 is attached to the rigid substrate 6, if one end of the flexible substrate 7 is attached by soldering, stress may be generated in that portion. A large number of through holes are formed in the connection region of the portion and the rigid substrate 6 to be connected thereto, and the flexible substrate 7 and the rigid substrate 6 are connected by inserting pins into these through holes. At this time, the pin portion on the surface is soldered. Thereby, the stress due to the slack in the C direction can be dispersed.

Embodiment 2. FIG.
3A and 3B are diagrams showing the configuration of an optical transceiver using BOSA according to Embodiment 2 of the present invention, where FIG. 3A is a side view of both the LD module and the PD module, and FIG. 3B is the PD module side. FIG. The portion of the flexible substrate 7 indicated by a broken line in the drawing indicates that it is connected to the upper surface side of the rigid substrate 6, and the solid line portion of the flexible substrate 7 is connected to the lower surface side of the flexible substrate 14.

  In the optical transceiver 1 according to the second embodiment, unlike the first embodiment, the PD module 4 of the BOSA component 2 is directly connected to the rigid board (third electronic board) 14, and the rigid board 14 and the rigid board 6 are connected. Are connected via a flexible substrate 7. In addition, the flexible board | substrate 7 uses what an internal wiring layer impedance-matches so that a characteristic may not shift | deviate with the structure which PD module 4 directly joined to the rigid board | substrate 6. FIG.

  In FIG. 3, the rigid boards 5 and 6 are fixedly mounted on a housing (not shown) of the optical transceiver via connectors 13 and 12 as in the first embodiment. Thereby, the position of the rigid substrate 5 is uniquely determined. Here, the LD module 3 of the BOSA component 2 is arranged such that the lead pin is the shortest, that is, the BOSA component 2 is placed so that the distance between the BOSA component 2 and the rigid substrate 5 is about the size of the fixed portion 10. Attach to.

  On the other hand, the PD module 4 of the BOSA component 2 is connected to the rigid substrate 14 via the fixing portion 11, the rigid substrate 14 and one end of the flexible substrate 7 are connected, and the other end is attached to the rigid substrate 6. Here, when the flexible substrate 7 is mounted on the same surface side of the rigid substrates 6 and 14, stress is generated in the connecting portion between the rigid substrates 6 and 14 and the flexible substrate 7 due to the slack in the C direction, and the flexible substrate 7 may be peeled off. There is sex.

  Therefore, in the second embodiment, one end of the flexible substrate 7 is attached to the lower surface portion of the rigid substrate 14, and the other end of the flexible substrate 7 is attached to the upper surface portion of the rigid substrate 6. For example, as shown in FIG. 3A, the lead terminal of the PD module 4 of the BOSA component 2 is connected to the rigid substrate 14, and one end of the flexible substrate 7 is connected to the lower surface of the rigid substrate 14. The other end is connected to the upper surface of the rigid substrate 6.

  With this configuration, even when the flexible substrate 7 is slack in the C direction, the rigid substrates 6 and 14 are connected at the connecting portions of the rigid substrates 6 and 14 in the direction indicated by the arrow in the drawing, that is, at the end of the flexible substrate 7. Stress in the direction of contact with the side is generated and the rigid substrates 6 and 14 are not peeled off.

  In attaching the flexible substrate 7 to the rigid substrates 6 and 14, if the end portion of the flexible substrate 7 is attached by soldering, stress may be generated in that portion. Therefore, a large number of through holes are formed in the end portion of the flexible substrate 7 and the connection region of the rigid substrates 6 and 14 to be connected thereto, and the flexible substrate 7 and the rigid substrates 6 and 14 are connected by inserting pins. At this time, the pin portion on the surface is soldered. Thereby, the stress due to the slack in the C direction can be dispersed.

  FIG. 4 is a view showing another attachment form of the flexible substrate in the optical transceiver according to the second embodiment, and is a bottom view seen from the PD module 4 side as in FIG. 3B. The portion of the flexible substrate 7 indicated by a broken line in the drawing indicates that it is connected to the upper surface side of the rigid substrate 6, and the solid line portion is connected to the lower surface side of the flexible substrate 14.

  In the illustrated example, the flexible substrate 7 is attached to the rigid substrate 6 in a state twisted 90 degrees from the C direction to the D direction. As a result, the movable area (degree of freedom of sag) of the flexible substrate 7 extends not only in the direction C but also in the direction D, so that mounting is possible regardless of the position of the PD module 4 of the BOSA component 2. The degree of twisting may be twisted by 90 degrees with respect to the C direction as shown in the figure, but the twisting angle may be changed according to the fixed position of the rigid board within the housing, for example.

  As described above, according to the second embodiment, the BOSA component 2 in which the LD module 3 that converts an electrical signal into an optical signal and the PD module 4 that converts an optical signal into an electrical signal share the WDM filter 8; An electronic substrate 5 that controls the LD module 3, an electronic substrate 6 that controls the PD module 4, an electronic substrate 14 that is connected to the PD module 4, and a flexible substrate 7 that connects between the electronic substrate 14 and the electronic substrate 6 Therefore, regardless of the shape of the fixed portion of the PD module 4, it can be mounted on the electronic substrate 6, and stress that may occur at the connecting portion of each module can be reduced. As a result, mounting can be performed without preparing an electronic board that meets the specifications of each BOSA component manufacturer, and the manufacturing cost can be reduced. Further, manufacturing management for each part of a plurality of BOSA parts manufacturers can be omitted, and the management cost can be reduced.

Embodiment 3 FIG.
FIG. 5 is a view showing a rigid board mounting form in an optical transceiver according to Embodiment 3 of the present invention, and is a bottom view seen from the PD module 4 side as in FIG. 3 (b). In the optical transceiver 1 according to the third embodiment, the PD module 4 is attached to the rigid board (third electronic board) 15 and connected to the rigid board (second electronic board) 16 via the rigid board 15.

  As shown in FIG. 5, in the third embodiment, a rigid substrate 15 is attached to the PD module 4 of the BOSA component 2 without using a flexible substrate. The rigid board 15 has a shape extending to the rigid board 16 side. A number of through holes 17 are formed at the end of the rigid substrate 15 on the side of the rigid substrate 16 and the end of the rigid substrate 16 on the side of the rigid substrate 15. The through holes 17 are arranged, for example, in a lattice shape in order to provide a degree of freedom of installation of the rigid board in the C direction and the D direction.

  The rigid board 15 and the rigid board 16 are attached by connecting the through holes 17 with pins at an optimum position according to the positional relationship with the BOSA component 2. For example, the lead terminal of the PD module 4 of the BOSA component is connected to the rigid substrate 15 and connected to the rigid substrate 16 through the through hole 17 provided at the end of the rigid substrate 15.

  As described above, according to the third embodiment, the integrated optical transceiver module in which the LD module 3 that converts an electrical signal into an optical signal and the PD module 4 that converts an optical signal into an electrical signal share the WDM filter 8. The BOSA component 2, the electronic board 5 that controls the LD module 3, the electronic board 6 that controls the PD module 4, the electronic board 15 that is connected to the PD module 4, and between the electronic board 15 and the electronic board 6 And the through hole 17 for connecting the two substrates by inserting pins, the same effect as in the first and second embodiments can be obtained by using a rigid substrate that is less expensive than a flexible substrate. be able to.

  In the first to third embodiments, the case where the PD module 4 and the rigid boards 6 and 16 are connected by the flexible board 7 and the through hole 17 has been described. Even so, it can be similarly connected. Further, both the LD module 3 and the rigid board and the PD module 4 and the rigid board may be connected in the configuration of the first to third embodiments.

  In the first to third embodiments, the case where the rigid substrates 5 and 6 are arranged in the casing at positions perpendicular to each other is shown. However, the rigid substrates 5 and 6 are arranged in parallel. Even if it exists, this invention can be applied and the same effect can be acquired.

It is a figure which shows the structure of the optical transmitter-receiver by Embodiment 1 of this invention. It is a figure which shows the other structure of the optical transmitter-receiver by Embodiment 1. FIG. It is a figure which shows the structure of the optical transmitter-receiver by Embodiment 2 of this invention. It is a figure which shows the other attachment form of the flexible substrate in the optical transmitter-receiver by Embodiment 2. FIG. It is a figure which shows the attachment form of the rigid board | substrate in the optical transmitter-receiver by Embodiment 3 of this invention.

Explanation of symbols

  1 optical transceiver, 2 BOSA parts, 3 LD module (optical transmission module), 4 PD module (optical reception module), 5, 6, 14, 15, 16 rigid substrate (first to third electronic substrates), 7 Flexible substrate, 8 WDM filter, 9 optical fiber, 10, 11 fixed part, 12, 13 connector, 17 through hole.

Claims (7)

An integrated optical transceiver module in which an optical transmitter module that converts an electrical signal into an optical signal and an optical receiver module that converts an optical signal into an electrical signal share an optical filter;
A first electronic substrate for controlling the optical transmission module;
A second electronic substrate for controlling the optical receiver module;
An optical transceiver comprising: a flexible substrate connecting at least one of the optical transmitter module and the first electronic substrate and between the optical receiver module and the second electronic substrate.   2. The optical transceiver according to claim 1, wherein the module and the electronic substrate are connected in a state where the flexible substrate is twisted. An integrated optical transceiver module in which an optical transmitter module that converts an electrical signal into an optical signal and an optical receiver module that converts an optical signal into an electrical signal share an optical filter;
A first electronic substrate for controlling the optical transmission module;
A second electronic substrate for controlling the optical receiver module;
A third electronic board connected to at least one of the optical transmitter module and the optical receiver module;
An optical transceiver comprising: a flexible substrate that connects at least one of the third electronic substrate and the first electronic substrate and between the third electronic substrate and the second electronic substrate.   One end of the flexible substrate is connected to the lower surface of the third electronic substrate, and the other end of the flexible substrate is connected to the upper surface of the electronic substrate to be connected to the third electronic substrate via the flexible substrate. The optical transceiver according to claim 3.   5. The optical transceiver according to claim 3, wherein the electronic substrates are connected in a state where the flexible substrate is twisted.   The optical transceiver according to any one of claims 1 to 5, wherein the flexible substrate and the electronic substrate are each provided with a through hole for connecting the two substrates by inserting pins. An integrated optical transceiver module in which an optical transmitter module that converts an electrical signal into an optical signal and an optical receiver module that converts an optical signal into an electrical signal share an optical filter;
A first electronic substrate for controlling the optical transmission module;
A second electronic substrate for controlling the optical receiver module;
A third electronic board connected to at least one of the optical transmitter module and the optical receiver module;
Formed in at least one of the connecting portions between the third electronic substrate and the first electronic substrate and the connecting portions between the third electronic substrate and the second electronic substrate, by inserting pins An optical transceiver having a through hole connecting between substrates.

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