JPS63100855U - - Google Patents

Info

Publication number
JPS63100855U
JPS63100855U JP1987173926U JP17392687U JPS63100855U JP S63100855 U JPS63100855 U JP S63100855U JP 1987173926 U JP1987173926 U JP 1987173926U JP 17392687 U JP17392687 U JP 17392687U JP S63100855 U JPS63100855 U JP S63100855U
Authority
JP
Japan
Prior art keywords
optical
housing
electro
electrical
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987173926U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS63100855U publication Critical patent/JPS63100855U/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

An electro-optical connector is provided in which an electro-optical element 4, accommodated in a housing 1, may be coupled to a light-conductive element 11. In order to obtain a small contact region with suitable optical and electrical conditions, the housing 1 is provided with openings 2, 2b for accommodating the electrical and optical parts which comprise guide means 3, 2a, 2d which reliably align the electrical and the light-conductive element 4, 11 with respect to each other (Figure 1). <IMAGE>

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案電気―光学コネクタの第１の実
施例の拡大断面図、第２図は本考案電気コネクタ
の第２の実施例の発光ダイオードと光フアイバの
ある区域の更に拡大した断面図、第３図は電気部
は取付けられているが光学部が未だ取付けられて
いない状態の本考案電気コネクタの第３の実施例
の一部の断面図、第４図は印刷回路板上に複数個
の電気―光学コネクタを取り付けた状態を示す平
面図、第５図は第４図に示す電気―光学コネクタ
の側面図、第６図は変形ハウジングを有する電気
―光学コネクタを複数個相互に連結した状態を示
す平面図である。 １，１′，１″，１……ハウジング、２，２
′，２″……孔、３……肩部、４，４′，４″…
…チツプ、５，５′……電気導線、６，６′，７
，７′，７″……電極、８，８′，８″……空胴
（凹所）、９……保持歯、１０……くし部材、１
１，１１′……光フアイバ、１２，１２′，１２
″……接着剤、２０，２０′……カラー部、２１
……スリツト、３１……遷移部、３２……頚部孔
、３３……面、３４……ワイヤボンド、３５……
中間片、４１……印刷回路板、４２，４３……孔
、６０……連結装置。 FIG. 1 is an enlarged cross-sectional view of a first embodiment of the electrical-optical connector of the present invention, and FIG. 2 is a further enlarged cross-sectional view of a region with light emitting diodes and optical fibers of the second embodiment of the electrical connector of the present invention. , FIG. 3 is a cross-sectional view of a portion of the third embodiment of the electrical connector of the present invention, with the electrical part installed but the optical part not yet installed, and FIG. FIG. 5 is a side view of the electrical-optical connector shown in FIG. 4, and FIG. 6 is a plan view showing the electrical-optical connector shown in FIG. FIG. 1, 1', 1'', 1...Housing, 2, 2
', 2''...hole, 3...shoulder, 4, 4', 4''...
...chip, 5,5'...electrical conductor, 6,6',7
, 7', 7''... Electrode, 8, 8', 8''... Cavity (recess), 9... Holding tooth, 10... Comb member, 1
1, 11'...Optical fiber, 12, 12', 12
″...Adhesive, 20, 20'...Color part, 21
...slit, 31 ... transition part, 32 ... neck hole, 33 ... surface, 34 ... wire bond, 35 ...
Intermediate piece, 41...printed circuit board, 42, 43...hole, 60...coupling device.

Claims (1)

【実用新案登録請求の範囲】 １ 電気―光学素子を含み、かつ少なくとも２個
の電気接続体と少なくとも１個の光接続体とを格
納するハウジングを具備し、このハウジング１，
１′，１″を電気的に且つできれば光学的にも絶
縁性の材料で一体形成すると共にこのハウジング
に少なくとも２個の空所２，２′，２″，２ｂ，
２ｂ′，２ｂ″を設け、これら２個の空所に前記
電気接続体と光接続体とを共通軸線上に配置して
格納した電気光学コネクタにおいて、前記空所２
，２′，２″，２ｂ，２ｂ′，２ｂ″に案内手段
３，２０，２０′，２ｅ，２ｅ′を設け、この案
内手段により挿入の際電気―光学素子４，４′，
４″と光導波素子１１，１１′とを互いに整列さ
せ、ハウジング１，１′，１″，１の内部に光
学的に活性な空胴２ｄ，２ｅ，３５を設け、この
空胴に透明な接着剤１２，１２′，１２″を充填
したことを特徴とする光学コネクタ。 ２ ハウジングの材料の屈折率を面相互の接着剤
の屈折率よりも小さくし、光フアイバの端面と受
光又は発光面との間の空胴全体が反射壁を呈する
ように構成したことを特徴とする実用新案登録請
求の範囲第１項記載の電気―光学コネクタ。[Claims for Utility Model Registration] 1. A housing including an electro-optical element and housing at least two electrical connections and at least one optical connection, the housing 1,
1', 1'' are integrally formed of an electrically and preferably optically insulating material, and at least two cavities 2, 2', 2'', 2b,
2b' and 2b'', and the electrical connection body and the optical connection body are arranged and housed in these two spaces on a common axis line.
, 2', 2'', 2b, 2b', 2b'' are provided with guiding means 3, 20, 20', 2e, 2e', which guide the electro-optical elements 4, 4',
4'' and optical waveguide elements 11, 11' are aligned with each other, optically active cavities 2d, 2e, 35 are provided inside the housings 1, 1', 1'', 1, and transparent An optical connector characterized in that it is filled with an adhesive 12, 12', 12''. 2 The refractive index of the material of the housing is lower than the refractive index of the adhesive between the surfaces, and the end surface of the optical fiber and the light receiving or emitting surface are 2. The electro-optical connector according to claim 1, wherein the entire cavity between the 2 and 3 is configured to have a reflective wall.
JP1987173926U 1979-04-03 1987-11-16 Pending JPS63100855U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2913262A DE2913262C2 (en) 1979-04-03 1979-04-03 Electro-optical connector

Publications (1)

Publication Number Publication Date
JPS63100855U true JPS63100855U (en) 1988-06-30

Family

ID=6067264

Family Applications (2)

Application Number Title Priority Date Filing Date
JP4290680A Pending JPS5612780A (en) 1979-04-03 1980-04-03 Electroooptical connector
JP1987173926U Pending JPS63100855U (en) 1979-04-03 1987-11-16

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP4290680A Pending JPS5612780A (en) 1979-04-03 1980-04-03 Electroooptical connector

Country Status (5)

Country Link
JP (2) JPS5612780A (en)
DE (1) DE2913262C2 (en)
FR (1) FR2453555A1 (en)
GB (1) GB2046472B (en)
SE (1) SE455243B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005122291A1 (en) * 2004-06-10 2005-12-22 Olympus Corporation Light emitting device, production method for light emitting device, lighting device using light emittingdevice, and projector

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3113146C2 (en) * 1981-04-01 1985-03-28 Siemens AG, 1000 Berlin und 8000 München Electro-optical module connector
FR2533710A1 (en) * 1982-09-24 1984-03-30 Radiotechnique Compelec METHOD FOR ASSEMBLING AN OPTICAL FIBER TRANSMISSION DEVICE
DE3302373A1 (en) * 1983-01-25 1984-07-26 WAGO Verwaltungsgesellschaft mbH, 4950 Minden Switching installation terminal block
CA1247902A (en) * 1983-09-30 1989-01-03 Timothy R. Ponn Fiber optic connector assembly
DE3513229A1 (en) * 1985-04-12 1986-10-16 Schott Glaswerke, 6500 Mainz RE-IGNITABLE THYRISTOR
JPH0830776B2 (en) * 1986-01-31 1996-03-27 京セラ株式会社 Optical communication module
DE3736026A1 (en) * 1987-10-24 1989-05-03 Standard Elektrik Lorenz Ag OPTOELECTRIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
GB2230349A (en) * 1989-04-08 1990-10-17 Oxley Dev Co Ltd "fibre optic/led coupling".
DE69129817T2 (en) * 1990-04-03 1999-01-07 Sumitomo Electric Industries Optical device
JP2792722B2 (en) * 1990-07-16 1998-09-03 三菱電機株式会社 Semiconductor light emitting device
DE4114156A1 (en) * 1991-04-30 1992-11-05 Burndy Deutschland CONNECTOR FOR LIGHTWAVE GUIDE
DE19541139C1 (en) 1995-10-27 1997-05-15 Siemens Ag Receiving arrangement and method for producing a receiving arrangement for at least one coated optical waveguide
GB9608381D0 (en) * 1996-04-23 1996-06-26 Baillie Hamilton William J Combined light emitting and light guide collection and output device
GB2365990A (en) * 2000-08-04 2002-02-27 Kymata Ltd Optical device with strengthening member and guide formations
DE10257128B3 (en) * 2002-12-05 2004-05-27 Schott Glas Light input coupling device for optical fibre for optical data transmission network has reflector focusing light from photoelectric material onto coupling region of light conductive block facing optical fibre

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5320946B2 (en) * 1972-02-03 1978-06-29

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2207900B1 (en) * 1972-02-19 1972-10-12 Messerschmitt-Bölkow-Blohm GmbH, 8000 München Coupling element for fiber optic cables
US3938177A (en) * 1973-06-25 1976-02-10 Amp Incorporated Narrow lead contact for automatic face down bonding of electronic chips
US3840741A (en) * 1973-09-18 1974-10-08 Bell Telephone Labor Inc Semiconductor delay line detector for equalization of optical fiber dispersion
US4076376A (en) * 1973-10-16 1978-02-28 Bicc Limited Optical transmission systems
GB1461693A (en) * 1974-01-15 1977-01-19 Marconi Co Ltd Fibre optic couplers
FR2262407B1 (en) * 1974-02-22 1977-09-16 Radiotechnique Compelec
GB1557685A (en) * 1976-02-02 1979-12-12 Fairchild Camera Instr Co Optically coupled isolator device
GB1569615A (en) * 1976-10-19 1980-06-18 Standard Telephones Cables Ltd Coupling optical fibres
US4144541A (en) * 1977-01-27 1979-03-13 Electric Power Research Institute, Inc. Light-activated semiconductor device package unit
DE2707190B2 (en) * 1977-02-18 1979-05-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Arrangement for optoelectronic coupling of intrinsically safe and non-intrinsically safe circuits, especially in firedamp or explosion-proof systems
DE2724850A1 (en) * 1977-06-02 1978-12-07 Bosch Gmbh Robert Demountable opto-electronic transducer system - is attached to fibre optic light guide and carries electrical plug connections

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5320946B2 (en) * 1972-02-03 1978-06-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005122291A1 (en) * 2004-06-10 2005-12-22 Olympus Corporation Light emitting device, production method for light emitting device, lighting device using light emittingdevice, and projector
US7918567B2 (en) 2004-06-10 2011-04-05 Olympus Corporation Light emitting device, manufacturing method for light emitting device, illumination device using light emitting device, and projector

Also Published As

Publication number Publication date
DE2913262C2 (en) 1982-04-29
GB2046472A (en) 1980-11-12
SE8002444L (en) 1980-10-04
SE455243B (en) 1988-06-27
JPS5612780A (en) 1981-02-07
GB2046472B (en) 1983-01-26
FR2453555A1 (en) 1980-10-31
DE2913262A1 (en) 1980-10-09
FR2453555B1 (en) 1984-12-14

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