JP2857221B2 - Optical surface mount circuit and optical component thereof - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an optical surface mount circuit and an optical component thereof.

(Prior art and its problems) With the development of optoelectronics, the mounting technology of optical components has become a problem. That is, as the optoelectronic products become more complicated and integrated, the number of optical circuit assembly steps has increased rapidly.

Micro-optics that integrates and integrates various optical components, mainly optical fibers and distributed index lenses
Devices are known and form the core of passive components in currently practiced optical fiber transmission systems. These micro-optical elements are stable in terms of characteristics, but not only require fine optical axis adjustment when connecting optical components, but also the work time required for fixing the optical components and the bonding required for this fixing. The solidification time of the material is prolonged, and the number of assembly steps for each optical component is large. For this reason, micro optical elements combining individual optical components have already reached their limits in terms of manufacturing and price.

Therefore, there is a strong demand for research progress in optical component mounting technology for optical printed boards and the like in consideration of simple retrofitting of active and passive individual components.

On the other hand, the present inventor, in Japanese Patent Publication No. 48-5975,
A printed optical circuit as schematically shown in FIGS. 15 and 16 has been proposed.

That is, according to a desired pattern, an optical waveguide 32 is formed from one end surface of the glass substrate 10 to the other end surface, and the refractive index is gradually reduced from the central axis of the optical waveguide 32 to the periphery. To obtain a wiring board for an optical circuit. When the index of refraction decreases from the central axis of the photoconductor to the periphery, light traveling in the photoconductor is confined in the photoconductor and oscillates about the optical axis of the photoconductor. Take. But,
In such a printed optical circuit board, the end face 35 of the optical waveguide 32
Is exposed at the end face of the glass substrate 10, so that an optical component such as a laser diode must be attached to the end face of the glass substrate 10, for example, as an optical component mounting technology similar to surface mounting technology (SMT) in an electrical system. Not applicable.

Further, there is a technique for extracting light in the optical waveguide by bringing a prism into close contact with the optical waveguide, but there is a great technical difficulty such as optical axis alignment. Further, a method of extracting light in the optical waveguide using a diffraction grating is conceivable. However, it is difficult to manufacture and mass-produce such a fine structure diffraction grating, and it is also difficult to control the position of the diffraction grating. Further, in FIG. 16, the optical waveguide extends from the main surface 30 of the glass substrate 10 toward the other main surface 31.
It is conceivable to provide a groove that penetrates through 32 and fix optical components in this groove. However, as the number of optical components increases, the number of processing steps, processing time, and processing cost increase, and it is difficult to align the optical axis. And lacks practicality.

(Problems to be Solved by the Invention) An object of the present invention is to provide an optical surface capable of easily mounting an optical component on a main surface of a substrate and easily realizing mass production, mounting design, and design change of a complicated optical circuit. An object of the present invention is to provide a mounting circuit and an optical component thereof.

(Means for Solving the Problems) The present invention is an optical surface mount circuit for optical communication, which comprises a substrate and an optical component mounted on the substrate. Wherein the substrate is an optical waveguide buried inside the substrate, the end surface of the optical waveguide being provided with an optical waveguide vertically exposed toward the main surface of the substrate, Guide means are provided, the first guide means is fixed in position relative to the end face, and the first guide means is a guide projection projecting from the main surface or a guide hole recessed from the main surface. The optical component has an optical terminal, a second guide means is provided on the bottom surface of the optical component, and the second guide means is fixed in position relative to the optical terminal, A guide projection in which the second guide means projects from the bottom surface or A guide hole recessed from the bottom surface, the bottom surface of the optical component is fixed on the main surface of the substrate, the first guide means and the second guide means are fitted, and the optical terminal and the optical waveguide are The end faces are in close contact with each other and are directly connected to the end faces.

“Optical terminal” refers to an optical input terminal and / or an optical output terminal.

The present invention also relates to an optical component, comprising an optical element, an optical terminal for inputting or outputting light to the optical element, and a guide means fixed relative to the optical terminal. Wherein an optical terminal and a guide means are provided on the bottom surface of the optical component, and the second guide means is a guide projection projecting from the bottom surface or a guide hole recessed from the bottom surface. I do.

This optical component incorporates an electric circuit as needed,
Also, an electric input / output terminal may be provided at the bottom of the optical component.

(Example) FIGS. 1 (A) and 1 (B) are perspective views showing a state where an optoelectronic element is mounted on a glass substrate 10 which is a flat transparent dielectric, and FIGS. 2 (A), 2 (B) and 2 (C). ) Is an enlarged sectional view of a main part of FIGS. 1 (A) and (B), and FIG. 3 is a sectional view taken along line AA of FIG. 2 (A).

A total of four rows of optical waveguides 12 are formed inside the glass substrate 10, and the optical waveguide 12 includes a linear portion 12a, a bent portion 12b, and a terminal portion 12c. The end face of the linear portion 12a is exposed on the end face of the glass plate 10 and is connected to the optical connector 33. The optical connector 33 is fitted and fixed to another device or optical circuit (not shown). The end portion 12c is formed to be perpendicular to the main surfaces 30 and 31 of the glass substrate 10, and the end surface 14 of the end portion 12c is
Expose to 0. A pair of guide holes 11 are formed at a predetermined angle with respect to the pair of end surfaces 14 exposed on the main surface 30, for example, at an angle of 90 degrees.
Is formed. The end face 14 and the pair of guide holes 11 are fixed and positioned relatively to each other.

On the main surface 30 of the glass substrate 10, a predetermined electric printed wiring is provided directly or via a buffer layer (not shown), and is connected to an electric connector. The technology for providing electric printed wiring on a substrate is well known, and a description thereof will be omitted.

The optoelectronic integrated device 50 is mounted on the glass substrate 10 via the ring-shaped rubber cushion 8. Specifically, two guide pins 9 and six electrical input / output terminals 15 are provided on a ring-shaped flange at the bottom of the device 50, and a pair of guide pins 9 are fitted into the corresponding guide holes 11, respectively. And fix the terminal 15 and connect the terminal 15 to the electric printed wiring. The end face 14 of the optical waveguide 12 is in close contact with the end faces of the SELFOC lenses 5, 7 and is end-face-coupled, so that the SELFOC lens 5 functions as a light input terminal and the SELFOC lens 7 functions as a light output terminal. The end faces of the selfoc lenses 5, 7 are fixed in position relative to the pair of guide pins 9,
Positioned. A pair of selfoc lenses 5, 7, a light receiving element 4, a light emitting element 6, and an electric processing section 3 are accommodated and fixed in the element accommodating section 1 of the optoelectronic integrated device 50.

The structure of the end face coupling portion between the end faces of the SELFOC microlenses 5 and 7 and the end face 14 of the optical waveguide may be the structure shown in FIGS. 2B and 2C. FIG. 2B shows a structure in which the SELFOC lenses 5 and 7 are fixed to the flange 2 of the optoelectronic integrated device 50. In this case, a part of the optical waveguide end 12c does not protrude from the main surface 30. Is also good. In this case, since the SELFOC lenses 5 and 7 have a structure slightly protruding from the flange portion 2, a metal ring or the like is attached around the SELFOC lenses 5 and 7 in order to prevent the lens from being chipped. It may be attached to the outer circumference of 5,7.

FIG. 2C shows a structure in which the SELFOC lenses 5 and 7 are fixed to the storage section 1 of the optoelectronic integrated device 50 such that the lens end faces are flush with the bottom of the storage section 1. in this case,
The entire bottom of the storage section 1 including the end faces of the SELFOC lenses 5 and 7 slightly projects from the flange section 2.

Next, the operation of this optical surface mount circuit will be described. First, light passing through the optical waveguide 12 as shown by the arrow B is bent along the bent portion 12b, exits from the main surface 30 of the glass substrate 10 in the vertical direction, passes through the self-fox lens 5 and is received by the light receiving element 4. The light is received, where it is once converted to an electrical signal. On the other hand, a predetermined electric signal is transmitted to the electric processing unit 3 through the electric input / output terminal 15 to operate the electric processing unit 3 and perform a desired process on the electric signal input from the light receiving element 4. The electrical processing itself may be performed according to a known processing method, and various modifications can be considered. For example, according to the electric signal applied from the terminal 15, a modulation process for changing the intensity, phase, wavelength, etc. of the electric signal input from the light receiving element 4 is performed, or a pulse wave is superimposed on the electric signal from the light receiving element. It is conceivable to perform a modulation process by intermittently changing the intensity, or extract the electric signal to the outside and perform monitoring without modifying the electric signal itself from the light receiving element. Since the electric processing unit itself is well known, its internal configuration itself will not be described in detail.

Next, the electric signal after the desired electric processing is sent to the light emitting element 6 composed of a semiconductor laser or the like, and the desired light intensity,
The optical signal is converted into an optical signal having a phase, a wavelength, and a waveform. The optical signal is focused by the SELFOC lens 7, made to enter the end portion 12 c, and propagate in the optical waveguide 12 as shown by the arrow C.

According to the optical surface mount circuit according to the present embodiment, the glass substrate
An optoelectronic integrated device is formed by forming a pair of guide holes 11 in 10 and fitting a pair of guide pins 9 into the guide holes 11.
50 is mounted, and the optical input / output terminal and the electric terminal are connected to the optical waveguide 12 and the electric printed wiring of the glass substrate 10. Therefore, unlike the conventional micro optical device, the alignment is automatically performed by fitting the guide pin 9 and the guide hole 11, so that the optical axis adjustment between the individual optical components as in the related art is unnecessary, and The number of steps can be reduced.
Therefore, the adoption of the optical surface mounting circuit technology enables mass production of a complicated optical circuit, and further facilitates the mounting design and the design change of the optical circuit.

The guide pins 9 are preferably cylindrical metal studs, and the guide holes 11 need not penetrate the glass substrate 10. In addition, the number, shape, position, and the like of the guide pins and the guide holes can be changed. Further, a guide pin may be provided on the glass substrate 10 side, a guide hole may be provided on the hole electronic integrated device 50 side, and the guide pin and the guide hole may be fitted to each other to mount the device.

The mounting accuracy of the guide pins 9 and the guide holes 11 differs depending on the wavelength of light and the purpose of the device. In recent optical communications, it has become common to use a single mode fiber as an optical waveguide for broadband transmission. The core diameter of the current standard single mode fiber is about
10 μm, and the cladding diameter is about 125 μm. Therefore, various optical devices such as a semiconductor laser as a light source need to align their optical axes with an accuracy of about 1 μm. Therefore, in order to apply in this area, the alignment by the guide pin 9 and the guide hole 11 requires one step.
An accuracy of about μm is required, and the outer diameter of the guide pin may be, for example, on the order of about 1 mm.

Further, according to the optical surface mounting circuit board described in the present embodiment, since the light propagating in the optical waveguide 12 is emitted from the end face 14 in a direction perpendicular to the substrate main surface 30, the light propagates on the main surface 30. An optical device can be mounted directly or via a predetermined buffer layer to perform desired processing on the above-mentioned emitted light.
Similarly, light emitted from an optical device mounted on the main surface 30 can be made to enter the optical waveguide 12 from the end face 14. Therefore, a desired circuit can be manufactured only by mounting and fixing the optical device on the main surface 30 (or the main surface 31 in some cases) of the glass substrate 10, so that it is easy to manufacture, mount, design, and change the design of the optical circuit. is there.

Further, in this embodiment, the configuration itself of the optoelectronic integrated device 50 is also characterized.

That is, inside the device 50, selfoc lenses 5, 7 acting as optical input / output terminals, a light receiving element, a light emitting element, and an electric processing unit (circuit) 3 are built in. The optical axis is fixed and fixed. By incorporating individual micro-optical elements and electric circuits in the device stage in this way, it is not necessary to re-align the optical axis in the mounting stage, and in this sense, it is possible to prevent the assembly process from being complicated, Mass production of circuits becomes easier.

FIGS. 4, 5 (A), (B), (C) and FIGS. 6 (A), (B), (C) show other optical surface mount circuits, respectively. FIG. 2 (A) , (B), (C) or an enlarged view of a main part similar to FIG.

In the circuit of FIG. 4, a total of four rows of optical waveguides 12 are formed inside the glass substrate 10, and the exposed end faces of the optical waveguides 12 on the main surface 30 side are connected to light receiving elements or light emitting elements in the optoelectronic integrated device. Connect and perform switching. For example, in FIG. 4, the pair of left optical waveguides 12 is connected to a light receiving element (input side), and the pair of right optical waveguides 12 is connected to a light emitting element (output side).
Then, the switching between the optical waveguides can be performed by switching the electrical connection between the light emitting element and the light receiving element in the electrical processing unit.

In the examples shown in FIGS. 5A, 5B and 5C, the input side of the optoelectronic integrated device 60 is omitted, and only the output side is built in the device. Therefore, a desired electric signal is sent into the electric processing unit 3 for control, and the light emitting element 6 is driven by the electric signal from the electric processing unit 3, and the SELFOC lens
7. An optical signal having a desired waveform, wavelength, phase, and intensity is supplied through the optical waveguide 21. Of course, FIG. 5 (A),
Contrary to the examples of (B) and (C), using an opto-electronic integrated device incorporating only the light-receiving element side, the light signal transmitted through the optical circuit is detected by the light-receiving element, converted to an electric signal, and sent to the outside. You can also take out.

In the examples of FIGS. 6A, 6B and 6C, no electrical processing section is provided in the optical integrated device 70, and only the isolator section 16 which is an optical processing section is incorporated. this is,
When a semiconductor laser is used, light reflected from the output end of the optical fiber of the coupling system or the connection point of the optical fiber in the transmission path is cut off to obtain stable oscillation characteristics. Specifically, the polarizer 17 and the Faraday element 18, the analyzer 19, and the mirror 20 are built in the isolator unit 16, and the optical axes of the individual optical components are previously adjusted when the device 70 is manufactured. I have. Of course, the components of the isolator section 16 can be variously changed. Further, instead of the isolator section 16, for example, a filter, an optical integrated circuit section, a lens and the like can be built in the device.

FIG. 7 is a perspective view showing a state before a plug for coupling between optical waveguides with an optical fiber is attached to the glass substrate 10, and FIG. 8 is a cross-sectional view showing the structure of a precision fitting built in the plug. FIG. 7 shows the inside of the plug 44 as if the plug 44 was transparent.

Inside the glass substrate 10, a total of four rows of optical waveguides 12A, 12B, 12C,
12D is formed, and end faces 14A, 14B, 14C, and 14D of the respective optical waveguides are exposed to the main surface 30. The end faces 14A and 14C are adjacent to each other, and a pair of guide holes 11 are provided around the end faces 14A and 14C.
14B and 14D are adjacent to each other, and a pair of guide holes 11 are provided therearound. The plug 44 is made of a flexible material such as resin, and has a pair of precision fittings 45 built in the plug 44. The precision fitting 45 includes a cylindrical portion 41 and a flange portion 42, and a pair of guide pins 9 is provided on a lower surface of the flange portion 42.
A pair of precision fittings 45 are connected by one optical fiber 43, and the end of the optical fiber 43 is fixed in the precision fitting 45,
On the lower side of the precision fitting 45, the end face 43b of the optical fiber core wire 43a
Is exposed.

When the plug 44 is mounted, the guide pins 9 are fitted into the corresponding guide holes 11, respectively. In the figure, reference numeral 46 denotes a rubber cushion. At this time, the end face 43b of the optical fiber is connected to the end faces 14A and 14B as shown by arrows, and the center axis of the optical fiber core 43a and the guide pin 9 are connected.
A high dimensional accuracy is required for the dimension D between the center axis and the center axis, and a precision fitting is used for this. Also plug
The reason why 44 is made of a flexible material is to cope with a positional shift between the optical waveguides 12A and 12B.

As described above, according to the present embodiment, the optical waveguides 12A and 12B can be easily connected by mounting the plug 44,
In this case, the same effects as in the embodiment of FIG. 1 can be obtained. Of course, the optical waveguides 12A and 12D can be connected, 12B and 12C can be connected, or both can be performed simultaneously.

FIG. 9 schematically shows a mixing plug.

This plug 51 has a structure similar to that of the plug shown in FIG. 7 as a whole.
The precision fitting 52 and the mixing rod 53 are built in. Eight rows of optical waveguides 12 are formed inside the glass substrate 10, and the end faces 14 of the respective optical waveguides are exposed on the main surface 30. Then, every two optical fibers 43 are fixed to each precision fitting 52, the end face of the optical fiber 43 is connected to the end face 14 of each optical waveguide 12, and the other end of each optical fiber 43 is connected to the mixing rod 53. I do. In the mixing rod 35, the input optical signal is divided into a plurality of optical signals, or conversely, the plurality of input optical signals are combined as one optical signal.

Also, this plug 51 can be used as a duplexer / multiplexer plug. In this case, the other end of the optical fiber 43 is coupled to an optical demultiplexer / multiplexer or the like, and a plurality of optical signals having different wavelengths are multiplexed, or a wavelength-multiplexed optical signal is demultiplexed on a receiving side for each wavelength. I do.

Next, a method of forming an optical waveguide in a glass substrate and exposing the end surface to the main surface of the substrate will be described. Tenth
FIGS. 3A to 3D are perspective views showing such a process.

First, a glass plate 10 having a uniform refractive index and containing two or more modified oxides is prepared. A first mask (for example, a photo-etching mask, paraffin, etc.) 21 having a predetermined pattern is formed on the main surface of the glass plate 10, and the state shown in FIG. 10A is obtained.

Next, a salt of a metal cation (such as Tl ⁺ ) having a higher ionic polarizability per unit volume than a metal cation (such as K ⁺ , Na ⁺ ) contained in the glass substrate 10 is applied through the mask 21. After contacting with the main surface of the glass substrate 10 and performing ion exchange,
The first mask 21 is removed. Thereby, FIG. 10 (B)
As shown in (1), ion exchange is performed from the exposed portion 22 not covered by the mask 21, and a refractive index gradient is formed such that the refractive index gradually decreases from the surface of the exposed portion 22 toward the inside.

In this case, as the modified oxide, Li ₂ O, Na ₂ O, K ₂ O, Rb ₂ O, C
s ₂ O, Tl ₂ O, Au ₂ O, Ag ₂ O, Ca ₂ O, MgO, CaO, BaO, ZnO, CdO, PbO, Sn
O ₂ , La ₂ O _{3 and the} like may be used.

By the way, about the principle of the formation of the refractive index gradient,
Since it is as shown in JP-A-48-5975, it will not be described in detail here.

Next, as shown in FIG. 10 (C), the end of the exposed portion 22 on the glass substrate central portion side is covered with a second mask 26.

Next, the ions (Tl) diffused into the glass substrate 10 in the first ion exchange step are formed on the main surface 30 of the glass substrate 10.
⁺ ), A salt of a metal cation (K ⁺ , Na ^+, etc.) having a small ionic polarizability per unit volume as compared with ( ⁺ ). As a result, a refractive index gradient in which the refractive index gradually increases from the contact surface with the salt toward the inside of the substrate is formed, and in the region of the exposed portion 22 in FIG. As shown in (1), a refractive index gradient is formed such that the refractive index gradually decreases toward the outer periphery of the region where the refractive index is large.

On the other hand, in the region covered by the second mask 26, since the second ion exchange does not occur, a region having a high refractive index remains as it is in the state of FIG.
As a result, when the second mask 26 is removed, the end surface 14 and the end portion 12c exposed to the main surface 30 are formed as shown in FIG. 10 (D) and FIG.

Thus, the optical waveguide 12 having the desired pattern and having the end face 14 exposed to the main surface 30 is formed. Since the optical waveguide 12 has a refractive index gradient in which the refractive index gradually decreases from the central axis toward the periphery, it functions as a light propagation medium.

The curvature of the bent portion 12b is preferably about 1 mm when the diameter of the optical waveguide 12 is 10 μm. The change Δn / n of the refractive index in the optical waveguide 12 with respect to the refractive index n around the optical waveguide is preferably about 0.1 to 1%.

In addition, as shown in FIG.
For example, there is a method of slightly cutting the upper surface from the state shown in FIG. Further, as shown in FIG. 2 (B), the selfoc lens 5 can be directly attached without performing cutting.

In the above embodiment, the case where the glass substrate is used as the plate-shaped transparent dielectric has been described, but it can be generally realized also with a synthetic resin.

For example, Japanese Patent Publication No. 47-26913 proposes using a synthetic resin to form an optical waveguide having such a characteristic that the refractive index gradually changes from the central axis toward the periphery. That is, according to Japanese Patent Publication No. 47-26913, a synthetic resin substrate having a cross-link by an ionic bond between a carboxyl group and a metal is brought into contact with ions of a metal other than the metal, and a synthetic resin body close to the contact surface is formed. Is replaced with the other metal ion, and the concentration ratio of two or more metal ions contained in the synthetic resin substrate is changed from the center to the surface, whereby the refractive index is changed from the center to the surface. Can be changed toward.

The metal ions are preferably monovalent metals, but all metals can be used.

On the other hand, when the metal ions diffused into the synthetic resin substrate by ion exchange have a higher ionic polarizability per unit volume than the metal ions contained in the synthetic resin substrate in advance, the synthetic resin When the refractive index decreases from the main surface of the substrate toward the inside, and conversely, the metal ions contained in the synthetic resin substrate in advance have a higher ion polarizability, From the surface toward the surface.

It is clear that this gives the same result as the ion exchange for the glass substrate shown in the above example.

Therefore, in the above embodiment, the first ion exchange and the second ion exchange were performed according to the procedure shown in FIGS. 10A to 10D using a synthetic resin substrate instead of the glass substrate. For example, a resin substrate as shown in FIGS. 10 (D) and 11 is obtained.

Further, the connection between the electric wiring on the main surface 30 of the glass substrate 10 and the electric wiring in the optoelectronic integrated device 50 may be as follows.

FIG. 12 is an enlarged cross-sectional view of a main part of a coupling portion between the optoelectronic integrated device 50 and the glass substrate 10 in that case, and FIG. 13 is a cross-sectional view taken along line AA of FIG. In this structure, six popular input / output terminals 15 are drawn out of the optoelectronic integrated device 50,
It is connected to the electric printed wiring on the main surface 30 of the glass substrate 10. In addition, the electric input / output terminal 15 arranged in the housing 1 is connected to the light receiving element 4, the light emitting element 6, or the electric circuit component 3.

FIG. 14 is a front view showing another fixing method for fixing the optoelectronic integrated device 50 (60) or the optical integrated device 70 to the glass substrate 10. FIG. The details such as the structure of the optical waveguide inside each device and inside the glass substrate 10 are the same as in the example of FIG.

In the present embodiment, a flange 80a of a substantially mountain-shaped leaf spring 80 having a slightly concave central portion is fixed to the glass substrate 10 with a stud 81, and the concave portion of the central portion of the leaf spring 80 is used as a pressing portion 80b, and the pressing portion 80b is The optical device 50 is pressed against the top of the
(Or 60, 70). This pressing force is
Adjust by According to the present embodiment, the device can be more reliably prevented from coming off the glass substrate 10.

In each of the embodiments shown in FIGS. 1 (A) and 1 (B) to 9 described above, a screw is formed on the pin head of the guide pin 9, and this screw portion is projected from the main surface 31 side, and a nut is formed. A screw fastening component such as is screwed into the head of the guide pin 9 from the main surface 31 side, whereby the device 50 (or 60, 70) can be pressed against the glass substrate 10.

 The above embodiment can be variously modified.

In FIGS. 1A and 14B, the rubber cushion 8 may be formed of resin or the like instead of rubber.

For example, an optical integrated circuit component or an optoelectronic integrated circuit (OEIC) can be mounted on the substrate of the present invention. The latter is
An optical device such as a laser or a photodiode is further integrated on one substrate with respect to an ordinary silicon integrated circuit in which a bipolar transistor and a MOS FET are integrated.

In the examples of FIGS. 1 (A) and 1 (B), it is described that the electric printed wiring is provided on the glass substrate 10. However, this is not always necessary, and only the optical component having no electric circuit is provided on the glass substrate 10. It is needless to say that in this case, it is not necessary to provide an electric terminal on the optical component.

(Effects of the Invention) According to the optical surface mounting apparatus and the optical component thereof according to the present invention, the first guide means fixed in position relative to the end face of the optical waveguide is relatively fixed to the optical terminal. The optical component is fixed on the main surface by engaging with the second guide means fixed in position, and the optical terminal and the end face of the optical waveguide are optically coupled. The alignment between the optical terminal and the end face of the optical waveguide is automatically performed by the engagement with the guide means. Therefore, the mounting of the optical components can be performed extremely easily, and the optical axis adjustment between the individual optical components as in the related art is not required, and the number of steps can be greatly reduced. Therefore, it is possible to mass-produce a complicated optical circuit, and it becomes very easy to mount and change the design of the optical circuit.

Thus, the present invention is important as an optical component surface mounting technology similar to SMT, and the application of optical technology to subscribers, LANs, OA equipment, AV equipment, etc., for which demand is expected to increase rapidly in the future. Has a significant impact on

[Brief description of the drawings]

1 (A) and 1 (B) are perspective views each showing a mounted state of an optoelectronic integrated device, and FIG. 1 (A) is a view showing an example in which a main surface 30 is cut to project an end surface 14; Figure (B) is the main surface
2 (A), 2 (B) and 2 (C) are cross-sectional views of main parts of FIGS. 1 (A) and 1 (B), respectively. The figure is a cross-sectional view taken along the line AA in FIG. 2 (A). FIG. 4 is a cross-sectional view of a main part showing a mounted state of the switching device. (A),
5 (B) and (C) are cross-sectional views of main parts showing a mounted state of another integrated device. FIGS. 5 (A) and 6 (A) show examples in which the end face 14 protrudes from the main face 30. Figure, FIG. 5 (B),
FIG. 6 (B) shows the SELFOC lenses 5, 7 on the flange 2.
FIG. 5 (C), FIG. 6 (C) showing an example in which is fixed.
Fig. 7 shows an example in which Selfoc lenses 5, 7 are fixed to the housing 1 so that the lens end faces are flush with the bottom of the housing 1. Fig. 7 shows a plug for connecting optical waveguides between optical waveguides to the substrate. FIG. 8 is a cross-sectional view showing a precision fitting with a built-in plug of FIG. 7, FIG. 9 is a schematic plan view showing a mixing plug or a duplexer / multiplexer plug, FIG. (A), (B), (C), and (D) are perspective views showing a process of forming an optical waveguide on a glass substrate, FIG. 11 is a cross-sectional view of FIG. 10 (D), FIG. FIG. 13 is a diagram showing the configuration of another example of the mounted state of the device and its AA cross-sectional view. FIG. 14 is a front view showing another mounting method of the integrated device. FIG. 15 is a diagram showing an optical waveguide formed. FIG. 16 is a perspective view showing a conventional glass substrate, and FIG. 16 is a sectional view of FIG. DESCRIPTION OF SYMBOLS 1 ... Housing part 2 ... Flange part 3 ... Electric processing part (circuit) 4 ... Light receiving element 5 ... Selfoc lens (optical input terminal) 6 ... Light emitting element 7 ... Selfoc lens (optical output) 8) Rubber cushion 9 Guide pin (second guide means) 10 Glass substrate 11 Guide hole (first guide means) 12, 12A, 12B, 12C, 12D Optical waveguide 12a …… Linear part, 12b… Bend part 12c …… End part 14,14A, 14B, 14C, 14D …… End face 15… Electrical input / output terminal, 16… Isolator part 17 …… Polarizer, 18 …… Faraday element 19 ... analyzer, 20 ... mirror 21 ... first mask, 22 ... exposed part 26 ... second mask, 30,31 ... main surface 33 ... optical connector, 34 ... electric Connector 43,68… Optical fiber, 44,51… Plug 45,52… Precision fitting 50,60… Optoelectronic integrated device

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int.Cl. ⁶ , DB name) G02B 6/12

Claims (5)

(57) [Claims] 1. An optical surface mounting circuit for optical communication, comprising: a substrate; and an optical component attached to the substrate. An optical waveguide buried inside the optical waveguide, the optical waveguide having an end face vertically exposed toward a main surface of the substrate, and a first guide means provided on the substrate. Wherein the first guide means is fixed in position relative to the end face, and the first guide means is a guide projection projecting from the main surface or a guide recessed from the main surface. A hole, wherein the optical component has an optical terminal, and a second guide means is provided on a bottom surface of the optical component, and the second guide means is fixed in position relative to the optical terminal. The second guide means is provided on the bottom A guide hole protruding from the bottom surface or a guide hole recessed from the bottom surface, wherein the bottom surface of the optical component is fixed on the main surface of the substrate, and the first guide means and the second guide are provided. Means, wherein the optical terminal and the end face of the optical waveguide are in close contact with each other and are directly connected to the end face. 2. The optical surface mount circuit according to claim 1, wherein electric wiring is formed on the substrate, and electric terminals of the optical component are electrically connected to the electric wiring. 3. The optical surface mount circuit according to claim 2, wherein said electric wiring is a printed electric wiring. 4. When fixing the optical component on the main surface of the board by fitting the first guide means and the second guide means, a plate-like elastic body is fixed to the board. 2. The optical surface mount circuit according to claim 1, wherein said optical component is pressed against said substrate by said plate-shaped elastic body. 5. An optical component, comprising: an optical element; an optical terminal for inputting or outputting light to the optical element; and guide means fixed relative to the optical terminal. The optical terminal and the guide means are provided on the bottom surface of the optical component, and the second guide means is a guide projection projecting from the bottom surface or a guide hole recessed from the bottom surface. An optical component, comprising: