SE7906252L - COATED COPPER FILM FOR PRINTED CIRCUITS AND SET TO MAKE IT - Google Patents

COATED COPPER FILM FOR PRINTED CIRCUITS AND SET TO MAKE IT

Info

Publication number
SE7906252L
SE7906252L SE7906252A SE7906252A SE7906252L SE 7906252 L SE7906252 L SE 7906252L SE 7906252 A SE7906252 A SE 7906252A SE 7906252 A SE7906252 A SE 7906252A SE 7906252 L SE7906252 L SE 7906252L
Authority
SE
Sweden
Prior art keywords
copper
layer
treated
printed circuits
layers
Prior art date
Application number
SE7906252A
Other languages
Swedish (sv)
Other versions
SE435779B (en
Inventor
K Himuro
T Kato
N Kitamura
Original Assignee
Mitsui Anaconda Electro Copper
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Anaconda Electro Copper filed Critical Mitsui Anaconda Electro Copper
Publication of SE7906252L publication Critical patent/SE7906252L/en
Publication of SE435779B publication Critical patent/SE435779B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Abstract

A copper foil having multiple layers thereon is provided by electrodepositing an arsenic-containing copper layer thinly on at least one surface of a copper foil; further electrodepositing thinly thereon, a treated layer consisting of zinc and tin or consisting of an alloy of at least one of zinc and tin together with copper; and causing the metals of the respective layers to diffusion- permeate e.g. by heating through each other to thereby form alloy compositions in the vicinities of the boundaries of the respective layers. The resulting copper foil for printed circuits is superior in the adhesion-retainability between the respective treated layers. The foil may be first electrodeposited with a fine particulate copper layer, then a smooth copper layer, prior to the arsenic-containing copper layer. The outermost layer may be treated with a chromate (e.g. chromium electroplated) or an organic anti-oxidising agent.
SE7906252A 1978-07-20 1979-07-20 COATED COPPER FILM COMPREHENSIVE ARSENIC CONTENT LAYER AND SET TO MAKE FILM SE435779B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8777878A JPS5515216A (en) 1978-07-20 1978-07-20 Printed circut copper foil and method of manufacturing same

Publications (2)

Publication Number Publication Date
SE7906252L true SE7906252L (en) 1980-01-21
SE435779B SE435779B (en) 1984-10-15

Family

ID=13924430

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7906252A SE435779B (en) 1978-07-20 1979-07-20 COATED COPPER FILM COMPREHENSIVE ARSENIC CONTENT LAYER AND SET TO MAKE FILM

Country Status (6)

Country Link
JP (1) JPS5515216A (en)
DE (1) DE2928942C2 (en)
GB (1) GB2030176B (en)
IE (1) IE48597B1 (en)
NL (1) NL7905675A (en)
SE (1) SE435779B (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045349A (en) * 1983-08-23 1985-03-11 馬渕　健一 Beating tool driving circuit
US4551210A (en) * 1984-11-13 1985-11-05 Olin Corporation Dendritic treatment of metallic surfaces for improving adhesive bonding
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4647315A (en) * 1985-07-01 1987-03-03 Olin Corporation Copper stainproofing technique
US4961828A (en) * 1989-04-05 1990-10-09 Olin Corporation Treatment of metal foil
US5057193A (en) * 1989-04-05 1991-10-15 Olin Corporation Anti-tarnish treatment of metal foil
US4952285A (en) * 1989-04-14 1990-08-28 Olin Corporation Anti-tarnish treatment of metal foil
US5098796A (en) * 1989-10-13 1992-03-24 Olin Corporation Chromium-zinc anti-tarnish coating on copper foil
US5022968A (en) * 1990-09-20 1991-06-11 Olin Corporation Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5230932A (en) * 1989-10-13 1993-07-27 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
US5164235A (en) * 1990-03-06 1992-11-17 Olin Corporation Anti-tarnish treatment of metal foil
KR100297179B1 (en) * 1990-07-02 2002-12-26 올린 코포레이션 A method for electrodepositing copper or copper alloy foil with chromium-zinc ion to impart discoloration resistance to the foil and a basic electrolyte solution for electrodepositing a discoloration preventing film on copper or copper alloy foil.
US6861159B2 (en) * 1992-03-27 2005-03-01 The Louis Berkman Company Corrosion-resistant coated copper and method for making the same
US5332486A (en) * 1993-01-29 1994-07-26 Gould Electronics Inc. Anti-oxidant coatings for copper foils
JP3292774B2 (en) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 Copper foil for printed wiring board and method for producing the same
KR20000011746A (en) * 1998-07-17 2000-02-25 미야무라 심뻬이 Method of drying copper foil and copper foil drying apparatus
JP3142259B2 (en) 1998-11-30 2001-03-07 三井金属鉱業株式会社 Copper foil for printed wiring board excellent in chemical resistance and heat resistance and method for producing the same
US6342308B1 (en) * 1999-09-29 2002-01-29 Yates Foil Usa, Inc. Copper foil bonding treatment with improved bond strength and resistance to undercutting
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP3670185B2 (en) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
JP3670186B2 (en) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
JP3306404B2 (en) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 Method for producing surface-treated copper foil and copper-clad laminate using surface-treated copper foil obtained by the method
JP3661763B2 (en) * 2000-01-28 2005-06-22 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
US7029761B2 (en) * 2003-04-30 2006-04-18 Mec Company Ltd. Bonding layer for bonding resin on copper surface
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
JP5406278B2 (en) * 2009-03-27 2014-02-05 Ｊｘ日鉱日石金属株式会社 Copper foil for printed wiring board and method for producing the same
JP2011162860A (en) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The Surface-roughened copper foil, method of producing the same and copper-clad laminate plate
CN103221583B (en) 2010-11-22 2015-05-13 三井金属矿业株式会社 Surface treated copper foil

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE789715A (en) * 1971-10-08 1973-02-01 Yates Industries MULTI-LAYER COPPER SHEET TREATMENT
JPS572200B2 (en) * 1972-06-12 1982-01-14
JPS5247177B2 (en) * 1972-07-04 1977-11-30
DE2511189C2 (en) * 1975-03-14 1976-10-21 Heinz Bungard METHOD FOR MANUFACTURING SURFACE-CLAD BASE MATERIAL FOR MANUFACTURING PRINTED CIRCUITS
JPS5856758B2 (en) * 1975-12-17 1983-12-16 ミツイアナコンダドウハク カブシキガイシヤ Douhakuhiyoumenshiyorihouhou

Also Published As

Publication number Publication date
GB2030176A (en) 1980-04-02
SE435779B (en) 1984-10-15
JPS5515216A (en) 1980-02-02
IE791383L (en) 1980-01-20
JPS6152240B2 (en) 1986-11-12
NL7905675A (en) 1980-01-22
IE48597B1 (en) 1985-03-20
DE2928942C2 (en) 1982-04-08
GB2030176B (en) 1982-10-20
DE2928942A1 (en) 1980-02-07

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