GB2030176B - Copper foil suitable for use in making printed circuits - Google Patents

Copper foil suitable for use in making printed circuits

Info

Publication number
GB2030176B
GB2030176B GB7925492A GB7925492A GB2030176B GB 2030176 B GB2030176 B GB 2030176B GB 7925492 A GB7925492 A GB 7925492A GB 7925492 A GB7925492 A GB 7925492A GB 2030176 B GB2030176 B GB 2030176B
Authority
GB
United Kingdom
Prior art keywords
copper foil
printed circuits
making printed
foil suitable
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7925492A
Other versions
GB2030176A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui-Anaconda Electro Copper Sheet Co Ltd
Original Assignee
Mitsui-Anaconda Electro Copper Sheet Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui-Anaconda Electro Copper Sheet Co Ltd filed Critical Mitsui-Anaconda Electro Copper Sheet Co Ltd
Publication of GB2030176A publication Critical patent/GB2030176A/en
Application granted granted Critical
Publication of GB2030176B publication Critical patent/GB2030176B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
GB7925492A 1978-07-20 1979-07-20 Copper foil suitable for use in making printed circuits Expired GB2030176B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8777878A JPS5515216A (en) 1978-07-20 1978-07-20 Printed circut copper foil and method of manufacturing same

Publications (2)

Publication Number Publication Date
GB2030176A GB2030176A (en) 1980-04-02
GB2030176B true GB2030176B (en) 1982-10-20

Family

ID=13924430

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7925492A Expired GB2030176B (en) 1978-07-20 1979-07-20 Copper foil suitable for use in making printed circuits

Country Status (6)

Country Link
JP (1) JPS5515216A (en)
DE (1) DE2928942C2 (en)
GB (1) GB2030176B (en)
IE (1) IE48597B1 (en)
NL (1) NL7905675A (en)
SE (1) SE435779B (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045349A (en) * 1983-08-23 1985-03-11 馬渕　健一 Beating tool driving circuit
US4551210A (en) * 1984-11-13 1985-11-05 Olin Corporation Dendritic treatment of metallic surfaces for improving adhesive bonding
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4647315A (en) * 1985-07-01 1987-03-03 Olin Corporation Copper stainproofing technique
US5057193A (en) * 1989-04-05 1991-10-15 Olin Corporation Anti-tarnish treatment of metal foil
US4961828A (en) * 1989-04-05 1990-10-09 Olin Corporation Treatment of metal foil
US4952285A (en) * 1989-04-14 1990-08-28 Olin Corporation Anti-tarnish treatment of metal foil
US5022968A (en) * 1990-09-20 1991-06-11 Olin Corporation Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil
US5230932A (en) * 1989-10-13 1993-07-27 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil
US5098796A (en) * 1989-10-13 1992-03-24 Olin Corporation Chromium-zinc anti-tarnish coating on copper foil
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
US5164235A (en) * 1990-03-06 1992-11-17 Olin Corporation Anti-tarnish treatment of metal foil
KR100297179B1 (en) * 1990-07-02 2002-12-26 올린 코포레이션 A method for electrodepositing copper or copper alloy foil with chromium-zinc ion to impart discoloration resistance to the foil and a basic electrolyte solution for electrodepositing a discoloration preventing film on copper or copper alloy foil.
US6861159B2 (en) * 1992-03-27 2005-03-01 The Louis Berkman Company Corrosion-resistant coated copper and method for making the same
US5332486A (en) * 1993-01-29 1994-07-26 Gould Electronics Inc. Anti-oxidant coatings for copper foils
JP3292774B2 (en) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 Copper foil for printed wiring board and method for producing the same
KR20000011746A (en) * 1998-07-17 2000-02-25 미야무라 심뻬이 Method of drying copper foil and copper foil drying apparatus
JP3142259B2 (en) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 Copper foil for printed wiring board excellent in chemical resistance and heat resistance and method for producing the same
US6342308B1 (en) * 1999-09-29 2002-01-29 Yates Foil Usa, Inc. Copper foil bonding treatment with improved bond strength and resistance to undercutting
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP3670185B2 (en) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
JP3661763B2 (en) * 2000-01-28 2005-06-22 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
JP3670186B2 (en) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
JP3306404B2 (en) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 Method for producing surface-treated copper foil and copper-clad laminate using surface-treated copper foil obtained by the method
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
US7029761B2 (en) * 2003-04-30 2006-04-18 Mec Company Ltd. Bonding layer for bonding resin on copper surface
WO2010110092A1 (en) * 2009-03-27 2010-09-30 日鉱金属株式会社 Copper foil for printed wiring board and method for producing same
JP2011162860A (en) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The Surface-roughened copper foil, method of producing the same and copper-clad laminate plate
US9138964B2 (en) 2010-11-22 2015-09-22 Mitsui Mining & Smelting Co., Ltd Surface-treated copper foil

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE789715A (en) * 1971-10-08 1973-02-01 Yates Industries MULTI-LAYER COPPER SHEET TREATMENT
JPS572200B2 (en) * 1972-06-12 1982-01-14
JPS5247177B2 (en) * 1972-07-04 1977-11-30
DE2511189C2 (en) * 1975-03-14 1976-10-21 Heinz Bungard METHOD FOR MANUFACTURING SURFACE-CLAD BASE MATERIAL FOR MANUFACTURING PRINTED CIRCUITS
JPS5856758B2 (en) * 1975-12-17 1983-12-16 ミツイアナコンダドウハク カブシキガイシヤ Douhakuhiyoumenshiyorihouhou

Also Published As

Publication number Publication date
SE435779B (en) 1984-10-15
IE791383L (en) 1980-01-20
GB2030176A (en) 1980-04-02
JPS6152240B2 (en) 1986-11-12
NL7905675A (en) 1980-01-22
DE2928942A1 (en) 1980-02-07
JPS5515216A (en) 1980-02-02
DE2928942C2 (en) 1982-04-08
IE48597B1 (en) 1985-03-20
SE7906252L (en) 1980-01-21

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Effective date: 19990719