IE791383L - Copper foil with electro deposited metal coatings. - Google Patents
Copper foil with electro deposited metal coatings.Info
- Publication number
- IE791383L IE791383L IE791383A IE138379A IE791383L IE 791383 L IE791383 L IE 791383L IE 791383 A IE791383 A IE 791383A IE 138379 A IE138379 A IE 138379A IE 791383 L IE791383 L IE 791383L
- Authority
- IE
- Ireland
- Prior art keywords
- copper foil
- copper
- layer
- treated
- layers
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
A copper foil having multiple layers thereon is provided by electrodepositing an arsenic-containing copper layer thinly on at least one surface of a copper foil; further electrodepositing thinly thereon, a treated layer consisting of zinc and tin or consisting of an alloy of at least one of zinc and tin together with copper; and causing the metals of the respective layers to diffusion- permeate e.g. by heating through each other to thereby form alloy compositions in the vicinities of the boundaries of the respective layers. The resulting copper foil for printed circuits is superior in the adhesion-retainability between the respective treated layers. The foil may be first electrodeposited with a fine particulate copper layer, then a smooth copper layer, prior to the arsenic-containing copper layer. The outermost layer may be treated with a chromate (e.g. chromium electroplated) or an organic anti-oxidising agent.
[GB2030176A]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8777878A JPS5515216A (en) | 1978-07-20 | 1978-07-20 | Printed circut copper foil and method of manufacturing same |
Publications (2)
Publication Number | Publication Date |
---|---|
IE791383L true IE791383L (en) | 1980-01-20 |
IE48597B1 IE48597B1 (en) | 1985-03-20 |
Family
ID=13924430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IE1383/79A IE48597B1 (en) | 1978-07-20 | 1979-08-08 | Copper foil suitable for use in making printed circuits |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5515216A (en) |
DE (1) | DE2928942C2 (en) |
GB (1) | GB2030176B (en) |
IE (1) | IE48597B1 (en) |
NL (1) | NL7905675A (en) |
SE (1) | SE435779B (en) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6045349A (en) * | 1983-08-23 | 1985-03-11 | 馬渕 健一 | Beating tool driving circuit |
US4549950A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Systems for producing electroplated and/or treated metal foil |
US4552627A (en) * | 1984-11-13 | 1985-11-12 | Olin Corporation | Preparation for improving the adhesion properties of metal foils |
US4532014A (en) * | 1984-11-13 | 1985-07-30 | Olin Corporation | Laser alignment system |
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
US4551210A (en) * | 1984-11-13 | 1985-11-05 | Olin Corporation | Dendritic treatment of metallic surfaces for improving adhesive bonding |
US4549941A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces |
US4647315A (en) * | 1985-07-01 | 1987-03-03 | Olin Corporation | Copper stainproofing technique |
US5057193A (en) * | 1989-04-05 | 1991-10-15 | Olin Corporation | Anti-tarnish treatment of metal foil |
US4961828A (en) * | 1989-04-05 | 1990-10-09 | Olin Corporation | Treatment of metal foil |
US4952285A (en) * | 1989-04-14 | 1990-08-28 | Olin Corporation | Anti-tarnish treatment of metal foil |
US5230932A (en) * | 1989-10-13 | 1993-07-27 | Olin Corporation | Chromium-zinc anti-tarnish coating for copper foil |
US5250363A (en) * | 1989-10-13 | 1993-10-05 | Olin Corporation | Chromium-zinc anti-tarnish coating for copper foil having a dark color |
US5022968A (en) * | 1990-09-20 | 1991-06-11 | Olin Corporation | Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil |
US5098796A (en) * | 1989-10-13 | 1992-03-24 | Olin Corporation | Chromium-zinc anti-tarnish coating on copper foil |
US5071520A (en) * | 1989-10-30 | 1991-12-10 | Olin Corporation | Method of treating metal foil to improve peel strength |
US5164235A (en) * | 1990-03-06 | 1992-11-17 | Olin Corporation | Anti-tarnish treatment of metal foil |
KR100297179B1 (en) * | 1990-07-02 | 2002-12-26 | 올린 코포레이션 | A method for electrodepositing copper or copper alloy foil with chromium-zinc ion to impart discoloration resistance to the foil and a basic electrolyte solution for electrodepositing a discoloration preventing film on copper or copper alloy foil. |
US6861159B2 (en) * | 1992-03-27 | 2005-03-01 | The Louis Berkman Company | Corrosion-resistant coated copper and method for making the same |
US5332486A (en) * | 1993-01-29 | 1994-07-26 | Gould Electronics Inc. | Anti-oxidant coatings for copper foils |
JP3292774B2 (en) * | 1994-02-15 | 2002-06-17 | 三井金属鉱業株式会社 | Copper foil for printed wiring board and method for producing the same |
KR20000011746A (en) * | 1998-07-17 | 2000-02-25 | 미야무라 심뻬이 | Method of drying copper foil and copper foil drying apparatus |
JP3142259B2 (en) * | 1998-11-30 | 2001-03-07 | 三井金属鉱業株式会社 | Copper foil for printed wiring board excellent in chemical resistance and heat resistance and method for producing the same |
US6342308B1 (en) * | 1999-09-29 | 2002-01-29 | Yates Foil Usa, Inc. | Copper foil bonding treatment with improved bond strength and resistance to undercutting |
US6579568B2 (en) | 1999-11-29 | 2003-06-17 | Mitsui Mining & Smelting Co., Ltd. | Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
JP3306404B2 (en) * | 2000-01-28 | 2002-07-24 | 三井金属鉱業株式会社 | Method for producing surface-treated copper foil and copper-clad laminate using surface-treated copper foil obtained by the method |
JP3670185B2 (en) * | 2000-01-28 | 2005-07-13 | 三井金属鉱業株式会社 | Method for producing surface-treated copper foil for printed wiring board |
JP3670186B2 (en) * | 2000-01-28 | 2005-07-13 | 三井金属鉱業株式会社 | Method for producing surface-treated copper foil for printed wiring board |
JP3661763B2 (en) * | 2000-01-28 | 2005-06-22 | 三井金属鉱業株式会社 | Method for producing surface-treated copper foil for printed wiring board |
US7029761B2 (en) * | 2003-04-30 | 2006-04-18 | Mec Company Ltd. | Bonding layer for bonding resin on copper surface |
US7156904B2 (en) * | 2003-04-30 | 2007-01-02 | Mec Company Ltd. | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby |
KR102104161B1 (en) * | 2009-03-27 | 2020-04-23 | 제이엑스금속주식회사 | Copper foil for printed wiring board and method for producing same |
JP2011162860A (en) * | 2010-02-12 | 2011-08-25 | Furukawa Electric Co Ltd:The | Surface-roughened copper foil, method of producing the same and copper-clad laminate plate |
MY163882A (en) | 2010-11-22 | 2017-11-15 | Mitsui Mining & Smelting Co | Surface-treated copper foil |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE789715A (en) * | 1971-10-08 | 1973-02-01 | Yates Industries | MULTI-LAYER COPPER SHEET TREATMENT |
JPS572200B2 (en) * | 1972-06-12 | 1982-01-14 | ||
JPS5247177B2 (en) * | 1972-07-04 | 1977-11-30 | ||
DE2511189C2 (en) * | 1975-03-14 | 1976-10-21 | Heinz Bungard | METHOD FOR MANUFACTURING SURFACE-CLAD BASE MATERIAL FOR MANUFACTURING PRINTED CIRCUITS |
JPS5856758B2 (en) * | 1975-12-17 | 1983-12-16 | ミツイアナコンダドウハク カブシキガイシヤ | Douhakuhiyoumenshiyorihouhou |
-
1978
- 1978-07-20 JP JP8777878A patent/JPS5515216A/en active Granted
-
1979
- 1979-07-18 DE DE2928942A patent/DE2928942C2/en not_active Expired
- 1979-07-20 SE SE7906252A patent/SE435779B/en unknown
- 1979-07-20 NL NL7905675A patent/NL7905675A/en not_active Application Discontinuation
- 1979-07-20 GB GB7925492A patent/GB2030176B/en not_active Expired
- 1979-08-08 IE IE1383/79A patent/IE48597B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2030176A (en) | 1980-04-02 |
GB2030176B (en) | 1982-10-20 |
JPS5515216A (en) | 1980-02-02 |
IE48597B1 (en) | 1985-03-20 |
DE2928942A1 (en) | 1980-02-07 |
SE7906252L (en) | 1980-01-21 |
DE2928942C2 (en) | 1982-04-08 |
NL7905675A (en) | 1980-01-22 |
JPS6152240B2 (en) | 1986-11-12 |
SE435779B (en) | 1984-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK9A | Patent expired |