SE7808954L - Forfarande och material for framstellning av tryckta kretsar - Google Patents
Forfarande och material for framstellning av tryckta kretsarInfo
- Publication number
- SE7808954L SE7808954L SE7808954A SE7808954A SE7808954L SE 7808954 L SE7808954 L SE 7808954L SE 7808954 A SE7808954 A SE 7808954A SE 7808954 A SE7808954 A SE 7808954A SE 7808954 L SE7808954 L SE 7808954L
- Authority
- SE
- Sweden
- Prior art keywords
- procedure
- printed circuits
- preparing printed
- preparing
- circuits
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
- B32B2309/022—Temperature vs pressure profiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
- B32B2309/025—Temperature vs time profiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2739494A DE2739494B2 (de) | 1977-08-30 | 1977-08-30 | Verfahren zum Herstellen elektrischer Leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
SE7808954L true SE7808954L (sv) | 1979-03-01 |
Family
ID=6017911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7808954A SE7808954L (sv) | 1977-08-30 | 1978-08-24 | Forfarande och material for framstellning av tryckta kretsar |
Country Status (8)
Country | Link |
---|---|
US (1) | US4336100A (xx) |
JP (1) | JPS5456173A (xx) |
AT (1) | AT377884B (xx) |
CH (1) | CH631587A5 (xx) |
DE (1) | DE2739494B2 (xx) |
GB (1) | GB2007152B (xx) |
NL (1) | NL7808763A (xx) |
SE (1) | SE7808954L (xx) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3027336A1 (de) * | 1980-07-18 | 1982-02-18 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur bohrungsisolierung bei metallkernleiterplatten |
JPS5797970U (xx) * | 1980-12-08 | 1982-06-16 | ||
DE3408630A1 (de) * | 1984-03-09 | 1985-09-12 | Hoechst Ag, 6230 Frankfurt | Verfahren und schichtmaterial zur herstellung durchkontaktierter elektrischer leiterplatten |
US4767672A (en) * | 1984-09-17 | 1988-08-30 | Kyocera Corporation | Process for preparation of glazed ceramic substrate and glazing composition used therefor |
US4679122A (en) * | 1984-10-09 | 1987-07-07 | General Electric Company | Metal core printed circuit board |
JPS61230933A (ja) * | 1985-04-06 | 1986-10-15 | 日本製箔株式会社 | プリント配線基板の製造方法 |
GB8512916D0 (en) * | 1985-05-22 | 1985-06-26 | Horgan M F | Probe cards |
JPS62130597A (ja) * | 1985-12-02 | 1987-06-12 | オ−ケ−プリント配線株式会社 | プリント配線基板の製造方法 |
JPS61285788A (ja) * | 1985-06-13 | 1986-12-16 | オ−ケ−プリント配線株式会社 | プリント配線基板の製造方法 |
DE3536883A1 (de) * | 1985-10-16 | 1987-04-16 | Isola Werke Ag | Basismaterial fuer gedruckte schaltungen |
DE3790062C2 (xx) * | 1986-02-06 | 1992-01-23 | Fujitsu Ltd., Kawasaki, Kanagawa, Jp | |
JPS62251136A (ja) * | 1986-04-25 | 1987-10-31 | 三菱樹脂株式会社 | 金属複合積層板 |
JPS632396A (ja) * | 1986-06-23 | 1988-01-07 | オ−ケ−プリント配線株式会社 | プリント配線基板 |
DE3623504A1 (de) * | 1986-07-09 | 1988-01-21 | Schering Ag | Kupferaetzloesungen |
DE3626232A1 (de) * | 1986-08-02 | 1988-03-10 | Akyuerek Susanne | Verfahren zur herstellung einer leiterplatte |
DE3631426A1 (de) * | 1986-09-16 | 1988-03-24 | Ruwel Werke Gmbh | Einen plattenfoermigen metallkern aufweisende leiterplatten und verfahren zu deren herstellung |
DE3708000A1 (de) * | 1987-03-12 | 1988-09-22 | Isola Werke Ag | Verfahren zur herstellung von metallkerne enthaltenden elektrischen leiterplatten und basismaterial dafuer |
JPS63241991A (ja) * | 1987-03-30 | 1988-10-07 | 株式会社 コサク | メタルベ−スプリント基板の製造方法 |
DE3826522A1 (de) * | 1988-08-04 | 1990-02-08 | Teldix Gmbh | Leiterplatte |
US5208068A (en) * | 1989-04-17 | 1993-05-04 | International Business Machines Corporation | Lamination method for coating the sidewall or filling a cavity in a substrate |
EP0393381B1 (en) * | 1989-04-17 | 1995-11-08 | International Business Machines Corporation | Lamination method for coating the sidewall or filling a cavity in a substrate |
US5120384A (en) * | 1989-05-25 | 1992-06-09 | Matsushita Electric Works, Ltd. | Method of manufacturing multilayer laminate |
JPH0621595A (ja) * | 1992-07-03 | 1994-01-28 | Cmk Corp | プリント配線板用素材 |
US5840402A (en) * | 1994-06-24 | 1998-11-24 | Sheldahl, Inc. | Metallized laminate material having ordered distribution of conductive through holes |
JP3565069B2 (ja) * | 1998-12-28 | 2004-09-15 | ソニーケミカル株式会社 | 両面フレキシブルプリント基板の製造方法 |
EP1870491B1 (de) * | 2006-06-22 | 2015-05-27 | Enthone, Inc. | Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen |
US20080148561A1 (en) * | 2006-12-22 | 2008-06-26 | Motorola, Inc. | Methods for making printed wiring boards |
KR101100708B1 (ko) | 2010-05-13 | 2011-12-30 | 엘에스산전 주식회사 | 진공 차단기 |
US10237985B2 (en) * | 2014-06-23 | 2019-03-19 | 3M Innovative Properties Company | Method of patterning a metal on a transparent conductor |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3334395A (en) * | 1962-11-26 | 1967-08-08 | Northrop Corp | Method of making a metal printed circuit board |
US3435127A (en) * | 1965-05-03 | 1969-03-25 | Burroughs Corp | Conductive adhesive articles and manufacture |
JPS49348B1 (xx) * | 1970-12-25 | 1974-01-07 | ||
US3969816A (en) * | 1972-12-11 | 1976-07-20 | Amp Incorporated | Bonded wire interconnection system |
US3934334A (en) * | 1974-04-15 | 1976-01-27 | Texas Instruments Incorporated | Method of fabricating metal printed wiring boards |
-
1977
- 1977-08-30 DE DE2739494A patent/DE2739494B2/de not_active Ceased
-
1978
- 1978-08-09 AT AT0579978A patent/AT377884B/de active
- 1978-08-24 SE SE7808954A patent/SE7808954L/xx unknown
- 1978-08-24 NL NL7808763A patent/NL7808763A/xx not_active Application Discontinuation
- 1978-08-25 CH CH900978A patent/CH631587A5/de not_active IP Right Cessation
- 1978-08-30 GB GB7834948A patent/GB2007152B/en not_active Expired
- 1978-08-30 JP JP10741178A patent/JPS5456173A/ja active Pending
-
1981
- 1981-05-18 US US06/264,857 patent/US4336100A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPS5456173A (en) | 1979-05-04 |
ATA579978A (de) | 1984-09-15 |
AT377884B (de) | 1985-05-10 |
CH631587A5 (de) | 1982-08-13 |
DE2739494A1 (de) | 1979-03-08 |
DE2739494B2 (de) | 1980-10-16 |
NL7808763A (nl) | 1979-03-02 |
US4336100A (en) | 1982-06-22 |
GB2007152B (en) | 1982-05-26 |
GB2007152A (en) | 1979-05-16 |
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