SE7414063L - - Google Patents

Info

Publication number
SE7414063L
SE7414063L SE7414063A SE7414063A SE7414063L SE 7414063 L SE7414063 L SE 7414063L SE 7414063 A SE7414063 A SE 7414063A SE 7414063 A SE7414063 A SE 7414063A SE 7414063 L SE7414063 L SE 7414063L
Authority
SE
Sweden
Prior art keywords
coating
percent
weight
alloy containing
copper
Prior art date
Application number
SE7414063A
Other languages
English (en)
Inventor
H Schreiner
D Friedrich
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7414063L publication Critical patent/SE7414063L/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
SE7414063A 1973-11-12 1974-11-08 SE7414063L (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2356351A DE2356351C3 (de) 1973-11-12 1973-11-12 Verfahren zum Herstellen eines feuerverzinnten Drahtes für elektrotechnische Zwecke

Publications (1)

Publication Number Publication Date
SE7414063L true SE7414063L (xx) 1975-05-13

Family

ID=5897833

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7414063A SE7414063L (xx) 1973-11-12 1974-11-08

Country Status (10)

Country Link
US (1) US4014660A (xx)
JP (1) JPS5079438A (xx)
CH (1) CH601488A5 (xx)
DE (1) DE2356351C3 (xx)
FR (1) FR2250829B1 (xx)
GB (1) GB1489362A (xx)
IT (1) IT1025569B (xx)
NL (1) NL7411796A (xx)
SE (1) SE7414063L (xx)
ZA (1) ZA747040B (xx)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5385382A (en) * 1977-01-05 1978-07-27 Hitachi Cable Ltd Preparing collective coating cable material
JPS5476041U (xx) * 1977-11-09 1979-05-30
FR2472253A1 (fr) * 1979-12-18 1981-06-26 Filotex Sa Procede de fabrication de cable electrique souple avec ame multibrins etamee et isolation appliquee a haute temperature
JPS58189364A (ja) * 1982-04-26 1983-11-05 Showa Electric Wire & Cable Co Ltd 一括スズめつき撚線の製造方法
US4441118A (en) * 1983-01-13 1984-04-03 Olin Corporation Composite copper nickel alloys with improved solderability shelf life
DE3420514C2 (de) * 1984-06-01 1986-04-17 Feindrahtwerk Adolf Edelhoff GmbH & Co, 5860 Iserlohn Verfahren zur Herstellung verzinnter Drähte
TW368523B (en) * 1994-03-17 1999-09-01 Fry Metals Inc Bismuth coating protection for copper
JPH10134869A (ja) * 1996-10-30 1998-05-22 Yazaki Corp 端子材料および端子
US6110608A (en) * 1996-12-10 2000-08-29 The Furukawa Electric Co., Ltd. Lead material for electronic part, lead and semiconductor device using the same
WO1998049367A1 (en) 1997-04-28 1998-11-05 Fry's Metals, Inc. Bismuth coating protection for copper
US20020009610A1 (en) * 1997-12-16 2002-01-24 Hanae Shimokawa Technical field
JP3622462B2 (ja) * 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
JPH11189835A (ja) * 1997-12-25 1999-07-13 Jst Mfg Co Ltd すず−ニッケル合金およびこの合金により表面処理を施した部品
US6164523A (en) * 1998-07-01 2000-12-26 Semiconductor Components Industries, Llc Electronic component and method of manufacture
DE19852271A1 (de) * 1998-11-13 2000-05-18 Edelhoff Adolf Feindrahtwerk Verfahren zur Herstellung verzinnter Drähte
JP3456454B2 (ja) * 1999-09-30 2003-10-14 株式会社村田製作所 ワイヤを有する電子部品
TW543164B (en) * 2002-05-29 2003-07-21 Kingtron Electronics Co Ltd Tape structure and fabrication method thereof
JP4447215B2 (ja) * 2002-12-16 2010-04-07 Ｎｅｃエレクトロニクス株式会社 電子部品
US20060068218A1 (en) * 2004-09-28 2006-03-30 Hooghan Kultaransingh N Whisker-free lead frames
US8367244B2 (en) * 2008-04-17 2013-02-05 Enovix Corporation Anode material having a uniform metal-semiconductor alloy layer
JP2011065936A (ja) * 2009-09-18 2011-03-31 Hitachi Cable Ltd フレキシブルフラットケーブル用導体及びその製造方法、並びにそれを用いたフレキシブルフラットケーブル
CN104064251A (zh) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 一种镀锡软铜线
CN105355258A (zh) * 2015-11-13 2016-02-24 芜湖楚江合金铜材有限公司 一种高性能镀锡铜线
US10376997B2 (en) * 2016-06-23 2019-08-13 Purdue Research Foundation Transient liquid phase bonding process and assemblies formed thereby
CN111286688B (zh) * 2020-04-02 2022-03-01 江西金屹有色金属有限公司 一种镀锡铜线的生产工艺

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621338B2 (de) * 1967-04-26 1971-04-01 Siemens Ag Verfahren und vorrichtung zum herstellen von zinn oder zinnlegierungsschichten
DE1621339A1 (de) * 1967-04-29 1971-06-03 Siemens Ag Verfahren zum Herstellen von mit Zinn oder einer ueberwiegend zinnhaltigen Legierung ueberzogenem Kupferdraht,insbesondere Kupferschaltdraht,durch Feuermetallisieren
US3573008A (en) * 1968-05-02 1971-03-30 Hudson Wire Co Composite metal article of copper material with a coat of nickel and tin

Also Published As

Publication number Publication date
FR2250829B1 (xx) 1977-07-08
NL7411796A (nl) 1975-05-14
CH601488A5 (xx) 1978-07-14
IT1025569B (it) 1978-08-30
ZA747040B (en) 1975-11-26
DE2356351B2 (de) 1979-10-18
JPS5079438A (xx) 1975-06-27
FR2250829A1 (xx) 1975-06-06
USB519680I5 (xx) 1976-03-30
US4014660A (en) 1977-03-29
GB1489362A (en) 1977-10-19
DE2356351A1 (de) 1975-05-28
DE2356351C3 (de) 1980-07-03

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