SE521528C3 - Svetsad benram - Google Patents

Svetsad benram

Info

Publication number
SE521528C3
SE521528C3 SE0102668A SE0102668A SE521528C3 SE 521528 C3 SE521528 C3 SE 521528C3 SE 0102668 A SE0102668 A SE 0102668A SE 0102668 A SE0102668 A SE 0102668A SE 521528 C3 SE521528 C3 SE 521528C3
Authority
SE
Sweden
Prior art keywords
conductor
leg
leg frame
contact surface
substrate
Prior art date
Application number
SE0102668A
Other languages
English (en)
Swedish (sv)
Other versions
SE521528C2 (sv
SE0102668L (sv
SE0102668D0 (sv
Inventor
Lars Gustafsson
Jan Oehrn
Per Lundstroem
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE0102668A priority Critical patent/SE521528C3/sv
Publication of SE0102668D0 publication Critical patent/SE0102668D0/xx
Priority to TW090121349A priority patent/TW531462B/zh
Priority to JP2003520257A priority patent/JP2004538656A/ja
Priority to PCT/SE2002/001434 priority patent/WO2003015485A1/en
Priority to CNB028153472A priority patent/CN1270376C/zh
Priority to EP02756051A priority patent/EP1415519A1/de
Publication of SE0102668L publication Critical patent/SE0102668L/xx
Publication of SE521528C2 publication Critical patent/SE521528C2/sv
Publication of SE521528C3 publication Critical patent/SE521528C3/sv

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Lead Frames For Integrated Circuits (AREA)
SE0102668A 2001-08-07 2001-08-07 Svetsad benram SE521528C3 (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE0102668A SE521528C3 (sv) 2001-08-07 2001-08-07 Svetsad benram
TW090121349A TW531462B (en) 2001-08-07 2001-08-29 Laser welded leadframe with hole
JP2003520257A JP2004538656A (ja) 2001-08-07 2002-08-07 溶接リードフレーム
PCT/SE2002/001434 WO2003015485A1 (en) 2001-08-07 2002-08-07 Welded leadframe
CNB028153472A CN1270376C (zh) 2001-08-07 2002-08-07 引线框架或元器件的引线连接到基底的接触焊盘上的方法
EP02756051A EP1415519A1 (de) 2001-08-07 2002-08-07 Geschweisster anschlusskamm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0102668A SE521528C3 (sv) 2001-08-07 2001-08-07 Svetsad benram

Publications (4)

Publication Number Publication Date
SE0102668D0 SE0102668D0 (sv) 2001-08-07
SE0102668L SE0102668L (sv) 2003-02-08
SE521528C2 SE521528C2 (sv) 2003-11-11
SE521528C3 true SE521528C3 (sv) 2003-12-10

Family

ID=20284987

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0102668A SE521528C3 (sv) 2001-08-07 2001-08-07 Svetsad benram

Country Status (6)

Country Link
EP (1) EP1415519A1 (de)
JP (1) JP2004538656A (de)
CN (1) CN1270376C (de)
SE (1) SE521528C3 (de)
TW (1) TW531462B (de)
WO (1) WO2003015485A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4842118B2 (ja) 2006-01-24 2011-12-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN102054658B (zh) * 2009-10-30 2013-03-27 日月光封装测试(上海)有限公司 封装打线工艺的加热治具及其方法
DE102020210201A1 (de) * 2020-08-12 2022-02-17 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Vorrichtung zum temperaturkritischen Fügen zweier Bauteilschichten
JP7690357B2 (ja) * 2020-12-02 2025-06-10 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
KR102840683B1 (ko) * 2022-11-30 2025-07-31 한국생산기술연구원 홀 드릴링 패턴을 이용한 접합소재 레이저 솔더링 접합방법 및 이에 사용되는 접합물 구조체

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4889275A (en) * 1988-11-02 1989-12-26 Motorola, Inc. Method for effecting solder interconnects
US4972989A (en) * 1989-10-30 1990-11-27 Motorola, Inc. Through the lead soldering
DE19840306A1 (de) * 1998-09-04 2000-03-09 Bosch Gmbh Robert Ausrichtleiste

Also Published As

Publication number Publication date
SE521528C2 (sv) 2003-11-11
CN1539256A (zh) 2004-10-20
SE0102668L (sv) 2003-02-08
WO2003015485A1 (en) 2003-02-20
TW531462B (en) 2003-05-11
EP1415519A1 (de) 2004-05-06
JP2004538656A (ja) 2004-12-24
SE0102668D0 (sv) 2001-08-07
CN1270376C (zh) 2006-08-16

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Legal Events

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