SE0102668D0 - Welded leadframe - Google Patents

Welded leadframe

Info

Publication number
SE0102668D0
SE0102668D0 SE0102668A SE0102668A SE0102668D0 SE 0102668 D0 SE0102668 D0 SE 0102668D0 SE 0102668 A SE0102668 A SE 0102668A SE 0102668 A SE0102668 A SE 0102668A SE 0102668 D0 SE0102668 D0 SE 0102668D0
Authority
SE
Sweden
Prior art keywords
lead
welding
lead frame
holes
hole
Prior art date
Application number
SE0102668A
Other languages
English (en)
Other versions
SE0102668L (sv
SE521528C2 (sv
SE521528C3 (sv
Inventor
Lars Gustafsson
Jan Oerhn
Per Lundstroem
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE0102668A priority Critical patent/SE521528C3/sv
Publication of SE0102668D0 publication Critical patent/SE0102668D0/sv
Priority to TW090121349A priority patent/TW531462B/zh
Priority to CNB028153472A priority patent/CN1270376C/zh
Priority to JP2003520257A priority patent/JP2004538656A/ja
Priority to PCT/SE2002/001434 priority patent/WO2003015485A1/en
Priority to EP02756051A priority patent/EP1415519A1/en
Publication of SE0102668L publication Critical patent/SE0102668L/sv
Publication of SE521528C2 publication Critical patent/SE521528C2/sv
Publication of SE521528C3 publication Critical patent/SE521528C3/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Lead Frames For Integrated Circuits (AREA)
SE0102668A 2001-08-07 2001-08-07 Svetsad benram SE521528C3 (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE0102668A SE521528C3 (sv) 2001-08-07 2001-08-07 Svetsad benram
TW090121349A TW531462B (en) 2001-08-07 2001-08-29 Laser welded leadframe with hole
CNB028153472A CN1270376C (zh) 2001-08-07 2002-08-07 引线框架或元器件的引线连接到基底的接触焊盘上的方法
JP2003520257A JP2004538656A (ja) 2001-08-07 2002-08-07 溶接リードフレーム
PCT/SE2002/001434 WO2003015485A1 (en) 2001-08-07 2002-08-07 Welded leadframe
EP02756051A EP1415519A1 (en) 2001-08-07 2002-08-07 Welded leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0102668A SE521528C3 (sv) 2001-08-07 2001-08-07 Svetsad benram

Publications (4)

Publication Number Publication Date
SE0102668D0 true SE0102668D0 (sv) 2001-08-07
SE0102668L SE0102668L (sv) 2003-02-08
SE521528C2 SE521528C2 (sv) 2003-11-11
SE521528C3 SE521528C3 (sv) 2003-12-10

Family

ID=20284987

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0102668A SE521528C3 (sv) 2001-08-07 2001-08-07 Svetsad benram

Country Status (6)

Country Link
EP (1) EP1415519A1 (sv)
JP (1) JP2004538656A (sv)
CN (1) CN1270376C (sv)
SE (1) SE521528C3 (sv)
TW (1) TW531462B (sv)
WO (1) WO2003015485A1 (sv)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4842118B2 (ja) 2006-01-24 2011-12-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN102054658B (zh) * 2009-10-30 2013-03-27 日月光封装测试(上海)有限公司 封装打线工艺的加热治具及其方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4889275A (en) * 1988-11-02 1989-12-26 Motorola, Inc. Method for effecting solder interconnects
US4972989A (en) * 1989-10-30 1990-11-27 Motorola, Inc. Through the lead soldering
DE19840306A1 (de) * 1998-09-04 2000-03-09 Bosch Gmbh Robert Ausrichtleiste

Also Published As

Publication number Publication date
SE0102668L (sv) 2003-02-08
SE521528C2 (sv) 2003-11-11
CN1270376C (zh) 2006-08-16
EP1415519A1 (en) 2004-05-06
TW531462B (en) 2003-05-11
CN1539256A (zh) 2004-10-20
SE521528C3 (sv) 2003-12-10
JP2004538656A (ja) 2004-12-24
WO2003015485A1 (en) 2003-02-20

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Legal Events

Date Code Title Description
NUG Patent has lapsed