SE449678B - Forfarande for framstellning av byggelement for sammankoppling av elektroniska komponenter - Google Patents

Forfarande for framstellning av byggelement for sammankoppling av elektroniska komponenter

Info

Publication number
SE449678B
SE449678B SE8202170A SE8202170A SE449678B SE 449678 B SE449678 B SE 449678B SE 8202170 A SE8202170 A SE 8202170A SE 8202170 A SE8202170 A SE 8202170A SE 449678 B SE449678 B SE 449678B
Authority
SE
Sweden
Prior art keywords
coating
wire
metal
carrier
resp
Prior art date
Application number
SE8202170A
Other languages
English (en)
Swedish (sv)
Other versions
SE8202170L (sv
Inventor
C L Lassen
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE8202170L publication Critical patent/SE8202170L/xx
Publication of SE449678B publication Critical patent/SE449678B/sv

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/00—Stock material or miscellaneous articles
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    • Y10T428/24322—Composite web or sheet

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Chemically Coating (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE8202170A 1981-04-14 1982-04-05 Forfarande for framstellning av byggelement for sammankoppling av elektroniska komponenter SE449678B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/254,132 US4500389A (en) 1981-04-14 1981-04-14 Process for the manufacture of substrates to interconnect electronic components

Publications (2)

Publication Number Publication Date
SE8202170L SE8202170L (sv) 1982-10-15
SE449678B true SE449678B (sv) 1987-05-11

Family

ID=22963047

Family Applications (1)

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SE8202170A SE449678B (sv) 1981-04-14 1982-04-05 Forfarande for framstellning av byggelement for sammankoppling av elektroniska komponenter

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US (1) US4500389A (fr)
JP (1) JPS5979594A (fr)
AT (1) AT385624B (fr)
AU (1) AU559827B2 (fr)
CA (1) CA1189196A (fr)
CH (1) CH660275A5 (fr)
DE (1) DE3211025A1 (fr)
ES (3) ES8304363A1 (fr)
FR (1) FR2503931B1 (fr)
GB (2) GB2096834B (fr)
IT (1) IT1147672B (fr)
NL (1) NL191641C (fr)
SE (1) SE449678B (fr)

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FR2573272A1 (fr) * 1984-11-14 1986-05-16 Int Standard Electric Corp Procede de realisation d'un substrat comportant un conducteur coaxial
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FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
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US4972050A (en) * 1989-06-30 1990-11-20 Kollmorgen Corporation Wire scribed circuit boards and methods of their manufacture
JP2811811B2 (ja) * 1989-10-03 1998-10-15 三菱電機株式会社 液晶表示装置
DE69122570T2 (de) * 1990-07-25 1997-02-13 Hitachi Chemical Co Ltd Leiterplatte mit Verbindung von Koaxialleitern untereinander
DE4037488A1 (de) * 1990-11-24 1992-05-27 Bosch Gmbh Robert Leistungsbausteine mit elektrisch isolierender thermischer ankopplung
US7062845B2 (en) 1996-06-05 2006-06-20 Laservia Corporation Conveyorized blind microvia laser drilling system
US6631558B2 (en) 1996-06-05 2003-10-14 Laservia Corporation Blind via laser drilling system
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Also Published As

Publication number Publication date
ATA116582A (de) 1987-09-15
AT385624B (de) 1988-04-25
NL191641B (nl) 1995-07-17
ES513839A0 (es) 1983-11-01
AU8793982A (en) 1984-03-08
ES511413A0 (es) 1983-03-01
CH660275A5 (de) 1987-03-31
GB8422466D0 (en) 1984-10-10
ES8503920A1 (es) 1985-03-16
JPS5979594A (ja) 1984-05-08
NL8201570A (nl) 1982-11-01
AU559827B2 (en) 1987-03-19
GB2146177A (en) 1985-04-11
ES513838A0 (es) 1985-03-16
FR2503931B1 (fr) 1986-02-21
ES8304363A1 (es) 1983-03-01
FR2503931A1 (fr) 1982-10-15
GB2146177B (en) 1985-10-23
GB2096834A (en) 1982-10-20
IT8248207A0 (it) 1982-04-09
SE8202170L (sv) 1982-10-15
US4500389A (en) 1985-02-19
CA1189196A (fr) 1985-06-18
IT1147672B (it) 1986-11-26
ES8400213A1 (es) 1983-11-01
DE3211025C2 (fr) 1991-11-21
GB2096834B (en) 1985-10-23
DE3211025A1 (de) 1982-10-21
NL191641C (nl) 1995-11-20

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