SE445186B - Fast lodkomposition - Google Patents
Fast lodkompositionInfo
- Publication number
- SE445186B SE445186B SE7809360A SE7809360A SE445186B SE 445186 B SE445186 B SE 445186B SE 7809360 A SE7809360 A SE 7809360A SE 7809360 A SE7809360 A SE 7809360A SE 445186 B SE445186 B SE 445186B
- Authority
- SE
- Sweden
- Prior art keywords
- composition according
- solder
- wax
- weight
- flux
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3873877 | 1977-09-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7809360L SE7809360L (sv) | 1979-03-17 |
SE445186B true SE445186B (sv) | 1986-06-09 |
Family
ID=10405394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7809360A SE445186B (sv) | 1977-09-16 | 1978-09-06 | Fast lodkomposition |
Country Status (20)
Country | Link |
---|---|
US (1) | US4493738A (nl) |
JP (1) | JPS5453653A (nl) |
AT (2) | AT372893B (nl) |
AU (1) | AU526809B2 (nl) |
BE (1) | BE870467A (nl) |
BR (1) | BR7805990A (nl) |
CH (1) | CH636788A5 (nl) |
DE (1) | DE2840415A1 (nl) |
DK (1) | DK408378A (nl) |
ES (1) | ES473311A1 (nl) |
FI (1) | FI70810C (nl) |
FR (1) | FR2403156A1 (nl) |
GB (1) | GB2004489B (nl) |
HK (1) | HK49183A (nl) |
IT (1) | IT1099069B (nl) |
NL (1) | NL7809344A (nl) |
NO (1) | NO151652C (nl) |
NZ (1) | NZ188341A (nl) |
SE (1) | SE445186B (nl) |
ZA (1) | ZA785046B (nl) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3295505A (en) * | 1963-05-31 | 1967-01-03 | Jordan Alfred | Rotary piston apparatus |
GB2027617B (en) * | 1978-08-01 | 1982-07-07 | Johnson Matthey Co Ltd | Flux coated brazing materials |
ES8104932A1 (es) * | 1979-04-06 | 1981-05-16 | Johnson Matthey Co Ltd | Procedimiento para la obtencion de una composicion para sol-dar. |
EP0034468A1 (en) * | 1980-02-15 | 1981-08-26 | JOHNSON, MATTHEY & Co., LIMITED | Improvements in and relating to the joining of tubes |
JPS5781993A (en) * | 1980-11-07 | 1982-05-22 | Taruchin Kk | Cream-like solder having adhesiveness or dry film formability |
JPS58192696A (ja) * | 1982-05-06 | 1983-11-10 | Nippon Univac Kk | 光線溶接用フラツクス |
DE3235574A1 (de) * | 1982-09-25 | 1984-03-29 | Degussa Ag, 6000 Frankfurt | Lotlegierungen zum aufloeten von kontaktwerkstoffen |
US4593851A (en) * | 1984-07-17 | 1986-06-10 | United Stirling Ab | Method of connecting elements by brazing |
FR2585190B1 (fr) * | 1985-07-17 | 1988-04-08 | Allied Corp | Cosse a fut borgne, notamment pour connecteurs electriques |
US5062896A (en) * | 1990-03-30 | 1991-11-05 | International Business Machines Corporation | Solder/polymer composite paste and method |
US5123586A (en) * | 1990-09-21 | 1992-06-23 | General Atomics | Process for soldering superconducting fibers into a copper channel |
CH684196A5 (de) * | 1991-05-30 | 1994-07-29 | Castolin Sa | Verschleissfeste Schicht auf einem Bauteil sowie Verfahren zu deren Herstellung. |
IT1255080B (it) * | 1992-04-01 | 1995-10-18 | Whirlpool Italia | Metodo per realizzare elementi preformati di forme e dimensioni voluteper la saldatura, in particolare la saldobrasatura, di componenti metallici ed elementi cosi' ottenuti |
JPH07100690A (ja) * | 1993-10-06 | 1995-04-18 | Nippon Arumitsuto Kk | はんだ付用フラックス |
DE19747041A1 (de) | 1997-10-24 | 1999-04-29 | Degussa | Flußmittelfreie Hartlotpaste |
GB2380964B (en) * | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
US6830632B1 (en) | 2002-07-24 | 2004-12-14 | Lucas Milhaupt, Inc. | Flux cored preforms for brazing |
BRPI0618466A2 (pt) * | 2005-11-10 | 2011-08-30 | Wolverine Tube Inc | composição de fluxo, material de solda forte com camada de comprimento contìnuo de elastÈmero contendo um fluxo, bem como métodos para a fabricação do material de solda forte e para soldagem à solda forte |
EP1808255A1 (en) * | 2006-01-11 | 2007-07-18 | Corus Aluminium Walzprodukte GmbH | Method of manufacturing a brazed assembly |
EP2038085B1 (en) * | 2006-05-25 | 2019-09-11 | Bellman-melcor Development, Llc | Wire with flux for brazing and soldering and method of making the same |
US8274014B2 (en) * | 2006-05-25 | 2012-09-25 | Bellman-Melcor Development, Llc | Filler metal with flux for brazing and soldering and method of making and using same |
EP2091686B1 (en) * | 2006-12-11 | 2016-06-15 | Lucas-Milhaupt, Inc. | Low and non-silver filler metals and alloys and corresponding joinder systems and methods |
CA2688325A1 (en) * | 2007-05-25 | 2008-12-04 | Lucas Milhaupt, Inc. | Brazing material |
US9157134B2 (en) | 2009-10-26 | 2015-10-13 | Lucas-Milhaupt, Inc. | Low silver, low nickel brazing material |
US9073153B2 (en) | 2010-02-09 | 2015-07-07 | Nordson Corporation | Flux and solder material and method of making same |
KR101097868B1 (ko) * | 2010-02-18 | 2011-12-23 | 주식회사 하이닉스반도체 | 반도체 패키지의 제조방법 |
EP2556916A1 (en) * | 2011-08-10 | 2013-02-13 | Nordson Corporation | Flux and solder material and method of making same |
EP2808114A3 (en) | 2013-05-30 | 2015-09-02 | Lucas-Milhaupt, Inc. | Process for flux coating braze preforms and discrete parts |
CN105081598A (zh) * | 2014-05-06 | 2015-11-25 | 烟台市固光焊接材料有限责任公司 | 焊剂膏及其应用 |
US9731383B2 (en) | 2014-07-09 | 2017-08-15 | Bellman-Melcor Development, Llc | Filler metal with flux for brazing and soldering and method of using same |
US10744601B2 (en) | 2015-08-07 | 2020-08-18 | Bellman-Melcor Development, Llc | Bonded brazing ring system and method for adhering a brazing ring to a tube |
DE102019125474A1 (de) * | 2019-09-23 | 2021-03-25 | Hans-Jürgen Köhler | Verfahren zur Herstellung eines Hochtemperaturlötmittels zum Ofenlöten von Körpern aus Stahl und/oder Edelstahl, Hochtemperaturlötmittel und Verwendung eines Hochtemperaturlötmittels |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1074804A (fr) * | 1952-01-22 | 1954-10-08 | Produit pour soudure, étamage et galvanisation | |
US2833030A (en) * | 1952-09-19 | 1958-05-06 | Wall Colmonoy Corp | Method of joining metal parts with flexible composite joining material |
US2914435A (en) * | 1956-10-02 | 1959-11-24 | Eutectic Welding Alloys | Brazing alloy-flux paste |
US3589952A (en) * | 1968-07-05 | 1971-06-29 | Olin Mathieson | Slurry for brazing metal surfaces |
US3703254A (en) * | 1970-05-07 | 1972-11-21 | Ncr Co | Pre-fluxed solder powder |
JPS4830545A (nl) * | 1971-08-24 | 1973-04-21 | ||
CH569543A5 (nl) * | 1972-07-26 | 1975-11-28 | Castolin Sa | |
GB1408145A (en) * | 1972-08-14 | 1975-10-01 | Minnesota Mining & Mfg | Metal parts joined with sintered powdered metal |
DE2246827B2 (de) * | 1972-09-23 | 1974-08-22 | Fa. Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim | Lötpaste |
US3915729A (en) * | 1974-04-09 | 1975-10-28 | Du Pont | High temperature solder pastes |
US3986899A (en) * | 1974-06-07 | 1976-10-19 | Scm Corporation | Atomized copper brazing paste |
JPS5259052A (en) * | 1975-11-12 | 1977-05-16 | Hitachi Ltd | Paste solder |
US4151016A (en) * | 1976-09-17 | 1979-04-24 | Fusion Incorporated | Single component brazing paste |
ES8104932A1 (es) * | 1979-04-06 | 1981-05-16 | Johnson Matthey Co Ltd | Procedimiento para la obtencion de una composicion para sol-dar. |
-
1978
- 1978-09-05 NZ NZ188341A patent/NZ188341A/xx unknown
- 1978-09-06 ZA ZA00785046A patent/ZA785046B/xx unknown
- 1978-09-06 SE SE7809360A patent/SE445186B/sv unknown
- 1978-09-13 GB GB7836655A patent/GB2004489B/en not_active Expired
- 1978-09-13 ES ES473311A patent/ES473311A1/es not_active Expired
- 1978-09-13 IT IT27601/78A patent/IT1099069B/it active
- 1978-09-14 BR BR7805990A patent/BR7805990A/pt unknown
- 1978-09-14 CH CH964778A patent/CH636788A5/fr not_active IP Right Cessation
- 1978-09-14 NL NL7809344A patent/NL7809344A/nl not_active Application Discontinuation
- 1978-09-14 FI FI782823A patent/FI70810C/fi not_active IP Right Cessation
- 1978-09-14 BE BE190471A patent/BE870467A/xx not_active IP Right Cessation
- 1978-09-15 AU AU39893/78A patent/AU526809B2/en not_active Expired
- 1978-09-15 FR FR7826500A patent/FR2403156A1/fr active Granted
- 1978-09-15 AT AT0667678A patent/AT372893B/de not_active IP Right Cessation
- 1978-09-15 NO NO783131A patent/NO151652C/no unknown
- 1978-09-15 DK DK408378A patent/DK408378A/da not_active Application Discontinuation
- 1978-09-16 DE DE19782840415 patent/DE2840415A1/de not_active Ceased
- 1978-09-16 JP JP11292078A patent/JPS5453653A/ja active Pending
-
1982
- 1982-05-10 AT AT0182982A patent/AT375578B/de not_active IP Right Cessation
-
1983
- 1983-02-28 US US06/470,545 patent/US4493738A/en not_active Expired - Fee Related
- 1983-11-03 HK HK491/83A patent/HK49183A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
IT7827601A0 (it) | 1978-09-13 |
ATA182982A (de) | 1984-01-15 |
US4493738A (en) | 1985-01-15 |
BR7805990A (pt) | 1979-05-29 |
FI782823A (fi) | 1979-03-17 |
AU3989378A (en) | 1980-03-20 |
NO151652C (no) | 1985-05-15 |
NO151652B (no) | 1985-02-04 |
ES473311A1 (es) | 1980-06-16 |
FI70810C (fi) | 1986-10-27 |
AU526809B2 (en) | 1983-02-03 |
DE2840415A1 (de) | 1979-03-29 |
AT375578B (de) | 1984-08-27 |
GB2004489B (en) | 1982-11-10 |
NL7809344A (nl) | 1979-03-20 |
ATA667678A (de) | 1983-04-15 |
FR2403156B1 (nl) | 1985-03-08 |
GB2004489A (en) | 1979-04-04 |
SE7809360L (sv) | 1979-03-17 |
JPS5453653A (en) | 1979-04-27 |
IT1099069B (it) | 1985-09-18 |
HK49183A (en) | 1983-11-11 |
BE870467A (fr) | 1979-01-02 |
NZ188341A (en) | 1980-05-08 |
FI70810B (fi) | 1986-07-18 |
AT372893B (de) | 1983-11-25 |
ZA785046B (en) | 1979-09-26 |
CH636788A5 (fr) | 1983-06-30 |
NO783131L (no) | 1979-03-19 |
FR2403156A1 (fr) | 1979-04-13 |
DK408378A (da) | 1979-03-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE445186B (sv) | Fast lodkomposition | |
RU2627822C2 (ru) | Составы для припоя | |
GB2049523A (en) | Soldering composition | |
KR101671062B1 (ko) | 무연 솔더 합금 조성물 및 무연 솔더 합금의 제조 방법 | |
JP3363393B2 (ja) | 鉛フリーはんだ合金 | |
Geranmayeh et al. | Microstructure and impression creep behavior of lead-free Sn–5Sb solder alloy containing Bi and Ag | |
CN101641176A (zh) | 高温焊接材料 | |
JPH08509661A (ja) | 無鉛及び無ビスマスのスズ合金はんだ組成物 | |
KR950031361A (ko) | 개선된 땜납 페이스트 혼합물 | |
JP2002057177A5 (ja) | はんだボール | |
JP2000288772A (ja) | 無鉛はんだ | |
JPS60262857A (ja) | 高導電性重合体‐金属合金ブレンド | |
Hwang et al. | A high‐performance lead‐free solder–the effects of In on 99.3 Sn/0.7 Cu | |
KR100666836B1 (ko) | 무용제 경랍 페이스트, 이를 사용한 납땜방법 및 납땜용 열가소성 유기 결합제 시스템 | |
CN108608345B (zh) | 一种含Cr的低温钎焊金刚石及其钎料合金 | |
JP5133518B2 (ja) | 滑走面用ワックスおよびその製造方法 | |
CN113388769B (zh) | 一种浆状合金导热材料 | |
US2690408A (en) | Solder flux compositions containing an aryl biguanide hydrochloride | |
US3166402A (en) | Brazing compositions having polyvinyl butyral as a binder | |
DE2735638A1 (de) | Lotgemisch mit automatischer loetspalteinregulierung | |
Zhang et al. | Effects of adding some elements on solderability of Sn-0.7 Ag-0.5 Cu solder | |
TWI255482B (en) | Fusible alloy for thermal fuse and thermal fuse | |
Jamadon et al. | Formation behaviour of reaction layer in Sn-3.0 Ag-0.5 Cu solder joint with addition of porous Cu interlayer | |
CN106181111A (zh) | 一种高性能铜铝复合焊料 | |
Mallick et al. | Effect of Ni additions on the microstructure of Zn based lead free solder alloys for high temperature applications |