SE445186B - Fast lodkomposition - Google Patents

Fast lodkomposition

Info

Publication number
SE445186B
SE445186B SE7809360A SE7809360A SE445186B SE 445186 B SE445186 B SE 445186B SE 7809360 A SE7809360 A SE 7809360A SE 7809360 A SE7809360 A SE 7809360A SE 445186 B SE445186 B SE 445186B
Authority
SE
Sweden
Prior art keywords
composition according
solder
wax
weight
flux
Prior art date
Application number
SE7809360A
Other languages
English (en)
Swedish (sv)
Other versions
SE7809360L (sv
Inventor
G L Selman
O N Collier
Original Assignee
Johnson Matthey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Co Ltd filed Critical Johnson Matthey Co Ltd
Publication of SE7809360L publication Critical patent/SE7809360L/xx
Publication of SE445186B publication Critical patent/SE445186B/sv

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Detergent Compositions (AREA)
SE7809360A 1977-09-16 1978-09-06 Fast lodkomposition SE445186B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3873877 1977-09-16

Publications (2)

Publication Number Publication Date
SE7809360L SE7809360L (sv) 1979-03-17
SE445186B true SE445186B (sv) 1986-06-09

Family

ID=10405394

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7809360A SE445186B (sv) 1977-09-16 1978-09-06 Fast lodkomposition

Country Status (20)

Country Link
US (1) US4493738A (fi)
JP (1) JPS5453653A (fi)
AT (2) AT372893B (fi)
AU (1) AU526809B2 (fi)
BE (1) BE870467A (fi)
BR (1) BR7805990A (fi)
CH (1) CH636788A5 (fi)
DE (1) DE2840415A1 (fi)
DK (1) DK408378A (fi)
ES (1) ES473311A1 (fi)
FI (1) FI70810C (fi)
FR (1) FR2403156A1 (fi)
GB (1) GB2004489B (fi)
HK (1) HK49183A (fi)
IT (1) IT1099069B (fi)
NL (1) NL7809344A (fi)
NO (1) NO151652C (fi)
NZ (1) NZ188341A (fi)
SE (1) SE445186B (fi)
ZA (1) ZA785046B (fi)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3295505A (en) * 1963-05-31 1967-01-03 Jordan Alfred Rotary piston apparatus
GB2027617B (en) * 1978-08-01 1982-07-07 Johnson Matthey Co Ltd Flux coated brazing materials
ES490073A0 (es) * 1979-04-06 1981-05-16 Johnson Matthey Co Ltd Procedimiento para la obtencion de una composicion para sol-dar.
EP0034468A1 (en) * 1980-02-15 1981-08-26 JOHNSON, MATTHEY & Co., LIMITED Improvements in and relating to the joining of tubes
JPS5781993A (en) * 1980-11-07 1982-05-22 Taruchin Kk Cream-like solder having adhesiveness or dry film formability
JPS58192696A (ja) * 1982-05-06 1983-11-10 Nippon Univac Kk 光線溶接用フラツクス
DE3235574A1 (de) * 1982-09-25 1984-03-29 Degussa Ag, 6000 Frankfurt Lotlegierungen zum aufloeten von kontaktwerkstoffen
US4593851A (en) * 1984-07-17 1986-06-10 United Stirling Ab Method of connecting elements by brazing
FR2585190B1 (fr) * 1985-07-17 1988-04-08 Allied Corp Cosse a fut borgne, notamment pour connecteurs electriques
US5062896A (en) * 1990-03-30 1991-11-05 International Business Machines Corporation Solder/polymer composite paste and method
US5123586A (en) * 1990-09-21 1992-06-23 General Atomics Process for soldering superconducting fibers into a copper channel
CH684196A5 (de) * 1991-05-30 1994-07-29 Castolin Sa Verschleissfeste Schicht auf einem Bauteil sowie Verfahren zu deren Herstellung.
IT1255080B (it) * 1992-04-01 1995-10-18 Whirlpool Italia Metodo per realizzare elementi preformati di forme e dimensioni voluteper la saldatura, in particolare la saldobrasatura, di componenti metallici ed elementi cosi' ottenuti
JPH07100690A (ja) * 1993-10-06 1995-04-18 Nippon Arumitsuto Kk はんだ付用フラックス
DE19747041A1 (de) 1997-10-24 1999-04-29 Degussa Flußmittelfreie Hartlotpaste
GB2380964B (en) * 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
US6830632B1 (en) 2002-07-24 2004-12-14 Lucas Milhaupt, Inc. Flux cored preforms for brazing
AU2006315655A1 (en) * 2005-11-10 2007-05-24 Omni Technologies Corporation Brazing material with continuous length layer of elastomer containing a flux
EP1808255A1 (en) * 2006-01-11 2007-07-18 Corus Aluminium Walzprodukte GmbH Method of manufacturing a brazed assembly
PL2038085T3 (pl) * 2006-05-25 2020-03-31 Bellman-Melcor Development, Llc Drut z topnikiem do lutowania twardego i lutowania miękkiego oraz sposób jego wykonania
US8274014B2 (en) * 2006-05-25 2012-09-25 Bellman-Melcor Development, Llc Filler metal with flux for brazing and soldering and method of making and using same
EP2091686B1 (en) * 2006-12-11 2016-06-15 Lucas-Milhaupt, Inc. Low and non-silver filler metals and alloys and corresponding joinder systems and methods
US20110123824A1 (en) * 2007-05-25 2011-05-26 Alan Belohlav Brazing material
EP2493652A4 (en) 2009-10-26 2017-02-08 Lucas-Milhaupt, Inc. Low silver, low nickel brazing material
US9073153B2 (en) * 2010-02-09 2015-07-07 Nordson Corporation Flux and solder material and method of making same
KR101097868B1 (ko) * 2010-02-18 2011-12-23 주식회사 하이닉스반도체 반도체 패키지의 제조방법
EP2556916A1 (en) * 2011-08-10 2013-02-13 Nordson Corporation Flux and solder material and method of making same
EP2808114A3 (en) 2013-05-30 2015-09-02 Lucas-Milhaupt, Inc. Process for flux coating braze preforms and discrete parts
CN105081598A (zh) * 2014-05-06 2015-11-25 烟台市固光焊接材料有限责任公司 焊剂膏及其应用
US9731383B2 (en) 2014-07-09 2017-08-15 Bellman-Melcor Development, Llc Filler metal with flux for brazing and soldering and method of using same
US10744601B2 (en) 2015-08-07 2020-08-18 Bellman-Melcor Development, Llc Bonded brazing ring system and method for adhering a brazing ring to a tube
DE102019125474A1 (de) * 2019-09-23 2021-03-25 Hans-Jürgen Köhler Verfahren zur Herstellung eines Hochtemperaturlötmittels zum Ofenlöten von Körpern aus Stahl und/oder Edelstahl, Hochtemperaturlötmittel und Verwendung eines Hochtemperaturlötmittels

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1074804A (fr) * 1952-01-22 1954-10-08 Produit pour soudure, étamage et galvanisation
US2833030A (en) * 1952-09-19 1958-05-06 Wall Colmonoy Corp Method of joining metal parts with flexible composite joining material
US2914435A (en) * 1956-10-02 1959-11-24 Eutectic Welding Alloys Brazing alloy-flux paste
US3589952A (en) * 1968-07-05 1971-06-29 Olin Mathieson Slurry for brazing metal surfaces
US3703254A (en) * 1970-05-07 1972-11-21 Ncr Co Pre-fluxed solder powder
JPS4830545A (fi) * 1971-08-24 1973-04-21
CH569543A5 (fi) * 1972-07-26 1975-11-28 Castolin Sa
GB1408145A (en) * 1972-08-14 1975-10-01 Minnesota Mining & Mfg Metal parts joined with sintered powdered metal
DE2246827B2 (de) * 1972-09-23 1974-08-22 Fa. Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim Lötpaste
US3915729A (en) * 1974-04-09 1975-10-28 Du Pont High temperature solder pastes
US3986899A (en) * 1974-06-07 1976-10-19 Scm Corporation Atomized copper brazing paste
JPS5259052A (en) * 1975-11-12 1977-05-16 Hitachi Ltd Paste solder
US4151016A (en) * 1976-09-17 1979-04-24 Fusion Incorporated Single component brazing paste
ES490073A0 (es) * 1979-04-06 1981-05-16 Johnson Matthey Co Ltd Procedimiento para la obtencion de una composicion para sol-dar.

Also Published As

Publication number Publication date
IT7827601A0 (it) 1978-09-13
NO151652B (no) 1985-02-04
ATA667678A (de) 1983-04-15
IT1099069B (it) 1985-09-18
US4493738A (en) 1985-01-15
GB2004489A (en) 1979-04-04
NZ188341A (en) 1980-05-08
DE2840415A1 (de) 1979-03-29
DK408378A (da) 1979-03-17
FI70810B (fi) 1986-07-18
JPS5453653A (en) 1979-04-27
CH636788A5 (fr) 1983-06-30
ATA182982A (de) 1984-01-15
BR7805990A (pt) 1979-05-29
AT375578B (de) 1984-08-27
SE7809360L (sv) 1979-03-17
HK49183A (en) 1983-11-11
AT372893B (de) 1983-11-25
FR2403156A1 (fr) 1979-04-13
NL7809344A (nl) 1979-03-20
FI782823A (fi) 1979-03-17
FI70810C (fi) 1986-10-27
BE870467A (fr) 1979-01-02
AU3989378A (en) 1980-03-20
GB2004489B (en) 1982-11-10
FR2403156B1 (fi) 1985-03-08
ES473311A1 (es) 1980-06-16
NO783131L (no) 1979-03-19
ZA785046B (en) 1979-09-26
NO151652C (no) 1985-05-15
AU526809B2 (en) 1983-02-03

Similar Documents

Publication Publication Date Title
SE445186B (sv) Fast lodkomposition
JP7135171B2 (ja) はんだ組成物
GB2049523A (en) Soldering composition
Liu et al. Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints
US6613123B2 (en) Variable melting point solders and brazes
KR101671062B1 (ko) 무연 솔더 합금 조성물 및 무연 솔더 합금의 제조 방법
Geranmayeh et al. Microstructure and impression creep behavior of lead-free Sn–5Sb solder alloy containing Bi and Ag
CN101641176A (zh) 高温焊接材料
JPH08509661A (ja) 無鉛及び無ビスマスのスズ合金はんだ組成物
KR950031361A (ko) 개선된 땜납 페이스트 혼합물
JP2002057177A5 (ja) はんだボール
JP2000288772A (ja) 無鉛はんだ
JPS60262857A (ja) 高導電性重合体‐金属合金ブレンド
Hwang et al. A high‐performance lead‐free solder–the effects of In on 99.3 Sn/0.7 Cu
KR100666836B1 (ko) 무용제 경랍 페이스트, 이를 사용한 납땜방법 및 납땜용 열가소성 유기 결합제 시스템
JP5133518B2 (ja) 滑走面用ワックスおよびその製造方法
Lin et al. Understanding the influence of copper nanoparticles on thermal characteristics and microstructural development of a tin-silver solder
CN113388769B (zh) 一种浆状合金导热材料
Zhang et al. Effects of adding some elements on solderability of Sn-0.7 Ag-0.5 Cu solder
TWI255482B (en) Fusible alloy for thermal fuse and thermal fuse
Hodúlová et al. Research and development of lead-free solder for microelectronics in consideration of the environmental and qualitative aspects
Jamadon et al. Formation behaviour of reaction layer in Sn-3.0 Ag-0.5 Cu solder joint with addition of porous Cu interlayer
CN106181111A (zh) 一种高性能铜铝复合焊料
Mallick et al. Effect of Ni additions on the microstructure of Zn based lead free solder alloys for high temperature applications
KITAJIMA et al. A Study on the Solderbility and Joint Reliability of lead-Free Sn-Zn-Al Solder