SE415421B - Sett att framstella ett elektriskt isolerande skikt pa en integrerad halvledarkrets - Google Patents

Sett att framstella ett elektriskt isolerande skikt pa en integrerad halvledarkrets

Info

Publication number
SE415421B
SE415421B SE7509970A SE7509970A SE415421B SE 415421 B SE415421 B SE 415421B SE 7509970 A SE7509970 A SE 7509970A SE 7509970 A SE7509970 A SE 7509970A SE 415421 B SE415421 B SE 415421B
Authority
SE
Sweden
Prior art keywords
make
insulating layer
electrically insulating
semiconductor circuit
integrated semiconductor
Prior art date
Application number
SE7509970A
Other languages
English (en)
Other versions
SE7509970L (sv
Inventor
J P Rioult
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE7509970L publication Critical patent/SE7509970L/sv
Publication of SE415421B publication Critical patent/SE415421B/sv

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Weting (AREA)
SE7509970A 1974-09-10 1975-09-08 Sett att framstella ett elektriskt isolerande skikt pa en integrerad halvledarkrets SE415421B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7430623A FR2284981A1 (fr) 1974-09-10 1974-09-10 Procede d'obtention d'un circuit integre semiconducteur

Publications (2)

Publication Number Publication Date
SE7509970L SE7509970L (sv) 1976-03-11
SE415421B true SE415421B (sv) 1980-09-29

Family

ID=9142928

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7509970A SE415421B (sv) 1974-09-10 1975-09-08 Sett att framstella ett elektriskt isolerande skikt pa en integrerad halvledarkrets

Country Status (10)

Country Link
JP (1) JPS5744017B2 (sv)
AT (1) AT359562B (sv)
CA (1) CA1035470A (sv)
CH (1) CH591163A5 (sv)
DE (1) DE2538264C3 (sv)
FR (1) FR2284981A1 (sv)
GB (1) GB1518988A (sv)
IT (1) IT1042339B (sv)
NL (1) NL7510427A (sv)
SE (1) SE415421B (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5496775A (en) * 1978-01-17 1979-07-31 Hitachi Ltd Method of forming circuit
FR2535525A1 (fr) * 1982-10-29 1984-05-04 Western Electric Co Procede de fabrication de circuits integres comportant des couches isolantes minces
JPH053192A (ja) * 1991-10-25 1993-01-08 Matsushita Electron Corp 半導体集積回路

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979768A (en) * 1966-03-23 1976-09-07 Hitachi, Ltd. Semiconductor element having surface coating comprising silicon nitride and silicon oxide films
FR1536321A (fr) * 1966-06-30 1968-08-10 Texas Instruments Inc Contacts ohmiques pour des dispositifs à semi-conducteurs
FR1531852A (fr) * 1966-07-15 1968-07-05 Itt Procédé de masquage de la surface d'un support
US3474310A (en) * 1967-02-03 1969-10-21 Hitachi Ltd Semiconductor device having a sulfurtreated silicon compound thereon and a method of making the same
US3442012A (en) * 1967-08-03 1969-05-06 Teledyne Inc Method of forming a flip-chip integrated circuit
DE2059116C3 (de) * 1970-12-01 1974-11-21 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung eines Halbleiterbauelementes
GB1363815A (en) * 1971-12-06 1974-08-21 Tektronix Inc Semiconductor device and method of producing same
JPS4960870A (sv) * 1972-10-16 1974-06-13

Also Published As

Publication number Publication date
SE7509970L (sv) 1976-03-11
AU8461075A (en) 1977-03-17
CA1035470A (en) 1978-07-25
ATA692075A (de) 1980-04-15
AT359562B (de) 1980-11-25
NL7510427A (nl) 1976-03-12
FR2284981B1 (sv) 1978-11-24
DE2538264B2 (de) 1981-04-30
JPS5744017B2 (sv) 1982-09-18
CH591163A5 (sv) 1977-09-15
JPS5153491A (sv) 1976-05-11
DE2538264C3 (de) 1982-01-14
FR2284981A1 (fr) 1976-04-09
IT1042339B (it) 1980-01-30
DE2538264A1 (de) 1976-03-18
GB1518988A (en) 1978-07-26

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