CA1056031A
(en)
*
|
1974-05-10 |
1979-06-05 |
Leonard S. Buchoff |
Layered strip connector
|
JPS5165254U
(sv)
*
|
1974-11-20 |
1976-05-22 |
|
|
JPS5189159U
(sv)
*
|
1975-01-09 |
1976-07-16 |
|
|
US3982320A
(en)
*
|
1975-02-05 |
1976-09-28 |
Technical Wire Products, Inc. |
Method of making electrically conductive connector
|
US4003621A
(en)
*
|
1975-06-16 |
1977-01-18 |
Technical Wire Products, Inc. |
Electrical connector employing conductive rectilinear elements
|
JPS52155365A
(en)
*
|
1976-06-21 |
1977-12-23 |
Shinetsu Polymer Co |
Method of producing stacking interconnector
|
JPS53892A
(en)
*
|
1976-06-25 |
1978-01-07 |
Fuji Gomme Kk |
Method of manufacturing multi connector
|
JPS5333367A
(en)
*
|
1976-09-09 |
1978-03-29 |
Kato Shiyouji |
Method of producing circuit connector
|
JPS5915376B2
(ja)
*
|
1977-10-18 |
1984-04-09 |
信越ポリマ−株式会社 |
電子回路部品
|
US4199209A
(en)
*
|
1978-08-18 |
1980-04-22 |
Amp Incorporated |
Electrical interconnecting device
|
JPS568081U
(sv)
*
|
1979-06-29 |
1981-01-23 |
|
|
US4502098A
(en)
*
|
1981-02-10 |
1985-02-26 |
Brown David F |
Circuit assembly
|
US4542082A
(en)
*
|
1982-02-08 |
1985-09-17 |
California Institute Of Technology |
Bipolar battery plate
|
US4667219A
(en)
*
|
1984-04-27 |
1987-05-19 |
Trilogy Computer Development Partners, Ltd. |
Semiconductor chip interface
|
DE3440109A1
(de)
*
|
1984-11-02 |
1986-05-07 |
Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe |
Verfahren zur herstellung verformbarer vielfach-verbindungen fuer den elektrischen anschluss mikroelektronischer bauelemente und nach diesem verfahren hergestellte vielfachverbindungen
|
US4686492A
(en)
*
|
1985-03-04 |
1987-08-11 |
Tektronix, Inc. |
Impedance match connection using multiple layers of bond wires
|
FR2583254A1
(fr)
*
|
1985-06-10 |
1986-12-12 |
Thevenin Gilles |
Panneau de montage d'elements amovibles, en particulier pour jouets pedagogiques
|
US5014161A
(en)
*
|
1985-07-22 |
1991-05-07 |
Digital Equipment Corporation |
System for detachably mounting semiconductors on conductor substrate
|
US4778950A
(en)
*
|
1985-07-22 |
1988-10-18 |
Digital Equipment Corporation |
Anisotropic elastomeric interconnecting system
|
US4954873A
(en)
*
|
1985-07-22 |
1990-09-04 |
Digital Equipment Corporation |
Electrical connector for surface mounting
|
US4729166A
(en)
*
|
1985-07-22 |
1988-03-08 |
Digital Equipment Corporation |
Method of fabricating electrical connector for surface mounting
|
US5262718A
(en)
*
|
1985-08-05 |
1993-11-16 |
Raychem Limited |
Anisotropically electrically conductive article
|
US5917707A
(en)
|
1993-11-16 |
1999-06-29 |
Formfactor, Inc. |
Flexible contact structure with an electrically conductive shell
|
JPS62177877A
(ja)
*
|
1986-01-31 |
1987-08-04 |
住友スリ−エム株式会社 |
異方導電性フイルムコネクタ
|
DE3712587C2
(de)
*
|
1986-04-15 |
1994-01-20 |
Canon Kk |
Gerät zum Erzeugen von auf einem Aufzeichnungsblatt zu überlagernden Bildern
|
US4988306A
(en)
*
|
1989-05-16 |
1991-01-29 |
Labinal Components And Systems, Inc. |
Low-loss electrical interconnects
|
US4992053A
(en)
*
|
1989-07-05 |
1991-02-12 |
Labinal Components And Systems, Inc. |
Electrical connectors
|
US5672062A
(en)
*
|
1991-01-30 |
1997-09-30 |
Labinal Components And Systems, Inc. |
Electrical connectors
|
US5597313A
(en)
*
|
1986-06-19 |
1997-01-28 |
Labinal Components And Systems, Inc. |
Electrical connectors
|
EP0854506A3
(en)
*
|
1987-03-04 |
1999-03-31 |
Canon Kabushiki Kaisha |
Electrically connecting member and electric circuit member
|
US5798780A
(en)
*
|
1988-07-03 |
1998-08-25 |
Canon Kabushiki Kaisha |
Recording element driving unit having extra driving element to facilitate assembly and apparatus using same
|
US6062870A
(en)
*
|
1989-05-16 |
2000-05-16 |
Labinal Components And Systems, Inc. |
Electrical interconnects
|
US5127837A
(en)
*
|
1989-06-09 |
1992-07-07 |
Labinal Components And Systems, Inc. |
Electrical connectors and IC chip tester embodying same
|
US5485351A
(en)
*
|
1989-06-09 |
1996-01-16 |
Labinal Components And Systems, Inc. |
Socket assembly for integrated circuit chip package
|
US4923404A
(en)
*
|
1989-10-20 |
1990-05-08 |
Amp Incorporated |
Sealed chip carrier
|
US4975079A
(en)
*
|
1990-02-23 |
1990-12-04 |
International Business Machines Corp. |
Connector assembly for chip testing
|
US5071359A
(en)
*
|
1990-04-27 |
1991-12-10 |
Rogers Corporation |
Array connector
|
US5245751A
(en)
*
|
1990-04-27 |
1993-09-21 |
Circuit Components, Incorporated |
Array connector
|
US7198969B1
(en)
*
|
1990-09-24 |
2007-04-03 |
Tessera, Inc. |
Semiconductor chip assemblies, methods of making same and components for same
|
US5148265A
(en)
|
1990-09-24 |
1992-09-15 |
Ist Associates, Inc. |
Semiconductor chip assemblies with fan-in leads
|
US5258330A
(en)
*
|
1990-09-24 |
1993-11-02 |
Tessera, Inc. |
Semiconductor chip assemblies with fan-in leads
|
US5148266A
(en)
*
|
1990-09-24 |
1992-09-15 |
Ist Associates, Inc. |
Semiconductor chip assemblies having interposer and flexible lead
|
US20010030370A1
(en)
*
|
1990-09-24 |
2001-10-18 |
Khandros Igor Y. |
Microelectronic assembly having encapsulated wire bonding leads
|
US5679977A
(en)
*
|
1990-09-24 |
1997-10-21 |
Tessera, Inc. |
Semiconductor chip assemblies, methods of making same and components for same
|
GB2248345B
(en)
*
|
1990-09-27 |
1994-06-22 |
Stc Plc |
Edge soldering of electronic components
|
US5207585A
(en)
*
|
1990-10-31 |
1993-05-04 |
International Business Machines Corporation |
Thin interface pellicle for dense arrays of electrical interconnects
|
US5163834A
(en)
*
|
1990-12-17 |
1992-11-17 |
International Business Machines Corporation |
High density connector
|
US5282312A
(en)
*
|
1991-12-31 |
1994-02-01 |
Tessera, Inc. |
Multi-layer circuit construction methods with customization features
|
US5367764A
(en)
*
|
1991-12-31 |
1994-11-29 |
Tessera, Inc. |
Method of making a multi-layer circuit assembly
|
US5371654A
(en)
|
1992-10-19 |
1994-12-06 |
International Business Machines Corporation |
Three dimensional high performance interconnection package
|
US20050062492A1
(en)
*
|
2001-08-03 |
2005-03-24 |
Beaman Brian Samuel |
High density integrated circuit apparatus, test probe and methods of use thereof
|
US5811982A
(en)
*
|
1995-11-27 |
1998-09-22 |
International Business Machines Corporation |
High density cantilevered probe for electronic devices
|
US5810607A
(en)
*
|
1995-09-13 |
1998-09-22 |
International Business Machines Corporation |
Interconnector with contact pads having enhanced durability
|
US5350308A
(en)
*
|
1993-08-16 |
1994-09-27 |
The United States Of America As Represented By The Secretary Of The Navy |
Elastomeric electrical connector
|
US20020053734A1
(en)
|
1993-11-16 |
2002-05-09 |
Formfactor, Inc. |
Probe card assembly and kit, and methods of making same
|
US5820014A
(en)
*
|
1993-11-16 |
1998-10-13 |
Form Factor, Inc. |
Solder preforms
|
US7073254B2
(en)
*
|
1993-11-16 |
2006-07-11 |
Formfactor, Inc. |
Method for mounting a plurality of spring contact elements
|
JPH07239363A
(ja)
*
|
1994-01-06 |
1995-09-12 |
Hewlett Packard Co <Hp> |
集積回路の試験アセンブリ、導電性ブリッジ装置および集積回路の試験方法
|
JP3578232B2
(ja)
*
|
1994-04-07 |
2004-10-20 |
インターナショナル・ビジネス・マシーンズ・コーポレーション |
電気接点形成方法、該電気接点を含むプローブ構造および装置
|
US5637176A
(en)
*
|
1994-06-16 |
1997-06-10 |
Fry's Metals, Inc. |
Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials
|
US5590460A
(en)
|
1994-07-19 |
1997-01-07 |
Tessera, Inc. |
Method of making multilayer circuit
|
US5915170A
(en)
*
|
1994-09-20 |
1999-06-22 |
Tessera, Inc. |
Multiple part compliant interface for packaging of a semiconductor chip and method therefor
|
US6232789B1
(en)
*
|
1997-05-28 |
2001-05-15 |
Cascade Microtech, Inc. |
Probe holder for low current measurements
|
US5785538A
(en)
*
|
1995-11-27 |
1998-07-28 |
International Business Machines Corporation |
High density test probe with rigid surface structure
|
US5994152A
(en)
*
|
1996-02-21 |
1999-11-30 |
Formfactor, Inc. |
Fabricating interconnects and tips using sacrificial substrates
|
US8033838B2
(en)
*
|
1996-02-21 |
2011-10-11 |
Formfactor, Inc. |
Microelectronic contact structure
|
US5890915A
(en)
*
|
1996-05-17 |
1999-04-06 |
Minnesota Mining And Manufacturing Company |
Electrical and thermal conducting structure with resilient conducting paths
|
US6403226B1
(en)
|
1996-05-17 |
2002-06-11 |
3M Innovative Properties Company |
Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
|
JP3420435B2
(ja)
*
|
1996-07-09 |
2003-06-23 |
松下電器産業株式会社 |
基板の製造方法、半導体装置及び半導体装置の製造方法
|
US5914613A
(en)
*
|
1996-08-08 |
1999-06-22 |
Cascade Microtech, Inc. |
Membrane probing system with local contact scrub
|
US6247228B1
(en)
*
|
1996-08-12 |
2001-06-19 |
Tessera, Inc. |
Electrical connection with inwardly deformable contacts
|
US5937276A
(en)
|
1996-12-13 |
1999-08-10 |
Tessera, Inc. |
Bonding lead structure with enhanced encapsulation
|
US6820330B1
(en)
*
|
1996-12-13 |
2004-11-23 |
Tessera, Inc. |
Method for forming a multi-layer circuit assembly
|
US6293808B1
(en)
|
1999-09-30 |
2001-09-25 |
Ngk Insulators, Ltd. |
Contact sheet
|
US6188028B1
(en)
|
1997-06-09 |
2001-02-13 |
Tessera, Inc. |
Multilayer structure with interlocking protrusions
|
US6256882B1
(en)
*
|
1998-07-14 |
2001-07-10 |
Cascade Microtech, Inc. |
Membrane probing system
|
US6578264B1
(en)
*
|
1999-06-04 |
2003-06-17 |
Cascade Microtech, Inc. |
Method for constructing a membrane probe using a depression
|
US6474997B1
(en)
|
1999-09-30 |
2002-11-05 |
Ngk Insulators, Ltd. |
Contact sheet
|
US6838890B2
(en)
|
2000-02-25 |
2005-01-04 |
Cascade Microtech, Inc. |
Membrane probing system
|
DE20114544U1
(de)
|
2000-12-04 |
2002-02-21 |
Cascade Microtech Inc |
Wafersonde
|
WO2003052435A1
(en)
|
2001-08-21 |
2003-06-26 |
Cascade Microtech, Inc. |
Membrane probing system
|
JP3847227B2
(ja)
|
2001-10-02 |
2006-11-22 |
日本碍子株式会社 |
コンタクトシート
|
KR100864916B1
(ko)
|
2002-05-23 |
2008-10-22 |
캐스케이드 마이크로테크 인코포레이티드 |
피시험 디바이스를 테스트하기 위한 프로브
|
US20040105244A1
(en)
*
|
2002-08-06 |
2004-06-03 |
Ilyas Mohammed |
Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions
|
US6712620B1
(en)
*
|
2002-09-12 |
2004-03-30 |
High Connection Density, Inc. |
Coaxial elastomeric connector system
|
US6724205B1
(en)
*
|
2002-11-13 |
2004-04-20 |
Cascade Microtech, Inc. |
Probe for combined signals
|
US7057404B2
(en)
|
2003-05-23 |
2006-06-06 |
Sharp Laboratories Of America, Inc. |
Shielded probe for testing a device under test
|
WO2006017078A2
(en)
*
|
2004-07-07 |
2006-02-16 |
Cascade Microtech, Inc. |
Probe head having a membrane suspended probe
|
DE10356981B3
(de)
*
|
2003-12-05 |
2005-09-01 |
Seoul National University Industry Foundation |
Verfahren zur Montage eines Halbleiterchips auf ein Substrat, insbesondere auf eine Leiterplatte
|
US7427868B2
(en)
*
|
2003-12-24 |
2008-09-23 |
Cascade Microtech, Inc. |
Active wafer probe
|
JP2008512680A
(ja)
*
|
2004-09-13 |
2008-04-24 |
カスケード マイクロテック インコーポレイテッド |
両面プロービング構造体
|
US20060092505A1
(en)
*
|
2004-11-02 |
2006-05-04 |
Umech Technologies, Co. |
Optically enhanced digital imaging system
|
US7535247B2
(en)
*
|
2005-01-31 |
2009-05-19 |
Cascade Microtech, Inc. |
Interface for testing semiconductors
|
US7656172B2
(en)
|
2005-01-31 |
2010-02-02 |
Cascade Microtech, Inc. |
System for testing semiconductors
|
US7218128B2
(en)
*
|
2005-02-14 |
2007-05-15 |
International Business Machines Corporation |
Method and apparatus for locating and testing a chip
|
US7449899B2
(en)
|
2005-06-08 |
2008-11-11 |
Cascade Microtech, Inc. |
Probe for high frequency signals
|
WO2006137979A2
(en)
*
|
2005-06-13 |
2006-12-28 |
Cascade Microtech, Inc. |
Wideband active-passive differential signal probe
|
WO2007146285A2
(en)
|
2006-06-09 |
2007-12-21 |
Cascade Microtech, Inc. |
Differential signal probe with integral balun
|
US7443186B2
(en)
*
|
2006-06-12 |
2008-10-28 |
Cascade Microtech, Inc. |
On-wafer test structures for differential signals
|
US7764072B2
(en)
*
|
2006-06-12 |
2010-07-27 |
Cascade Microtech, Inc. |
Differential signal probing system
|
US7723999B2
(en)
*
|
2006-06-12 |
2010-05-25 |
Cascade Microtech, Inc. |
Calibration structures for differential signal probing
|
US7403028B2
(en)
|
2006-06-12 |
2008-07-22 |
Cascade Microtech, Inc. |
Test structure and probe for differential signals
|
US7876114B2
(en)
*
|
2007-08-08 |
2011-01-25 |
Cascade Microtech, Inc. |
Differential waveguide probe
|
US7888957B2
(en)
*
|
2008-10-06 |
2011-02-15 |
Cascade Microtech, Inc. |
Probing apparatus with impedance optimized interface
|
WO2010059247A2
(en)
*
|
2008-11-21 |
2010-05-27 |
Cascade Microtech, Inc. |
Replaceable coupon for a probing apparatus
|
JP5453016B2
(ja)
*
|
2009-08-18 |
2014-03-26 |
日本碍子株式会社 |
フィルム状電気的接続体及びその製造方法
|
TWI543451B
(zh)
*
|
2013-07-30 |
2016-07-21 |
鴻海精密工業股份有限公司 |
電連接器及其組合
|