SE0101006L - Kapsel av TO-kanne typ - Google Patents
Kapsel av TO-kanne typInfo
- Publication number
- SE0101006L SE0101006L SE0101006A SE0101006A SE0101006L SE 0101006 L SE0101006 L SE 0101006L SE 0101006 A SE0101006 A SE 0101006A SE 0101006 A SE0101006 A SE 0101006A SE 0101006 L SE0101006 L SE 0101006L
- Authority
- SE
- Sweden
- Prior art keywords
- hermetically
- type capsule
- optical
- jug type
- encapsulating element
- Prior art date
Links
- 239000002775 capsule Substances 0.000 title 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000013307 optical fiber Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0101006A SE519590C2 (sv) | 2001-03-22 | 2001-03-22 | Kapsel av TO-kanne typ |
TW090117327A TWI252570B (en) | 2001-03-22 | 2001-07-16 | To-can type encapsulation for enclosing at least one optical-electrical chip |
JP2002576494A JP4153310B2 (ja) | 2001-03-22 | 2002-03-22 | リードフレームを有するトランジスタ・アウトライン被覆部品 |
PCT/SE2002/000582 WO2002078409A1 (en) | 2001-03-22 | 2002-03-22 | A to-can having a leadframe |
US10/473,182 US7207729B2 (en) | 2001-03-22 | 2002-03-22 | TO-can having a leadframe |
EP02708917A EP1371274A1 (en) | 2001-03-22 | 2002-03-22 | A to-can having a leadframe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0101006A SE519590C2 (sv) | 2001-03-22 | 2001-03-22 | Kapsel av TO-kanne typ |
Publications (3)
Publication Number | Publication Date |
---|---|
SE0101006D0 SE0101006D0 (sv) | 2001-03-22 |
SE0101006L true SE0101006L (sv) | 2002-09-23 |
SE519590C2 SE519590C2 (sv) | 2003-03-18 |
Family
ID=20283478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0101006A SE519590C2 (sv) | 2001-03-22 | 2001-03-22 | Kapsel av TO-kanne typ |
Country Status (6)
Country | Link |
---|---|
US (1) | US7207729B2 (sv) |
EP (1) | EP1371274A1 (sv) |
JP (1) | JP4153310B2 (sv) |
SE (1) | SE519590C2 (sv) |
TW (1) | TWI252570B (sv) |
WO (1) | WO2002078409A1 (sv) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100464342B1 (ko) * | 2003-04-14 | 2005-01-03 | 삼성전자주식회사 | 티오-캔 구조의 광 모듈 |
JP2005062842A (ja) * | 2003-07-31 | 2005-03-10 | Toshiba Discrete Technology Kk | 光伝送デバイス |
US7399123B2 (en) * | 2003-11-14 | 2008-07-15 | Tyco Electronics Corporation | Optical fiber connector with molded locking component |
JP2005197659A (ja) * | 2003-12-08 | 2005-07-21 | Sony Corp | 光学装置及び画像生成装置 |
CN2852157Y (zh) * | 2005-07-05 | 2006-12-27 | 武汉电信器件有限公司 | 小型化数字地和壳地电隔离的同轴光电组件 |
JP6110493B2 (ja) * | 2013-07-26 | 2017-04-05 | 京セラ株式会社 | 光部品組立体、光レセプタクル、および光通信用送受信モジュール |
WO2019038930A1 (ja) * | 2017-08-25 | 2019-02-28 | オリンパス株式会社 | 内視鏡用光モジュール、内視鏡、および内視鏡用光モジュールの製造方法 |
US20190129108A1 (en) | 2017-10-31 | 2019-05-02 | Versalume LLC | Modular Laser Connector Packaging System and Method |
US10551542B1 (en) | 2018-12-11 | 2020-02-04 | Corning Incorporated | Light modules and devices incorporating light modules |
JP7350646B2 (ja) * | 2019-12-17 | 2023-09-26 | CIG Photonics Japan株式会社 | 光モジュール |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06164099A (ja) * | 1992-11-16 | 1994-06-10 | Mitsubishi Electric Corp | 光半導体モジュールと表面実装基板との電気接続方法 |
JP3301791B2 (ja) * | 1992-11-30 | 2002-07-15 | アジレント・テクノロジーズ・インク | 光コネクタ |
JPH07283072A (ja) * | 1994-04-11 | 1995-10-27 | Daishinku Co | 表面実装型電子部品 |
JPH1096839A (ja) * | 1996-09-20 | 1998-04-14 | Sumitomo Electric Ind Ltd | 半導体レーザモジュールの製造方法 |
JP3934234B2 (ja) * | 1998-01-21 | 2007-06-20 | 富士通株式会社 | レセプタクルモジュール |
-
2001
- 2001-03-22 SE SE0101006A patent/SE519590C2/sv not_active IP Right Cessation
- 2001-07-16 TW TW090117327A patent/TWI252570B/zh not_active IP Right Cessation
-
2002
- 2002-03-22 US US10/473,182 patent/US7207729B2/en not_active Expired - Fee Related
- 2002-03-22 JP JP2002576494A patent/JP4153310B2/ja not_active Expired - Fee Related
- 2002-03-22 WO PCT/SE2002/000582 patent/WO2002078409A1/en active Application Filing
- 2002-03-22 EP EP02708917A patent/EP1371274A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
SE0101006D0 (sv) | 2001-03-22 |
EP1371274A1 (en) | 2003-12-17 |
SE519590C2 (sv) | 2003-03-18 |
TWI252570B (en) | 2006-04-01 |
US20040247259A1 (en) | 2004-12-09 |
WO2002078409A1 (en) | 2002-10-03 |
JP4153310B2 (ja) | 2008-09-24 |
US7207729B2 (en) | 2007-04-24 |
JP2005500556A (ja) | 2005-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |