SE0004605D0 - Method of manufacturing dielectric ceramic composition for electronic devices - Google Patents
Method of manufacturing dielectric ceramic composition for electronic devicesInfo
- Publication number
- SE0004605D0 SE0004605D0 SE0004605A SE0004605A SE0004605D0 SE 0004605 D0 SE0004605 D0 SE 0004605D0 SE 0004605 A SE0004605 A SE 0004605A SE 0004605 A SE0004605 A SE 0004605A SE 0004605 D0 SE0004605 D0 SE 0004605D0
- Authority
- SE
- Sweden
- Prior art keywords
- composition
- temperature
- sintering
- electronic devices
- dielectric ceramic
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000919 ceramic Substances 0.000 title 1
- 238000005245 sintering Methods 0.000 abstract 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 2
- 229910052760 oxygen Inorganic materials 0.000 abstract 2
- 239000001301 oxygen Substances 0.000 abstract 2
- 229910052573 porcelain Inorganic materials 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000006104 solid solution Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31691—Inorganic layers composed of oxides or glassy oxides or oxide based glass with perovskite structure
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Inorganic Insulating Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19235798 | 1998-06-22 | ||
PCT/JP1999/003026 WO1999067186A1 (fr) | 1998-06-22 | 1999-06-04 | Procede de production d'une composition de porcelaine dielectrique pour dispositif electronique |
Publications (1)
Publication Number | Publication Date |
---|---|
SE0004605D0 true SE0004605D0 (sv) | 2000-12-13 |
Family
ID=16289942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0004605A SE0004605D0 (sv) | 1998-06-22 | 2000-12-13 | Method of manufacturing dielectric ceramic composition for electronic devices |
Country Status (5)
Country | Link |
---|---|
US (1) | US6413896B1 (xx) |
EP (1) | EP1130002B1 (xx) |
KR (1) | KR100407456B1 (xx) |
SE (1) | SE0004605D0 (xx) |
WO (1) | WO1999067186A1 (xx) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007017950A1 (ja) * | 2005-08-11 | 2007-02-15 | Hitachi Metals, Ltd. | 電子デバイス用誘電体磁器組成物 |
CN101439975B (zh) * | 2008-12-22 | 2011-11-09 | 中国西电电气股份有限公司 | 一种电瓷烧成方法 |
US9653820B1 (en) * | 2014-06-09 | 2017-05-16 | Rockwell Collins, Inc. | Active manifold system and method for an array antenna |
US9923269B1 (en) | 2015-06-30 | 2018-03-20 | Rockwell Collins, Inc. | Phase position verification system and method for an array antenna |
US9673846B2 (en) | 2014-06-06 | 2017-06-06 | Rockwell Collins, Inc. | Temperature compensation system and method for an array antenna system |
CN109136491B (zh) * | 2017-06-28 | 2020-07-28 | 宝山钢铁股份有限公司 | 一种含铌钢加热工艺动态控制方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4572594A (en) * | 1984-02-08 | 1986-02-25 | Schwartz C Bruce | Arthroscopy support stand |
JPS61191557A (ja) * | 1985-02-19 | 1986-08-26 | 松下電器産業株式会社 | 誘電体共振器用磁器材料の製造方法 |
JPH0673246B2 (ja) * | 1985-10-18 | 1994-09-14 | 住友金属鉱山株式会社 | 誘電体磁器 |
JP2622545B2 (ja) * | 1987-05-22 | 1997-06-18 | 株式会社デンソー | 誘電体共振器材料の製造方法 |
JP2663944B2 (ja) * | 1987-05-26 | 1997-10-15 | 株式会社デンソー | 誘電体共振器材料の製造方法 |
JPH0625024B2 (ja) * | 1988-11-16 | 1994-04-06 | 住友金属鉱山株式会社 | 誘電体磁器の製造方法 |
JPH02285616A (ja) * | 1989-04-26 | 1990-11-22 | Sumitomo Special Metals Co Ltd | 電子デバイス用誘電体磁器組成物 |
DE69738011D1 (de) * | 1996-10-25 | 2007-09-27 | Ngk Spark Plug Co | Dielektrisches Material, Verfahren zu dessen Herstellung und dieses Material enthaltende dielektrische Resonatorvorrichtung |
JP3843176B2 (ja) * | 1997-12-25 | 2006-11-08 | 株式会社Neomax | 電子デバイス用誘電体磁器組成物 |
-
1999
- 1999-06-04 US US09/701,931 patent/US6413896B1/en not_active Expired - Fee Related
- 1999-06-04 EP EP99923936A patent/EP1130002B1/en not_active Expired - Lifetime
- 1999-06-04 WO PCT/JP1999/003026 patent/WO1999067186A1/ja active IP Right Grant
- 1999-06-04 KR KR10-2000-7014498A patent/KR100407456B1/ko not_active IP Right Cessation
-
2000
- 2000-12-13 SE SE0004605A patent/SE0004605D0/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US6413896B1 (en) | 2002-07-02 |
EP1130002A4 (en) | 2004-04-28 |
EP1130002A1 (en) | 2001-09-05 |
EP1130002B1 (en) | 2005-11-16 |
KR100407456B1 (ko) | 2003-11-28 |
WO1999067186A1 (fr) | 1999-12-29 |
KR20010053049A (ko) | 2001-06-25 |
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