SE0001943L - Modul för radiokommunikation - Google Patents

Modul för radiokommunikation

Info

Publication number
SE0001943L
SE0001943L SE0001943A SE0001943A SE0001943L SE 0001943 L SE0001943 L SE 0001943L SE 0001943 A SE0001943 A SE 0001943A SE 0001943 A SE0001943 A SE 0001943A SE 0001943 L SE0001943 L SE 0001943L
Authority
SE
Sweden
Prior art keywords
card
module
pcb
radio communication
accordance
Prior art date
Application number
SE0001943A
Other languages
English (en)
Swedish (sv)
Other versions
SE0001943D0 (sv
SE520151C2 (sv
Inventor
Shaofang Gong
Johan Nilsson
Original Assignee
Bluetronics Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bluetronics Ab filed Critical Bluetronics Ab
Priority to SE0001943A priority Critical patent/SE520151C2/sv
Publication of SE0001943D0 publication Critical patent/SE0001943D0/xx
Priority to PCT/SE2001/000949 priority patent/WO2001095679A1/en
Priority to AU56895/01A priority patent/AU5689501A/en
Publication of SE0001943L publication Critical patent/SE0001943L/
Publication of SE520151C2 publication Critical patent/SE520151C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Near-Field Transmission Systems (AREA)
SE0001943A 2000-06-07 2000-06-07 Modul för radiokommunikation SE520151C2 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0001943A SE520151C2 (sv) 2000-06-07 2000-06-07 Modul för radiokommunikation
PCT/SE2001/000949 WO2001095679A1 (en) 2000-06-07 2001-05-03 Module for radio communication
AU56895/01A AU5689501A (en) 2000-06-07 2001-05-03 Module for radio communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0001943A SE520151C2 (sv) 2000-06-07 2000-06-07 Modul för radiokommunikation

Publications (3)

Publication Number Publication Date
SE0001943D0 SE0001943D0 (sv) 2000-06-07
SE0001943L true SE0001943L (sv) 2001-12-08
SE520151C2 SE520151C2 (sv) 2003-06-03

Family

ID=20279824

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0001943A SE520151C2 (sv) 2000-06-07 2000-06-07 Modul för radiokommunikation

Country Status (3)

Country Link
AU (1) AU5689501A ( )
SE (1) SE520151C2 ( )
WO (1) WO2001095679A1 ( )

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7260890B2 (en) 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
US6987307B2 (en) 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
US6900708B2 (en) 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
KR20040003890A (ko) * 2002-07-04 2004-01-13 (주)에이엔티테크놀러지 라디오주파수 모듈
US7489914B2 (en) 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
KR101183272B1 (ko) 2004-02-23 2012-09-14 조지아 테크 리서치 코오포레이션 Ｒｆ/무선 다중 대역 응용들을 위한 액정 폴리머 및 다층폴리머 기반 수동 신호 처리 부품들
US7724109B2 (en) * 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
DE102006007381A1 (de) 2006-02-15 2007-08-23 Infineon Technologies Ag Halbleiterbauelement für einen Ultraweitband-Standard in der Ultrahochfrequenz-Kommunikation und Verfahren zur Herstellung desselben
US7808434B2 (en) 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7940148B2 (en) 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
WO2008063507A2 (en) 2006-11-17 2008-05-29 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
DE102006057332B4 (de) 2006-12-05 2018-01-25 Infineon Technologies Ag Zusammenbau aufweisend ein Substrat und einen auf dem Substrat montierten Chip
FR2919433B1 (fr) * 2007-07-27 2010-09-17 Thales Sa Module d'antenne compact.
WO2009108707A2 (en) * 2008-02-25 2009-09-03 Fairchild Semiconductor Corporation Micromodules including integrated thin film inductors and methods of making the same
CN102217064A (zh) * 2008-11-19 2011-10-12 Nxp股份有限公司 毫米波射频天线模块
CN102074534B (zh) * 2009-11-24 2013-05-29 上海长丰智能卡有限公司 一种微型pcb射频模块及其封装方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2321787A (en) * 1997-01-31 1998-08-05 Nokia Mobile Phones Ltd Multiple layer printed circuit board inductive arrangement
JP3373753B2 (ja) * 1997-03-28 2003-02-04 株式会社東芝 超高周波帯無線通信装置
TW347936U (en) * 1997-11-28 1998-12-11 Delta Electronics Inc Apparatus for oscillator
US6228196B1 (en) * 1998-06-05 2001-05-08 Murata Manufacturing Co., Ltd. Method of producing a multi-layer ceramic substrate
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same

Also Published As

Publication number Publication date
AU5689501A (en) 2001-12-17
SE0001943D0 (sv) 2000-06-07
WO2001095679A1 (en) 2001-12-13
SE520151C2 (sv) 2003-06-03

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Legal Events

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