SE0001943L - Module for radio communication - Google Patents

Module for radio communication

Info

Publication number
SE0001943L
SE0001943L SE0001943A SE0001943A SE0001943L SE 0001943 L SE0001943 L SE 0001943L SE 0001943 A SE0001943 A SE 0001943A SE 0001943 A SE0001943 A SE 0001943A SE 0001943 L SE0001943 L SE 0001943L
Authority
SE
Sweden
Prior art keywords
card
module
pcb
radio communication
accordance
Prior art date
Application number
SE0001943A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE520151C2 (en
SE0001943D0 (en
Inventor
Shaofang Gong
Johan Nilsson
Original Assignee
Bluetronics Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bluetronics Ab filed Critical Bluetronics Ab
Priority to SE0001943A priority Critical patent/SE520151C2/en
Publication of SE0001943D0 publication Critical patent/SE0001943D0/en
Priority to AU56895/01A priority patent/AU5689501A/en
Priority to PCT/SE2001/000949 priority patent/WO2001095679A1/en
Publication of SE0001943L publication Critical patent/SE0001943L/en
Publication of SE520151C2 publication Critical patent/SE520151C2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

A module for radio communication in accordance with the Blue Tooth concept and/or in accordance with the wireless-LAN concept, wherein the module comprises a transmitter-and-receiver circuit and an antenna. The invention is characterised in that the module comprises a carrier in the form of a laminated PCB-card (1) (Printed Circuit Board) that includes a number of electrically conductive metal layers (M1-M5) and so-called microvias; in that a first side (11) of the card (1) has an integrated antenna (10) formed in the metal layer (M5) on said side and connected to the remainder of the module; in that a radio frequency chip (13) is surface-mounted on the PCB-card (1) on other side (12) of said card; in that passive components (14, 15), such as filters, Baluns, inductors and capacitors, are integrated in the PCB-card (1) and connected to different microvias; and in that terminals in the form of BGA balls (16, 17) (Ball Grid Array) are provided on said second side (12) of the card.
SE0001943A 2000-06-07 2000-06-07 Module for radio communication SE520151C2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0001943A SE520151C2 (en) 2000-06-07 2000-06-07 Module for radio communication
AU56895/01A AU5689501A (en) 2000-06-07 2001-05-03 Module for radio communication
PCT/SE2001/000949 WO2001095679A1 (en) 2000-06-07 2001-05-03 Module for radio communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0001943A SE520151C2 (en) 2000-06-07 2000-06-07 Module for radio communication

Publications (3)

Publication Number Publication Date
SE0001943D0 SE0001943D0 (en) 2000-06-07
SE0001943L true SE0001943L (en) 2001-12-08
SE520151C2 SE520151C2 (en) 2003-06-03

Family

ID=20279824

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0001943A SE520151C2 (en) 2000-06-07 2000-06-07 Module for radio communication

Country Status (3)

Country Link
AU (1) AU5689501A (en)
SE (1) SE520151C2 (en)
WO (1) WO2001095679A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7260890B2 (en) 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
US6900708B2 (en) 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
US6987307B2 (en) 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
KR20040003890A (en) * 2002-07-04 2004-01-13 (주)에이엔티테크놀러지 A radio frequency module
US7489914B2 (en) 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
DE602005002547T2 (en) 2004-02-23 2008-06-12 Georgia Tech Research Corp. PASSIVE SIGNAL PROCESSING COMPONENTS ON LIQUID CRYSTAL POLYMER AND MULTILAYER POLYMER BASIS FOR HF / WIRELESS MULTI-BAND APPLICATIONS
US7724109B2 (en) 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
DE102006007381A1 (en) 2006-02-15 2007-08-23 Infineon Technologies Ag Ultra-wide-band semiconductor component for ultra-wide-band standard in communication, comprises semiconductor component, ultra-wide-band semiconductor chip and multilevel circuit substrate with lower and upper metal layer
US7808434B2 (en) 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7940148B2 (en) 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
US7646255B2 (en) 2006-11-17 2010-01-12 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
DE102006057332B4 (en) * 2006-12-05 2018-01-25 Infineon Technologies Ag Assembly comprising a substrate and a chip mounted on the substrate
FR2919433B1 (en) * 2007-07-27 2010-09-17 Thales Sa COMPACT ANTENNA MODULE.
KR101591492B1 (en) * 2008-02-25 2016-02-03 페어차일드 세미컨덕터 코포레이션 Micromodules including integrated thin film inductors and methods of making the same
US8854277B2 (en) 2008-11-19 2014-10-07 Nxp, B.V. Millimetre-wave radio antenna module
CN102074534B (en) * 2009-11-24 2013-05-29 上海长丰智能卡有限公司 Micro PCB radio frequency module and packaging method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2321787A (en) * 1997-01-31 1998-08-05 Nokia Mobile Phones Ltd Multiple layer printed circuit board inductive arrangement
JP3373753B2 (en) * 1997-03-28 2003-02-04 株式会社東芝 Ultra-high frequency band wireless communication equipment
TW347936U (en) * 1997-11-28 1998-12-11 Delta Electronics Inc Apparatus for oscillator
US6228196B1 (en) * 1998-06-05 2001-05-08 Murata Manufacturing Co., Ltd. Method of producing a multi-layer ceramic substrate
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same

Also Published As

Publication number Publication date
AU5689501A (en) 2001-12-17
WO2001095679A1 (en) 2001-12-13
SE520151C2 (en) 2003-06-03
SE0001943D0 (en) 2000-06-07

Similar Documents

Publication Publication Date Title
SE0001943L (en) Module for radio communication
US5929510A (en) Integrated electronic circuit
JP3582460B2 (en) High frequency module
JP2005005866A (en) Antenna-integrated module
FR2840711B1 (en) INTEGRATED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
EP1895589A3 (en) Semiconductor package substrate
WO1998019339A9 (en) Integrated electronic circuit
EP1041633A4 (en) Semiconductor device, method of manufacture thereof, circuit board, and electronic device
JP2004296613A (en) Semiconductor device
WO2006036965A3 (en) Reduced electromagnetic coupling in integrated circuits
WO2007146580A1 (en) Printed circuit board with coextensive electrical connectors and contact pad areas
KR100341077B1 (en) Structure of multi-layered module in pcb
WO2002061774A3 (en) Low inductance chip with center via contact
WO2002103789A2 (en) Electronic assembly with laterally connected capacitors and manufacturing method
JP4508194B2 (en) module
US7679928B2 (en) System-in-package module and mobile terminal having the same
US20060176123A1 (en) High-frequency switch in multi-layer substrate
KR100859319B1 (en) Package structure of ltcc module
CN202143291U (en) Two-layer printed circuit board and mobile communication terminal
KR20020021102A (en) Module card and it's manufacturing method
US6950315B2 (en) High frequency module mounting structure in which solder is prevented from peeling
JP2013080764A (en) Circuit module
KR100318934B1 (en) Printed circuit board for portable radiotelephone
JP2017038085A (en) Circuit module
JP2001167974A (en) Circuit board and circuit module using the same and electronic device using the module

Legal Events

Date Code Title Description
NUG Patent has lapsed