JP2001167974A - Circuit board and circuit module using the same and electronic device using the module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board, that has a passive element built-in and further has general-purpose properties, a circuit module using it and an electronic device using it. SOLUTION: A first dielectric material layer 12 of low dielectric constant, a second dielectric material layer 13 of high dielectric constant and a third dielectric material layer 14 of low dielectric constant are laminated in this order to constitute a board 11, and a plurality of capacity elements 15 and 16 are provided in the second dielectric material layer 13. Two terminals of the capacity element 15 are led out to one principal surface 11a, and two terminals of the capacity element 16 are led out to both principal surfaces, to be connected to a connection terminal 17. Thereby, another circuit board is formed by forming a circuit wiring in another process, on the principal surface of the board constituting the circuit board, or circuit modules and electronic devices having various functions are formed using a kind of circuit board, by mounting an active element and the passive element on the circuit wiring.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board, a circuit module using the same, and an electronic device using the same, in particular, a circuit board having a built-in capacitive element and an inductive element and capable of being designed in a short time. The present invention relates to a circuit module used and an electronic device using the same.

[0002]

2. Description of the Related Art FIG. 9 shows a conventional circuit module.
In FIG. 9, the circuit module 1 has a dielectric substrate 2 having a high dielectric constant and a semiconductor element 6. The dielectric substrate 2 has a multilayer structure, in which a plurality of capacitive elements 3 and an inductive element 4 are provided, and connection terminals 5 are provided on the upper surface of the dielectric substrate 2.
Is provided. Here, the capacitance element 3 is a MIM (Met) in which a plurality of electrodes having a predetermined area are stacked via a dielectric material.
al Insulator Metal) structure. The inductive element 4 is formed of a line electrode formed in a meandering or spiral shape in a dielectric material. The two terminals of the capacitive element 3 and the inductive element 4 are led out to the upper surface of the dielectric substrate 2 via via holes and the like, and are connected to the connection terminals 5.

The semiconductor element 6 is mounted on the upper surface of the dielectric substrate 2. The semiconductor element 6 is connected to the connection terminal 5 via a wire 7.

In the circuit module 1 configured as described above, since the capacitive element 3 and the inductive element 4 are formed in the dielectric substrate 2, they are connected to the active elements formed in the semiconductor element 6. Thereby, a predetermined function can be realized as a circuit having an active element and a passive element.

[0005]

By the way, in the circuit module 1 shown in FIG. 9, the capacitance element 3 and the inductive element 4 provided in the dielectric substrate 2 are set to predetermined capacitance values and inductance values in advance. Have been. for that reason,
Since the dielectric substrate 2 is not versatile, it is necessary to redesign by changing the capacitance value and the inductance value each time according to the use of the circuit module, which hinders the cost reduction of the dielectric substrate and the shortening of the circuit module design time. Had become.

Accordingly, it is an object of the present invention to provide a circuit board having a built-in passive element and having versatility, a circuit module using the same, and an electronic device using the same.

[0007]

In order to achieve the above-mentioned object, a circuit board according to the present invention comprises a substrate having first, second and third dielectric layers laminated in order, and at least one of the substrates. A plurality of independent connection terminals provided on the main surface of the substrate, and a plurality of independent capacitance elements provided on the second dielectric layer. Each terminal of the plurality of capacitance elements is It is characterized by being drawn out to a surface and connected to the connection terminals different from each other.

Further, in the circuit board according to the present invention, the capacitive element includes a first capacitive element for leading each terminal to one main surface of the substrate, and each terminal on one and the other main surface of the substrate. It is characterized by comprising second capacitance elements to be drawn out.

The circuit board according to the present invention is characterized in that the first capacitance element and the second capacitance element are alternately arranged in a plane direction in the second dielectric layer. .

The circuit board of the present invention includes a plurality of independent inductive elements provided on at least one of the first and third dielectric layers, and each terminal of the plurality of inductive elements is And are connected to the connection terminals different from each other.

Further, in the circuit board according to the present invention, the first and third dielectric layers are made of a dielectric having a low dielectric constant, and the second dielectric layer is made of a dielectric having a high dielectric constant. Features.

Further, the circuit board according to the present invention is characterized in that a planar or net-shaped conductor layer is provided on an inner layer of the first or third dielectric layer near any one of the main surfaces of the base. Features.

Further, the circuit board of the present invention is characterized in that one of the two terminals of the capacitive element or the inductive element is connected to the conductor layer.

Further, the circuit board of the present invention is characterized in that a circuit wiring for connecting the plurality of connection terminals is formed on at least one main surface of the above-mentioned substrate with a built-in passive element.

Further, the circuit board of the present invention is characterized in that the circuit wiring comprises a thin film electrode.

Further, a circuit module according to the present invention is characterized in that one or more active elements are mounted on the circuit wiring of the circuit board.

Further, the circuit module of the present invention is characterized in that one or more passive elements are mounted on the circuit wiring.

The circuit module according to the present invention is characterized in that a high dielectric constant ceramic chip having a passive circuit formed on one or both sides is mounted on the circuit wiring.

Further, the circuit module of the present invention is characterized in that the passive circuit formed on the high dielectric constant ceramic chip comprises a thin film electrode.

The electronic device according to the present invention is characterized by using the above-mentioned circuit module.

With this configuration, in the circuit board of the present invention, one circuit board can be applied to a plurality of circuits.

Further, in the circuit module of the present invention, by using the circuit board of the present invention, miniaturization and cost reduction can be achieved.

Further, in the electronic device of the present invention, by using the circuit module of the present invention, downsizing and cost reduction can be achieved.

[0024]

1 and 2 show an embodiment of a circuit board according to the present invention. Here, FIG. 1 is a plan view of the circuit board 10, and FIG.

Referring to FIG. 1 and FIG.
Is composed of a substrate 11 formed by sequentially stacking a first dielectric layer 12 having a low dielectric constant, a second dielectric layer 13 having a high dielectric constant, and a third dielectric layer 14 having a low dielectric constant. I have. The second dielectric layer 13 is formed by laminating a plurality of thinner dielectric layers, and a plurality of MIM-structured capacitance elements 15 and 16 are provided inside the second dielectric layer 13. Also,
A plurality of independent connection terminals 17 are provided on one main surface 11a (the main surface on the first dielectric layer 12 side) and the other main surface 11b (the main surface on the third dielectric layer 14 side) of the substrate 11. Have been. Here, each of the two terminals of the capacitive element 15 is drawn out to the one main surface 11 a side of the substrate 11 and connected to different connection terminals 17. On the other hand, the capacitor 16 has two terminals connected to one main surface 1 of the substrate 11.
It is drawn out to both the 1a side and the other main surface 11b side, and is connected to the connection terminal 17. As can be seen from the plan view shown in FIG. 1, the capacitance elements 15 and 16 are alternately arranged in the plane direction in the second dielectric layer 13 in both the vertical and horizontal directions.

In the circuit board 10 configured as described above, since the plurality of independent capacitance elements 15 and 16 are provided inside the second dielectric layer 13 having a high dielectric constant,
A capacitance element having a large capacitance value can be incorporated. Conversely, to reduce the occupied area of each capacitive element,
Many capacitance elements can be built in.

Using this circuit board 10, as a separate step, one main surface 11 a or the other main surface 11
A circuit module having a plurality of capacitors can be realized by forming a circuit wiring in b and connecting the connection terminals 17 appropriately. Since the connection terminals 17 are only provided on the two main surfaces of the substrate 11,
Circuit wiring can be designed relatively freely, and various circuit modules can be made based on the circuit board 10.

Further, a semiconductor element or a semiconductor element is provided on the circuit wiring formed on one main surface 11a or the other main surface 11b of the substrate 11.
It is also possible to mount a discrete type passive element such as a chip resistor or a chip inductor to form a circuit module, thereby greatly expanding the variety of circuit modules that can be realized based on the circuit board 10. In this case, a circuit wiring for signals is formed on one main surface 11a of the substrate 11, and a DC power source or the like is formed on the other main surface 11b.
Circuit wiring can be formed, and only the signal circuit wiring is concentrated on one main surface, thereby reducing the size of the circuit board and reducing the loss due to the shortened wiring.

In the circuit board 10, the capacitance elements 15 and 16 have the MIM structure.
The capacitive element may have a different configuration, such as a configuration in which two electrodes are opposed to each other, or a configuration in which the opposed surfaces are comb-shaped.

The capacitors 15 and 16 do not need to be alternately arranged in the vertical and horizontal directions in the second dielectric layer 13; for example, the capacitors 15 and 16 are arranged in the vertical direction.
And the horizontal direction may be alternately arranged. Furthermore, even if the capacitors 15 and 16 are arranged so that the ratio of the numbers is different, or
A plurality of types of capacitive elements having the same lead-out direction and different capacitance values may be appropriately arranged.

Although the second dielectric layer 13 is a high dielectric constant dielectric layer for forming the capacitive elements 15 and 16, the first dielectric layer 12 and the third dielectric layer The dielectric layer having the same low dielectric constant as the dielectric layer 14 may be used. In some cases, the first dielectric layer 12
Alternatively, the third dielectric layer 14 may be a high dielectric constant dielectric layer.

Next, FIGS. 3 and 4 show another embodiment of the circuit board of the present invention. Here, FIG. 3 is a plan view of the circuit board 20, and FIG. In FIGS. 3 and 4, the same or equivalent parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted. 3 and 4, the capacitance element 15,
16 and the connection terminals 17 connected thereto are not shown except for a part of the drawing in order to complicate the drawing.

3 and 4, the low dielectric constant first dielectric layer 12 of the circuit board 20 is formed by laminating thin dielectric layers, and a plurality of inductive elements 21 having a spiral structure are provided therein. And 22 are provided. Further, the third dielectric layer 14 having a low dielectric constant is also formed by laminating thin dielectric layers, and a planar conductor layer 23 is formed substantially over the entire inside thereof. A plurality of mutually independent connection terminals 17 are provided on one main surface 11 a of the substrate 11. Here, the capacitive element 15 and the inductive element 21
Indicates that both of the two terminals are on one main surface 11 of the substrate 11.
It is drawn out to the side a and connected to different connection terminals 17 respectively. On the other hand, the capacitive element 16 and the inductive element 22
Are connected to the connection terminal 17 at one main surface 11a, and are drawn out to both the one main surface 11a side and the other main surface 11b side of the substrate 11, respectively.
On the 1b side, it is connected to the conductor layer 23. Then, as can be seen from the plan view shown in FIG.
1 and 22 are alternately arranged in the planar direction in the first dielectric layer 12.

In the circuit board 20 thus configured, since the plurality of independent inductive elements 21 and 22 are provided inside the first dielectric layer 12 having a low dielectric constant, the parasitic capacitance is small, and An inductive element having a high resonance frequency and a large inductance value can be incorporated.

Further, in addition to the capacitance elements 15 and 16 provided on the second dielectric layer 13, a plurality of independent inductive elements 21 and 22 are provided inside the first dielectric layer 12. Therefore, using the circuit board 20 as a separate process, one main surface 11a or the other main surface 11b of the substrate 11 is used.
By forming a circuit wiring on the substrate and connecting the connection terminals 17 appropriately, a circuit module such as a filter having a plurality of capacitors and an inductive element can be realized. The connection terminals 1 are provided on the two main surfaces of the substrate 11.
7, the circuit wiring can be designed relatively freely, and based on the circuit board 20,
Various circuit modules can be made. Further, since the planar conductor layer 23 is formed inside the third dielectric layer 14, the conductor layer 23 can be used as a ground electrode, and electrical stabilization of the entire circuit module can be achieved. Can be.

As in the case of the circuit board 10, a semiconductor element or a discrete passive element such as a chip resistor is mounted on a circuit wiring formed on one main surface 11a or the other main surface 11b of the substrate 11. It is also possible to further expand the variations of the circuit module that can be realized based on the circuit board 20.

In the circuit board 20, the inductive elements 21 and 22 are formed in a spiral shape, but may be formed in any shape such as a meander shape or a simple linear shape.

In the circuit board 20, the inductive elements 21 and 22 need not be alternately arranged in the vertical and horizontal directions in the first dielectric layer 12 like the capacitive elements 15 and 16. Alternatively, they may be appropriately arranged as needed.

In the circuit board 20, the inductive elements 21 and 22 are provided on the first dielectric layer 12, but the inductive element may be provided on the third dielectric layer 14; Inductive elements may be provided on both the body layer 12 and the third dielectric layer 14.

In the circuit board 20, the conductor layer 23 is provided on the third dielectric layer 14. However, the conductor layer may be provided without the conductor layer, or the conductor layer may be provided on the first dielectric layer 12. It doesn't matter. Further, the first dielectric layer 12 and the third
A conductor layer may be provided on both of the dielectric layers 14. In this case, a capacitor element or an inductive element formed between the two conductor layers and the circuit wiring provided on the surface of the base 11 may be used. It can also have the function of electromagnetically shielding the space between them. Then, in the circuit board 20, the conductor layer 23
Is a plane shape, but may be a net shape if necessary.

In the circuit board 20, the other main surface 11b of the substrate 11 of the capacitive element 16 and the inductive element 22 is provided.
The terminal drawn to the side is connected to the conductor layer 23, but penetrates the conductor layer 23 to reach the other main surface 11b,
On the other hand, it may be connected to the connection electrode formed on the main surface 11b. In this case, the conductor layer 23 is insulated from the via layer for drawing one terminal of the capacitive element or the inductive element to the other main surface 11b by removing a part of the conductor layer 23 or the like. .

As in the case of the circuit board 10, the second dielectric layer 13 may be replaced with a dielectric layer having the same low dielectric constant as the first dielectric layer 12 or the third dielectric layer 14, if necessary. It does not matter. In some cases, conversely, the first
The dielectric layer 12 and the third dielectric layer 14 may also be high dielectric constant dielectric layers.

Next, FIG. 5 shows still another embodiment of the circuit board of the present invention. 5, the same or equivalent parts as those in FIG. 3 are denoted by the same reference numerals, and the description thereof will be omitted.
FIG. 5 is a plan view, and the components provided inside the substrate 11 and on the other main surface 11b are omitted because the drawing is complicated.

In FIG. 5, the circuit board 30 is
A circuit wiring 31 is formed on one main surface 11a so as to connect the connection terminal 17. Here, the circuit wiring 31
Is formed by using a thin film process as a separate step on the circuit board 20 of the present invention prepared in advance. Therefore, the electrodes forming the circuit wiring 31 are thin-film electrodes.

In the circuit board 30 thus configured, since the circuit wiring 31 is formed on the circuit board 20 shown in FIGS. 3 and 4, the same operation and effect as in the case of the circuit board 20 can be obtained. Things.

Although the circuit wiring 31 is formed on the circuit board 30 by the thin film process, it is not limited to the thin film process, but may be formed by thick film printing or the like. is there.

In addition to the one main surface 11a of the substrate 11, the other main surface 11b and the one main surface 11a and the other main surface 11a
The circuit wiring may be formed on both of b.

FIG. 6 shows an embodiment of the circuit module of the present invention. 6, the same or equivalent parts as those in FIGS. 4 and 5 are denoted by the same reference numerals, and description thereof will be omitted. FIG. 6 is a sectional view similar to FIG.

In FIG. 6, a circuit module 40 includes a semiconductor chip 41 as an active element and a passive element on a circuit wiring 31 formed on one main surface 11a of the substrate 11 constituting the circuit board 30 shown in FIG. Is mounted. Semiconductor chip 41 and substrate 11
The connection electrode 17 formed on one main surface 11a is connected via a wire 42.

The circuit module 40 thus configured
Since the circuit module shown in FIG. 5 is obtained by mounting an active element or a passive element on the circuit board 30 shown in FIG. 5 to form a circuit module, the same operation and effect as in the case of the circuit board 30 can be obtained.

In the circuit module 40, the connection between the circuit board 30 and the semiconductor chip 41 is made by a wire 42.
However, another mounting method such as soldering or flip chip mounting may be used.

FIG. 7 shows another embodiment of the circuit module of the present invention. 7, the same or equivalent parts as those in FIG. 6 are denoted by the same reference numerals, and description thereof will be omitted.

In FIG. 7, the circuit module 50 has a high dielectric constant ceramic chip 51 on the circuit wiring 31 instead of one of the semiconductor chips 41. The high-permittivity ceramic chip 51 and the connection electrode 17 formed on one main surface 11 a of the substrate 11 are connected via a wire 42.

Here, the high dielectric constant ceramic chip 51
Is one in which a ground electrode is formed on substantially the entirety of one main surface of a high dielectric constant ceramic substrate, and a passive circuit is formed on the other main surface by a distributed constant line. And this passive circuit is formed by a thin film electrode. In the ceramic chip 51 thus configured, the passive circuit formed on the other main surface can be significantly reduced in size due to the wavelength shortening effect due to the high dielectric constant.

The circuit module 50 thus configured
In the above, since the size of the passive circuit can be significantly reduced, the size of the entire circuit module 50 can be reduced.

The passive circuit formed on the high-permittivity ceramic chip is not limited to one formed by thin-film electrodes, but may be formed by thick-film electrodes.

FIG. 8 shows an embodiment of the electronic device of the present invention. FIG. 8 is a block diagram of a communication device that is a type of electronic device.

Referring to FIG. 8, a communication device 60 includes an antenna 61, a circuit module 62 of the present invention, and a signal processing circuit 63. The antenna 61 is connected to the signal processing circuit 63 via the circuit module 62. The circuit module 62 includes a circuit board of the present invention including a capacitive element and an inductive element, and includes a semiconductor element and a passive element mounted thereon. The circuit includes a circuit, a filter, and an amplifier circuit, and functions as a so-called RF module.

In the communication device 60, the signal processing circuit 6
The transmission signal generated in 3 is converted into an RF signal by the circuit module 62 and radiated from the antenna 61. Further, the RF signal received by the antenna 61 is subjected to frequency conversion and the like in the circuit module 62 and is received by being demodulated in the signal processing circuit 63 and the like.

In the communication device 60 configured as described above, since the communication device 60 is provided with the circuit module 62 of the present invention, the size and the price can be reduced.

[0061]

According to the circuit board of the present invention, the first and second circuit boards are provided.
And a plurality of independent capacitance elements in a second dielectric layer of a substrate formed by sequentially laminating a third dielectric layer and a first dielectric layer.
And the second dielectric layer are provided with a plurality of independent inductive elements, and these two terminals are drawn out to connection terminals formed on one of the main surfaces of the substrate. By configuring the circuit wiring on the surface, one circuit board can be used for a plurality of purposes, and the cost of the circuit board can be reduced. In addition, since the capacitor element and the inductive element are incorporated, the size of the circuit board can be reduced.

According to the circuit module of the present invention,
By mounting and configuring an active element, a passive element, or a high dielectric constant ceramic chip on the circuit wiring of the circuit board of the present invention, it is possible to reduce the size and cost.

Further, according to the electronic device of the present invention, by using the circuit module of the present invention, downsizing and cost reduction can be achieved.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a circuit board of the present invention.

FIG. 2 is a sectional view of the circuit board of FIG. 1 taken along the line AA.

FIG. 3 is a plan view showing another embodiment of the circuit board of the present invention.

FIG. 4 is a cross-sectional view of the circuit board of FIG. 3 taken along line BB.

FIG. 5 is a plan view showing still another embodiment of the circuit board of the present invention.

FIG. 6 is a sectional view showing an embodiment of the circuit module of the present invention.

FIG. 7 is a sectional view showing another embodiment of the circuit module of the present invention.

FIG. 8 is a block diagram showing one embodiment of the electronic device of the present invention.

FIG. 9 is a sectional view showing a conventional circuit module.

[Explanation of symbols]

 10, 20, 30 ... circuit board 11 ... substrate 11a ... one main surface 11b ... other main surface 12 ... first dielectric layer 13 ... second dielectric layer 14 ... third dielectric layer 15, 16 ... capacitance Element 17 Connection terminal 21, 22 Inductive element 31 Circuit wiring 40, 50 Circuit module 41 Semiconductor chip 42 Wire 43 Chip resistance 51 High-permittivity ceramic chip 60 Communication device

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (Reference) H01G 4/40 321A F-term (Reference) 4E351 AA01 BB03 BB09 BB15 BB18 BB22 BB24 BB26 BB27 BB32 BB43 BB49 DD01 DD41 GG20 5E082 AA20 AB03 BC40 CC03 DD01 DD08 DD11 DD15 EE04 EE11 EE23 EE35 FF05 FG06 FG26 GG10 GG28 JJ03 KK01 KK07 KK08 LL13 LL15

Claims (14)

[Claims] A substrate having a first, a second, and a third dielectric layer laminated in order; a plurality of independent connection terminals provided on at least one main surface of the substrate; A plurality of independent capacitance elements provided in a dielectric layer, wherein each terminal of the plurality of capacitance elements is drawn out to a main surface of the substrate and connected to the connection terminals different from each other. Circuit board. 2. The capacitive element according to claim 1, wherein each of the terminals is a first capacitive element that leads each terminal to one main surface of the substrate, and a second capacitive element is each that leads each terminal to one and other principal surfaces of the substrate. The circuit board according to claim 1, comprising: 3. The device according to claim 2, wherein the first capacitance element and the second capacitance element are alternately arranged in a plane direction in the second dielectric layer. Circuit board. 4. A semiconductor device comprising: a plurality of independent inductive elements provided on at least one of the first and third dielectric layers; and terminals of the plurality of inductive elements are drawn out to a main surface of the substrate. 4. The circuit board according to claim 1, wherein the circuit boards are connected to the different connection terminals. 5. The semiconductor device according to claim 1, wherein the first and third dielectric layers are made of a low dielectric constant dielectric, and the second dielectric layer is made of a high dielectric constant dielectric. 5. The circuit board according to any one of claims 1 to 4. 6. A planar or net-like conductor layer is provided on an inner layer of the first or third dielectric layer near any one of the main surfaces of the base. 6. The circuit board according to any one of claims 5 to 5. 7. The capacitive element or the inductive element 2
The circuit board according to claim 6, wherein one of the terminals is connected to the conductor layer. 8. The circuit board according to claim 1, further comprising a circuit wiring formed on at least one main surface of the board. 9. The circuit board according to claim 8, wherein said circuit wiring comprises a thin film electrode. 10. A circuit module comprising one or more active elements mounted on the circuit wiring of the circuit board according to claim 8. 11. The circuit module according to claim 10, wherein one or more passive elements are mounted on the circuit wiring. 12. The circuit module according to claim 9, wherein a high dielectric constant ceramic chip having a passive circuit formed on one or both surfaces is mounted on the circuit wiring. 13. The circuit module according to claim 12, wherein the passive circuit formed on the high dielectric constant ceramic chip comprises a thin film electrode. 14. An electronic device using the circuit module according to claim 8. Description: